公开(公告)号：WO2016147533A1

公开(公告)日：2016-09-22

申请号：PCT/JP2016/000565

申请日：2016-02-03

Applicant: セイコーエプソン株式会社

Inventor： 桐原　大輔 ,  前田　政己 ,  下島　聡興 ,  山崎　孝

IPC: G01R31/26

CPC classification number: G01R31/2893 ,  G01R31/2891 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67288 ,  H01L21/67356 ,  H01L21/67373 ,  H01L21/67376 ,  H01L21/67379 ,  H01L21/67386 ,  H01L21/67389

Abstract: 　装置の内部に対する作業を施す際に、外気の流入をできる限り抑えることができる電子部品搬送装置および電子部品検査装置を提供すること。　電子部品搬送装置は、開閉可能な第１開閉部４と、第１開閉部４を回動可能に支持する第１回動支持部４２と、第１開閉部４に開閉可能に設けられた第２開閉部５と、第２開閉部５を回動可能に支持する第２回動支持部５２とを備える。第１開閉部４の面積は、第２開閉部５の面積よりも大きい。

Abstract translation: 提供了一种电子部件输送装置和电子部件检查装置，能够在设备内部进行工作时尽可能多地抑制外部空气的流入。 电子部件输送装置设置有能够开闭的第一开闭部4， 第一转动支撑部42，其可转动地支撑第一开闭部4; 可开闭地设置在第一开闭部4上的第二开闭部5; 以及可转动地支撑第二打开/关闭部分5的第二转动支撑部分52.第一打开/关闭部分4的面积大于第二打开/关闭部分5的面积。

公开(公告)号：WO2011124205A2

公开(公告)日：2011-10-13

申请号：PCT/DE2011/000354

申请日：2011-03-30

Applicant: CURAMIK ELECTRONICS GMBH ,  BRÄUTIGAM, Johann ,  ERNSTBERGER, Erich ,  SCHWEIGER, Heiko ,  SCHULZ-HARDER, Jürgen

Inventor： BRÄUTIGAM, Johann ,  ERNSTBERGER, Erich ,  SCHWEIGER, Heiko ,  SCHULZ-HARDER, Jürgen

IPC: H01L21/673

CPC classification number: B65D25/00 ,  A23C9/1307 ,  A23C9/137 ,  A23C9/1524 ,  A23C2210/30 ,  A23C2270/05 ,  A23F5/243 ,  A23V2002/00 ,  B65B5/08 ,  B65D75/02 ,  B65D81/2007 ,  H01L21/67353 ,  H01L21/67356 ,  A23V2250/5424 ,  A23V2200/226

Abstract: Verpackung für Metall-Keramik-Substrate jeweils bestehend aus einer Keramikschicht, aus mehreren auf wenigstens einer Oberflächenseite der Keramikschicht gebildeten Einzelmetallisierungen und zwischen diesen verlaufenden Sollbruchlinien.

Abstract translation: 包金属 - 陶瓷基片的每个，从多个Einzelmetallisierungen形成在陶瓷层和那些延伸预定断裂线之间的至少一个表面侧的由陶瓷层构成。

公开(公告)号：WO2006104972A1

公开(公告)日：2006-10-05

申请号：PCT/US2006/011024

申请日：2006-03-27

Applicant: ENTEGRIS, INC. ,  THOMAS, Ronald ,  KOLBOW, Steven ,  DUBAN-HU, Joy

Inventor： THOMAS, Ronald ,  KOLBOW, Steven ,  DUBAN-HU, Joy

IPC: B65D1/24 ,  B65D1/26 ,  B65D73/02 ,  B65D85/00 ,  B65D85/30

CPC classification number: B65D73/0057 ,  H01L21/67356 ,  H01L21/67386 ,  Y10S206/82

Abstract: A carrier tape for holding a plurality of disks includes a thin, elongate strip of polymer material presenting a longitudinal axis and having a plurality of pockets defined therein. Each pocket is adapted to receive a separate one of the disks. The pockets are spaced apart and arranged along the longitudinal axis of the strip, and each pocket has at least one operable disk restraining structure for retaining the disk when the disk is received in the pocket.

