公开(公告)号：WO2021201990A1

公开(公告)日：2021-10-07

申请号：PCT/US2021/017445

申请日：2021-02-10

Applicant: APPLE INC.

Inventor： CHEN, Wei ,  ZHAO, Jie-Hua ,  ZHAI, Jun ,  CHANG, Po-Hao ,  LIN, Hsien-Che ,  KE, Ying-Chieh ,  HU, Kunzhong

IPC: H01L23/04 ,  H01L23/16 ,  H01L23/367 ,  H01L25/065 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L23/24 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/562 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/18 ,  H01L2924/15311 ,  H01L2924/1615 ,  H01L2924/16151 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/164 ,  H01L2924/19105 ,  H01L2924/3511

Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.