Electrolytic capacitor
    5.
    发明授权

    公开(公告)号:US11881360B2

    公开(公告)日:2024-01-23

    申请号:US17687840

    申请日:2022-03-07

    发明人: Katsutomo Aritomi

    摘要: An electrolytic capacitor that includes a resin molded body including a stack that includes a capacitor element with an anode exposed at a first end surface, a dielectric layer on a surface of the anode, and a cathode opposite to the anode and exposed at a second end surface; a first external electrode on the first end surface and electrically connected to the anode; and a second external electrode on the second end surface and electrically connected to the cathode, wherein the first external electrode and the second external electrode each include: a resin electrode layer containing a conductive component and a resin component; and a Ni plating layer on a surface of the resin electrode layer, wherein a ratio of a thickness of the resin electrode layer to a thickness of the Ni plating layer is 5 or less.

    ELECTROLYTIC CAPACITOR
    8.
    发明公开

    公开(公告)号:US20230368979A1

    公开(公告)日:2023-11-16

    申请号:US18361090

    申请日:2023-07-28

    IPC分类号: H01G9/012 H01G9/10 H01G9/15

    CPC分类号: H01G9/012 H01G9/10 H01G9/15

    摘要: An electrolytic capacitor that includes: a resin molded body that includes a stack including a capacitor element and a sealing resin sealing a periphery of the stack; and an anode external electrode and a cathode external electrode on an outer surface of the resin molded body. The capacitor element includes: a valve-action metal substrate having a core and a porous portion along a surface of the core. The anode external electrode includes a first electrode layer in direct contact with the core of the valve-action metal substrate. The first electrode layer includes flat particles having an aspect ratio of 2 or more, and in a cross section, a long axis direction of the flat particles is arranged in a direction along the outer surface of the resin molded body.

    METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

    公开(公告)号:US20230352249A1

    公开(公告)日:2023-11-02

    申请号:US18346515

    申请日:2023-07-03

    发明人: Soichiro ESAKI

    IPC分类号: H01G9/15 H01G9/012 H01G9/042

    CPC分类号: H01G9/15 H01G9/012 H01G9/0425

    摘要: A method for manufacturing an electronic component includes: a preparation step of preparing an electrode-forming body for electronic components; and an electrode forming step of forming an electrode on an outer surface of the electrode-forming body for electronic components, wherein in the electrode forming step, a conductive resin layer is formed on the electrode-forming body for electronic components by using a conductive resin composition containing a silicone resin. According to the present invention, it is possible to provide a method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide a method for manufacturing an electronic component having reduced restrictions on design and manufacturing and high manufacturing efficiency, in addition to high moisture resistance.