Abstract translation: 用于保持多个盘的载带包括具有纵向轴线并且具有限定在其中的多个凹穴的薄的，细长的聚合物材料带。 每个口袋适合接收单独的一个磁盘。 凹穴沿着条的纵向轴线间隔开并布置，并且每个凹槽具有至少一个可操作的盘限制结构，用于当盘被容纳在口袋中时用于保持盘。

公开(公告)号：WO1992005581A1

公开(公告)日：1992-04-02

申请号：PCT/JP1991001221

申请日：1991-09-13

Applicant: FUJITSU LIMITED ,  ANDO, Yukio

Inventor： FUJITSU LIMITED

IPC: H01L23/00

CPC classification number: H01L21/67356 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device provided with a main body (10) of a rectangular package, many leads (12) protruded therefrom, a heat radiating fin assembly provided on the upper surface of the main body of the package. The assembly comprises a pole (14a) extending upright from the upper surface of the main body of the package, and at least one heat radiating fin (14b) extended from the pole perpendicularly. The heat radiating fins are supported by the direct or indirect engagement with a case (18) containing the semiconductor device. This support is so accomplished that no lead is in contact with anything. Also, when the semiconductor device is so disposed in the case in a predetermined direction, the direction canot be altered.

公开(公告)号：WO2010036790A1

公开(公告)日：2010-04-01

申请号：PCT/US2009/058197

申请日：2009-09-24

Applicant: ILLINOIS TOOL WORKS INC. ,  FORSYTH, Valoris, L. ,  LAWRENCE, Justin, L. ,  VANNORTWICK, John, E. ,  WANKE, Jamie, J. ,  CASEY, Christopher, E. ,  FORBIS, Michael, R. ,  STOOR, James, R. ,  SLAUGHTER, Michael, R.

Inventor： FORSYTH, Valoris, L. ,  LAWRENCE, Justin, L. ,  VANNORTWICK, John, E. ,  WANKE, Jamie, J. ,  CASEY, Christopher, E. ,  FORBIS, Michael, R. ,  STOOR, James, R. ,  SLAUGHTER, Michael, R.

IPC: G01R1/00

CPC classification number: H01L21/67356 ,  B29C45/0053 ,  B29C65/561 ,  B29C65/562 ,  B29C66/5346 ,  B29L2012/00 ,  B29L2031/737 ,  B65D1/34 ,  B65D25/10 ,  H01L21/67333 ,  H01L21/67369 ,  H01L21/67373

Abstract: The disclosure relates to trays for the handling and shipping of computer chips, or similar microelectronic devices. The tray include a series of channels, each extending along a width of the tray. The channels include such devices as pins and clips for securing a thermoformed tape. The thermoformed tape includes pockets for storing the various computer chips, or similar microelectronic devices.

Abstract translation: 本公开涉及用于处理和运送计算机芯片或类似的微电子器件的托盘。 托盘包括一系列通道，每个通道沿托盘的宽度延伸。 通道包括用于固定热成型带的销和夹子的装置。 热成型带包括用于存储各种计算机芯片或类似的微电子器件的口袋。

公开(公告)号：WO1992008242A1

公开(公告)日：1992-05-14

申请号：PCT/US1991007780

申请日：1991-10-21

Applicant: STRONG, Leslie, G.

