公开(公告)号：WO2006104972B1

公开(公告)日：2007-01-18

申请号：PCT/US2006011024

申请日：2006-03-27

Applicant: ENTEGRIS INC ,  THOMAS RONALD ,  KOLBOW STEVEN ,  DUBAN-HU JOY

Inventor： THOMAS RONALD ,  KOLBOW STEVEN ,  DUBAN-HU JOY

IPC: B65D1/24 ,  B65D1/26 ,  B65D73/02 ,  B65D85/00 ,  B65D85/30

CPC classification number: B65D73/0057 ,  H01L21/67356 ,  H01L21/67386 ,  Y10S206/82

Abstract: A carrier tape for holding a plurality of disks includes a thin, elongate strip of polymer material presenting a longitudinal axis and having a plurality of pockets defined therein. Each pocket is adapted to receive a separate one of the disks. The pockets are spaced apart and arranged along the longitudinal axis of the strip, and each pocket has at least one operable disk restraining structure for retaining the disk when the disk is received in the pocket.

Abstract translation: 用于保持多个盘的载带包括具有纵向轴线并且具有限定在其中的多个凹穴的薄的，细长的聚合物材料带。 每个口袋适合接收单独的一个磁盘。 凹穴沿着条的纵向轴线间隔开并布置，并且每个凹槽具有至少一个可操作的盘限制结构，用于当盘被容纳在口袋中时用于保持盘。

公开(公告)号：WO2003008303A1

公开(公告)日：2003-01-30

申请号：PCT/US2002/022117

申请日：2002-07-12

Applicant: ENTEGRIS, INC. ,  DUBAN-HU, Joy ,  NIGG, James

Inventor： DUBAN-HU, Joy ,  NIGG, James

IPC: B65D85/30

CPC classification number: H01L21/67333 ,  H01L21/67356 ,  H01L2221/68313

Abstract: A tray (10) for semiconductors having a tray portion (12), a rail portion (14), and an intermediate portion (30). The tray portion has a plurality of chip recesses (20) formed therein. The rail portion extends substantially around the tray portion. The intermediate portion interconnects the tray portion and the rail portion and is oriented at an angle of more then 115° with respect to the rail portion.

Abstract translation: 一种用于具有托盘部分（12），轨道部分（14）和中间部分（30）的半导体的托盘（10）。 托盘部分具有形成在其中的多个切屑凹部（20）。 导轨部分基本上围绕托盘部分延伸。 中间部分将托盘部分和轨道部分互连，并相对于轨道部分以大于115°的角度定向。

公开(公告)号：WO2002083522A1

公开(公告)日：2002-10-24

申请号：PCT/US2002/010403

申请日：2002-04-01

Applicant: BROOKS, Ray, G.

Inventor： BROOKS, Ray, G. ,  BROOKS, Timothy, W.

IPC: B65D85/30

CPC classification number: H01L21/67356 ,  H01L21/67369

Abstract: An IC wafer shipping container (11) has therein a stack of IC wafers (21). At least one side of each wafer (21) has raised, conductive bump pads (23). A separator (25) is located between two wafers. The film separators each have a dissipative layer and an insulating layer. The separators are cushioned to protect the wafers from mechanical shock and electrical shock. The separators are cushioned by embossing (27).

Abstract translation: IC晶片运输容器（11）中具有一叠IC晶片（21）。 每个晶片（21）的至少一侧具有凸起的导电凸块焊盘（23）。 分离器（25）位于两个晶片之间。 膜分离器各自具有耗散层和绝缘层。 分离器被缓冲以保护晶片免受机械冲击和电击。 分离器通过压花缓冲（27）。