公开(公告)号：WO2014008258A3

公开(公告)日：2014-03-13

申请号：PCT/US2013049061

申请日：2013-07-02

Applicant: HEMLOCK SEMICONDUCTOR CORP

Inventor： HERRON WILLIAM ,  REVIS ANTHONY L ,  SOBECK DANIEL D

IPC: B01J8/02 ,  B01J19/00 ,  C01B33/033 ,  C01B33/107

CPC classification number: B01J8/0285 ,  B01J8/025 ,  B01J19/0013 ,  B01J2208/00168 ,  B01J2208/00247 ,  B01J2219/00087 ,  B01J2219/00101 ,  C01B33/033 ,  C01B33/1071

Abstract: An apparatus is provided that includes a heating zone, an overhead temperature modulation zone in fluid communication with the heating zone, and an overhead cooling zone in fluid communication with the overhead temperature modulation zone. The heating zone includes a solid reactant support and a reactant gas input, and also includes a heater. The overhead temperature modulation zone includes a temperature regulator for modifying the temperature of the overhead temperature modulation zone. The overhead temperature modulation zone also includes an overhead gas outlet and provides a reflux flow path for condensate to return to the heating zone. The overhead cooling zone has a chiller for cooling the temperature of the overhead cooling zone. The overhead cooling zone provides a barrier to separate condensate formed therein from the overhead temperature modulation zone. The apparatus further includes an apparatus wall that defines an interior chamber of the apparatus between the zones.

Abstract translation: 提供了一种装置，其包括加热区，与加热区流体连通的塔顶温度调制区和与架空温度调制区流体连通的塔顶冷却区。 加热区包括固体反应物载体和反应气体输入，并且还包括加热器。 架空温度调制区包括用于改变塔顶温度调制区的温度的温度调节器。 架空温度调制区还包括塔顶气体出口，并提供冷凝水回流到加热区的回流流动路径。 塔顶冷却区具有用于冷却塔顶冷却区的温度的冷却器。 塔顶冷却区提供了将塔顶温度调制区域中形成的冷凝物分离开的屏障。 该装置还包括一个装置壁，该装置壁限定该区域之间的装置的内部室。