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公开(公告)号：WO2004064114A2
公开(公告)日：2004-07-29
申请号：PCT/US2004/000270
申请日：2004-01-07
Applicant: CABOT CORPORATION , MICHALUK, Christopher, A. , YUAN, Shi , MAGUIRE, James, D.
Inventor： MICHALUK, Christopher, A. , YUAN, Shi , MAGUIRE, James, D.
IPC: H01L
CPC classification number: H01G9/0525 , B22F1/0088 , B22F2998/00 , B22F2999/00 , C23C8/02 , C23C8/80 , C23C14/3414 , H01J37/3426 , Y10T428/12049 , Y10T428/12104 , B22F3/15 , B22F3/20 , B22F2201/02
Abstract: A method of forming a sputtering target and other metal articles having controlled oxygen and nitrogen content levels and the articles so formed are described. The method includes surface-nitriding a deoxidized metal powder and further includes consolidating the powder by a powder metallurgy technique. Preferred metal powders include, but are not limited to, valve metals, including tantalum, niobium, and alloys thereof.
Abstract translation: 描述了形成具有受控的氧和氮含量水平的溅射靶和其它金属制品的方法以及如此形成的制品。 该方法包括对脱氧金属粉末进行表面氮化，还包括通过粉末冶金技术固化粉末。 优选的金属粉末包括但不限于阀金属，包括钽，铌及其合金。
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2.发明申请
公开(公告)号：WO2004074532A2
公开(公告)日：2004-09-02
申请号：PCT/US2004/004050
申请日：2004-02-12
Applicant: CABOT CORPORATION , MICHALUK, Christopher, A. , STERSHIC, Matthew, T. , FORD, Robert, B.
Inventor： MICHALUK, Christopher, A. , STERSHIC, Matthew, T. , FORD, Robert, B.
IPC: C23C
CPC classification number: G06Q10/06 , C23C14/3407 , G06Q30/0283
Abstract: A method of supplying a sputter target, including, supplying a sputtering target assembly to a user or an agent thereof where a sputter target of the sputtering target assembly is sputtered to form a spent target assembly; determining an amount of the sputter target consumed by the sputtering; and charging the user based on the amount sputtered or an amount not returned, is described.
Abstract translation: 一种提供溅射靶的方法，包括向溅射靶组件的溅射靶溅射溅射靶，以形成用过的靶组件; 确定通过溅射消耗的溅射靶的量; 并且基于溅射的量或未返回的量对用户进行充电。
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公开(公告)号：WO2004076706A3
公开(公告)日：2004-09-10
申请号：PCT/US2004/005538
申请日：2004-02-24
Applicant: CABOT CORPORATION , FORD, Robert, B. , MICHALUK, Christopher, A. , WICKERSHAM, Charles, E., Jr.
IPC: C23C14/34
Abstract: A method of forming a sputtering target assembly is described that involves explosively bonding a target grade plate and a backing plate member to form a bonded preform having dimensions such that a large target or several target assemblies can be obtained. The method includes partitioning the bonded preform into a plurality of sputtering target assemblies. An interlayer can optionally be disposed between the target grade plate and the backing plate member before bonding. A bond quality test sample can be produced by the method. The sputtering target assemblies, the bonded preform, and the bond quality test sample are further described.
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公开(公告)号：WO2004074530A2
公开(公告)日：2004-09-02
申请号：PCT/US2004/004021
申请日：2004-02-11
Applicant: CABOT CORPORATION , MICHALUK, Christopher, A.
Inventor： MICHALUK, Christopher, A.
IPC: C22F1/00
CPC classification number: C23C14/3407 , C22F1/00
Abstract: The present invention relates to an improvement in the manufacture of metal blanks, discs, and sputtering targets by flattening only one of the two surfaces of a metal plate. The elimination of flattening the metal plate’s second surface results in a significant cost reduction. The metal plate of the present invention preferably has a single-side flatness of 0.005 inches or less, which improves the reliability of the bond between the target blank and a backing plate. Preferred metals include, but are not limited to, tantalum, niobium, titanium, and alloys thereof. The present invention also relates to machining the first side of a metal plate, bonding the first side to a backing plate, and then optionally machining the second side of the metal plate.