IPC: H01L21/00

CPC classification number: H01L21/67333 ,  H01L21/67353 ,  H01L21/67356 ,  H01L21/67369 ,  H01L21/67396

Abstract: A method and apparatus for packaging sensitive electronic components includes a tray having an outer wall with an inside surface which at least partially defines a protected space; releasable retention bars releasably retaining the components in the protected space. The tray and retention bar are preferably fabricated from an electrically conductive material, so that the assembly may be grounded during transport and handling. The method of packaging and transporting includes providing the container, placing at least one component in the protected space, placing the retention bar over the component to retain it in the protected space, engaging the ends of the bars with the container to capture the component between the bar and the inside surface of the tray, and transporting the tray with captured components to a desired location, during which time the assembly is protected against damage during handling.

Abstract translation: 一种用于包装敏感电子部件的方法和装置包括具有至少部分地限定受保护空间的具有内表面的外壁的托盘; 可释放的保持杆可释放地将部件保持在受保护的空间中。 托盘和保持杆优选地由导电材料制成，使得组件可以在运输和处理期间接地。 包装和运输的方法包括提供容器，将至少一个部件放置在受保护的空间中，将保持杆放置在部件上以将其保持在受保护的空间中，将杆的端部与容器接合以捕获组件 棒和内表面，并且将具有捕获的部件的托盘运送到期望的位置，在此期间组装被保护以防止在处理期间的损坏。

公开(公告)号：WO1989002860A1

公开(公告)日：1989-04-06

申请号：PCT/US1988003284

申请日：1988-09-23

Applicant: NCR CORPORATION

Inventor： NCR CORPORATION ,  TEHRANI, Kazem, N.

IPC: B65D81/06

CPC classification number: H01L21/67356 ,  B65D81/113 ,  H01L21/67366 ,  H01L21/67386 ,  H01L21/67396

Abstract: A container (10) for packaging surface mount electronic devices that protects such devices from physical damage during handling and also protects such devices from electrostatic discharge damage. The container (10) includes a plurality of panels (12, 26, 42) supporting a foam-like receptacle member (14), a foam-like plug member (32), and tab members (48, 50) for securing the panels (12, 26, 42) together when they are folded over one another to form a closed package.

Abstract translation: 一种用于包装表面贴装电子装置的容器（10），用于保护这些装置在处理期间免受物理损坏，并且还保护这些装置免受静电放电损坏。 容器（10）包括支撑泡沫状容器构件（14）的多个面板（12,26,42），泡沫状插塞构件（32）和用于固定面板的凸片构件（48,50） （12,26,42）当它们彼此折叠以形成封闭的包装时在一起。

公开(公告)号：WO2016175654A2

公开(公告)日：2016-11-03

申请号：PCT/NL2016/050296

申请日：2016-04-26

Applicant: NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO

Inventor： HENDRIKS, Rob Jacob ,  VAN DEN ENDE, Daan Anton ,  SMITS, Edsger Constant Pieter

IPC: H01L21/60 ,  H01L21/67 ,  H01L21/683 ,  H01L21/98

CPC classification number: H01L21/67356 ,  H01L21/67751 ,  H01L21/683 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2021/60007 ,  H01L2221/68354 ,  H01L2221/68381 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/7526 ,  H01L2224/75502 ,  H01L2224/75611 ,  H01L2224/7565 ,  H01L2224/75702 ,  H01L2224/75753 ,  H01L2224/75804 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method and apparatus for soldering a chip (1a) to a substrate (3). A chip carrier (8) is provided between a flash lamp (5) and the substrate (3). The chip (1a) is attached to the chip carrier (8) on a side of the chip carrier (8) facing the substrate (3). A solder material (2) is disposed between the chip (1a) and the substrate (3). The flash lamp (5) generates a light pulse (6) for heating the chip (1a). The heating of the chip (1a) causes the chip (1a) to be released from the chip carrier (8) towards the substrate (3). The solder material (2) is at least partially melted by contact with the heated chip (1a) for attaching the chip (1a) to the substrate (3).

Abstract translation: 一种将芯片（1a）焊接到基板（3）上的方法和装置。 芯片载体（8）设置在闪光灯（5）和基板（3）之间。 芯片（1a）在芯片载体（8）的面向衬底（3）的一侧附着于芯片载体（8）。 在芯片（1a）和基板（3）之间设置焊料（2）。 闪光灯（5）产生用于加热芯片（1a）的光脉冲（6）。 芯片（1a）的加热使得芯片（1a）从芯片载体（8）向衬底（3）释放。 焊料材料（2）通过与加热芯片（1a）的接触而至少部分地熔化，用于将芯片（1a）附接到基板（3）。

公开(公告)号：WO2011124205A3

公开(公告)日：2012-02-23

申请号：PCT/DE2011000354

申请日：2011-03-30

Applicant: CURAMIK ELECTRONICS GMBH ,  BRAEUTIGAM JOHANN ,  ERNSTBERGER ERICH ,  SCHWEIGER HEIKO ,  SCHULZ-HARDER JUERGEN

Inventor： BRAEUTIGAM JOHANN ,  ERNSTBERGER ERICH ,  SCHWEIGER HEIKO ,  SCHULZ-HARDER JUERGEN

IPC: H01L21/673 ,  H01L23/10

CPC classification number: B65D25/00 ,  A23C9/1307 ,  A23C9/137 ,  A23C9/1524 ,  A23C2210/30 ,  A23C2270/05 ,  A23F5/243 ,  A23V2002/00 ,  B65B5/08 ,  B65D75/02 ,  B65D81/2007 ,  H01L21/67353 ,  H01L21/67356 ,  A23V2250/5424 ,  A23V2200/226

Abstract: The invention relates to a package for metal-ceramic substrates composed of a ceramic layer, multiple individual metallizations formed on at least one surface of the ceramic layer, and predetermined breaking lines extending therebetween.

Abstract translation: 包金属 - 陶瓷基片的每个，从多个Einzelmetallisierungen形成在陶瓷层和那些延伸预定断裂线之间的至少一个表面侧的由陶瓷层构成。

公开(公告)号：WO2011138339A1

公开(公告)日：2011-11-10

申请号：PCT/EP2011/057073

申请日：2011-05-03

Applicant: NESTEC S.A. ,  CHANET, Benjamin ,  MOREAU, Jean ,  SERRE, Jean-Emmanuel ,  MANCHO, José

Inventor： CHANET, Benjamin ,  MOREAU, Jean ,  SERRE, Jean-Emmanuel ,  MANCHO, José

IPC: A23C9/13 ,  A23C9/137 ,  A23C9/152 ,  A23F5/24 ,  B65D51/00

CPC classification number: A23C9/1544 ,  A23C9/1307 ,  A23C9/137 ,  A23C9/1524 ,  A23C2210/30 ,  A23C2270/05 ,  A23F5/243 ,  A23V2002/00 ,  H01L21/67353 ,  H01L21/67356 ,  A23V2250/5424 ,  A23V2200/226

Abstract: The present invention relates to a beverage product comprising a container, a liquid and a dairy foam on top of the liquid covering its surface. The dairy foam comprises 9Q to about 100 wt% milk and milk fat, 0-10 wt% sweetener, and from 0.1 to about 1,5 wtl, preferably from 0.1 to about 1,0 wt% of a stabilizer. According to the invention the dairy foam has been applied first to an inner wall of the container along the entire circumference of said container before filling up the complete surface of the liquid so that it sticks to said inner wall. The present invention also relates to a method for manufacturing such a beverage product.

Abstract translation: 本发明涉及一种饮料产品，其包括在覆盖其表面的液体的顶部上的容器，液体和乳制泡沫。 乳制泡沫体包含9至100重量％的乳和乳脂，0-10重量％甜味剂和0.1至约1.5重量％，优选0.1至约1.0重量％的稳定剂。 根据本发明，在填充液体的完整表面之前，乳制泡沫首先沿着容器的整个周边首先施加到容器的内壁，使其粘附到所述内壁。 本发明还涉及一种制造这种饮料产品的方法。