Abstract translation: 本发明涉及通过仅使金属板的两个表面中的一个平坦化来改进金属坯料，盘和溅射靶的制造。 消除使金属板的第二表面平坦化导致显着的成本降低。 本发明的金属板优选具有0.005英寸或更小的单面平坦度，这提高了目标坯件和背板之间的结合的可靠性。 优选的金属包括但不限于钽，铌，钛及其合金。 本发明还涉及加工金属板的第一面，将第一面粘合到背板，然后可选地加工金属板的第二面。
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5.发明申请
公开(公告)号：WO2006076333A2
公开(公告)日：2006-07-20
申请号：PCT/US2006/000771
申请日：2006-01-11
Applicant: CABOT CORPORATION , MICHALUK, Christopher, A. , HUBER, Louis, E., Jr. , ALEXANDER, P., Todd , CARPENTER, Craig, M.
Inventor： MICHALUK, Christopher, A. , HUBER, Louis, E., Jr. , ALEXANDER, P., Todd , CARPENTER, Craig, M.
CPC classification number: C22F1/18 , C22F1/183 , C23C14/3414
Abstract: A method of making metal plates as well as sputtering targets is described. In addition, products made by the process of the present invention are further described. The present invention preferably provides a product with reduced or minimized marbleizing on the surface of the metal product which has a multitude of benefits.
Abstract translation: 描述制造金属板以及溅射靶的方法。 此外，进一步描述通过本发明的方法制备的产品。 本发明优选提供在金属产品的表面上具有减少或最小化的大理石的产品，其具有许多益处。
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Patent Agency Ranking6.发明申请
公开(公告)号：WO2005064037A3
公开(公告)日：2005-12-08
申请号：PCT/US2004042734
申请日：2004-12-20
Applicant: CABOT CORP , MICHALUK CHRISTOPHER A , HUBER LOUIS E , ALEXANDER P TODD
Inventor： MICHALUK CHRISTOPHER A , HUBER LOUIS E , ALEXANDER P TODD
CPC classification number: C23C14/3414 , C22F1/18 , C22F1/183
Abstract: A method of making metal plates as well as sputtering targets is described. In addition, products made by the process of the present invention are further described. The present invention preferably provides a product with reduced or minimized marbleizing on the surface of the metal product which has a multitude of benefits.
Abstract translation: 描述制造金属板以及溅射靶的方法。 此外，进一步描述通过本发明的方法制备的产品。 本发明优选提供在金属产品的表面上具有减少或最小化的大理石的产品，其具有许多益处。
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7.发明申请
公开(公告)号：WO2004111295A1
公开(公告)日：2004-12-23
申请号：PCT/US2004/017972
申请日：2004-06-07
Applicant: CABOT CORPORATION , VON SPRECKELSEN, Eric , MICHALUK, Christopher, A. , FORD, Robert, B.
Inventor： VON SPRECKELSEN, Eric , MICHALUK, Christopher, A. , FORD, Robert, B.
IPC: C23C14/34
CPC classification number: B21J1/025 , B21B2001/022 , B21J1/04 , C22F1/00 , C22F1/18 , C23C14/3414
Abstract: A method of producing a valve metal mill form having dimensions sufficient to be divided to form a plurality of sputter targets is described. The method includes multidirectional deformation of an ingot to form a mill form having a preferred average grain size of about 100 microns or less and/or a texture substantially void of textural bands.
Abstract translation: 描述了一种制造具有足够划分以形成多个溅射靶的尺寸的阀金属铣刀形式的方法。 该方法包括锭的多向变形以形成具有约100微米或更小的优选平均晶粒尺寸和/或基本上无纹理带的纹理的研磨形式。
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8.发明申请
公开(公告)号：WO2004076706A2
公开(公告)日：2004-09-10
申请号：PCT/US2004005538
申请日：2004-02-24
Applicant: CABOT CORP , FORD ROBERT B , MICHALUK CHRISTOPHER A , WICKERSHAM CHARLES E JR
Inventor： FORD ROBERT B , MICHALUK CHRISTOPHER A , WICKERSHAM CHARLES E JR
CPC classification number: C23C14/3407
Abstract: A method of forming a sputtering target assembly is described that involves explosively bonding a target grade plate and a backing plate member to form a bonded preform having dimensions such that a large target or several target assemblies can be obtained. The method includes optionally partitioning the bonded preform into a plurality of sputtering target assemblies. An interlayer can optionally be disposed between the target grade plate and the backing plate member before bonding. A bond quality test sample can be produced by the method. The sputtering target assemblies, the bonded preform, and the bond quality test sample are further described.
Abstract translation: 描述了一种形成溅射靶组件的方法，其涉及将靶标板和背板构件爆炸地结合以形成尺寸使得能够获得大目标或多个目标组件的结合预制件。 该方法包括任选地将结合的预成型件分成多个溅射靶组件。 在粘合之前，中间层可以可选地设置在目标级板和背板构件之间。 可以通过该方法制备粘合质量测试样品。 进一步描述溅射靶组件，结合预制件和粘合质量测试样品。
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9.发明申请
公开(公告)号：WO2006076333A3
公开(公告)日：2006-09-28
申请号：PCT/US2006000771
申请日：2006-01-11
Applicant: CABOT CORP , MICHALUK CHRISTOPHER A , HUBER LOUIS E JR , ALEXANDER P TODD , CARPENTER CRAIG M
Inventor： MICHALUK CHRISTOPHER A , HUBER LOUIS E JR , ALEXANDER P TODD , CARPENTER CRAIG M
CPC classification number: C22F1/18 , C22F1/183 , C23C14/3414
Abstract: A method of making a sputtering target, comprising: providing a slab comprising at least one metal; a first rolling of said slab to form an intermediate plate, wherein said first rolling includes a plurality of rolling passes; and a second rolling to form a metal plate, wherein said second rolling includes a plurality of rolling passes, and wherein each of said rolling passes of said second rolling imparts a true strain reduction of about 0. 2 or more.
Abstract translation: 一种制造溅射靶的方法，包括：提供包含至少一种金属的板坯; 所述板坯的第一轧制形成中间板，其中所述第一轧制包括多个轧制道次; 以及第二轧制以形成金属板，其中所述第二轧制包括多个轧制道次，并且其中所述第二轧制的每个所述轧制道次赋予约0.2以上的真实应变减小。
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10.发明申请HIGH INTEGRITY SPUTTERING TARGET MATERIAL AND METHOD FOR PRODUCING BULK QUANTITIES OF SAME 审中-公开高完整性溅射靶材及生产散装数量的方法
公开(公告)号：WO2005064037A2
公开(公告)日：2005-07-14
申请号：PCT/US2004/042734
申请日：2004-12-20
Applicant: CABOT CORPORATION , MICHALUK, Christopher, A. , HUBER, Louis, E. , ALEXANDER, P., Todd
Inventor： MICHALUK, Christopher, A. , HUBER, Louis, E. , ALEXANDER, P., Todd
IPC: C23C14/34
CPC classification number: C23C14/3414 , C22F1/18 , C22F1/183
Abstract: A method of making metal plates as well as sputtering targets is described. In addition, products made by the process of the present invention are further described. The present invention preferably provides a product with reduced or minimized marbleizing on the surface of the metal product which has a multitude of benefits.
Abstract translation: 描述了一种制造金属板以及溅射靶的方法。 另外，进一步描述通过本发明的方法制造的产品。 本发明优选提供在金属产品表面具有减少的或最小化的纹理化的产品，其具有多种益处。
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