公开(公告)号：WO2018233929A1

公开(公告)日：2018-12-27

申请号：PCT/EP2018/062387

申请日：2018-05-14

Applicant: ASML NETHERLANDS B.V.

Inventor： DEN BOEF, Arie, Jeffrey ,  TINNEMANS, Patricius, Aloysius, Jacobus ,  KOK, Haico, Victor ,  VAN DRENT, William, Peter ,  GOORDEN, Sebastianus, Adrianus

IPC: G03F7/20 ,  G01B11/02

Abstract: The invention relates to a sensor (SE) comprising: • - a radiation source (LS) to emit radiation (LI) having a coherence length towards a sensor target (GR); and • - a polarizing beam splitter (PBS) to split radiation diffracted by the sensor target into radiation with a first polarization state and radiation with a second polarization state, wherein the first polarization state is orthogonal to the second polarization state, and wherein the sensor is configured such that after passing the polarizing beam splitter radiation with the first polarization state has an optical path difference relative to radiation with the second polarization state that is larger than the coherence length.

公开(公告)号：WO2018224218A1

公开(公告)日：2018-12-13

申请号：PCT/EP2018/061287

申请日：2018-05-03

Applicant: ASML NETHERLANDS B.V.

Inventor： DE SIMONE, Giovanna ,  VAN DEN HEUVEL, Marco, Adrianus, Peter ,  LAURENT, Thibault, Simon, Mathieu ,  BLOKS, Ruud, Hendrikus, Martinus, Johannes ,  ROSET, Niek, Jacobus, Johannes ,  GERRITZEN, Justin, Johannes, Hermanus

IPC: G03F7/20 ,  H01L21/683

Abstract: A method of unloading an object from a support table during an unloading process, the object clamped to the support table during an exposure process by: applying a first pressure to a central region of the support table under a central portion of the object; and applying a second pressure to a peripheral region of the support table under a peripheral portion of the object, wherein during clamping the first pressure and the second pressure are controlled such that liquid is retained between the object and a seal member that is positioned radially between the central region and the peripheral region at an upper surface of the support table and protrudes towards the object, the method comprising: increasing the first pressure towards ambient pressure; removing at least some of the liquid retained between the object and the seal member by decreasing the second pressure; and increasing the second pressure towards the ambient pressure.

公开(公告)号：WO2018215183A1

公开(公告)日：2018-11-29

申请号：PCT/EP2018/061265

申请日：2018-05-03

Applicant: ASML NETHERLANDS B.V.

Inventor： GEERTS, Niels, Cornelis, Petrus, Johannes ,  STADHOUDERS, Franciscus ,  HOFSTE, Erwin, Gerardus, Bernardus

IPC: H02K41/00 ,  H02K9/22

Abstract: An actuator comprises a coil, a first cooling plate and a second cooling plate. The cooling plates are configured to cool the coil. The first and second cooling plates are arranged at opposite sides of the coil to be in thermal contact with the coil. The coil comprises a first coil part and a second coil part, the first coil part facing the first cooling plate and the second coil part facing the second cooling plate, the first and second coil parts being separated by a spacing there between. The first cooling plate, the first coil part, the spacing, the second coil part and the second cooling plate form a stacked structure whereby the coil parts are arranged between the cooling plates and the spacing is arranged between the coil parts. The actuator further comprises a filling element arranged in the spacing. The filling element to push the first coil part towards the first cooling plate and to push the second coil part towards the second cooling plate.

公开(公告)号：WO2018202388A1

公开(公告)日：2018-11-08

申请号：PCT/EP2018/059183

申请日：2018-04-10

Applicant: ASML NETHERLANDS B.V.

Inventor： JAVAHERI, Narjes ,  HAJIAHMADI, Mohammadreza ,  ZWIER, Olger, Victor ,  SANGUINETTI, Gonzalo, Roberto

IPC: G03F7/20

CPC classification number: G03F7/70625 ,  G01M11/00 ,  G01M11/0264 ,  G03F7/705 ,  G03F7/70633

Abstract: A method of determining a patterning process parameter from a metrology target, the method including: obtaining a plurality of values of diffraction radiation from the metrology target, each value of the plurality of values corresponding to a different illumination condition of a plurality of illumination conditions of illumination radiation for the target; and using the combination of values to determine a same value of the patterning process parameter for the target.

公开(公告)号：WO2018197198A1

公开(公告)日：2018-11-01

申请号：PCT/EP2018/059108

申请日：2018-04-10

Applicant: ASML NETHERLANDS B.V.

Inventor： FAN, Chi-Hsiang ,  VAN DER SCHAAR, Maurits ,  ZHANG, Youping

IPC: G03F7/20

Abstract: A method of measuring n values of a parameter of interest (e.g., overlay) relating to a structure forming process, where n>1. The method includes performing n measurements on each of n+1 targets, each measurement performed with measurement radiation having a different wavelength and/or polarization combination and determining the n values for a parameter of interest from the n measurements of n+1 targets, each of the n values relating to the parameter of interest for a different pair of the layers. Each target includes n+1 layers, each layer including a periodic structure, the targets including at least n biased targets having at least one biased periodic structure formed with a positional bias relative to the other layers, the biased periodic structure being in at least a different one of the layers per biased target. Also disclosed is a substrate having such a target and a patterning device for forming such a target.

公开(公告)号：WO2018197146A1

公开(公告)日：2018-11-01

申请号：PCT/EP2018/057982

申请日：2018-03-28

Applicant: ASML NETHERLANDS B.V.

Inventor： SIMONS, Hubertus, Johannes, Gertrudus ,  MOS, Everhardus, Cornelis ,  WEI, Xiuhong ,  MAHMOODI BARAM, Reza ,  YAGUBIZADE, Hadi ,  ZHANG, Yichen

IPC: G03F7/20

Abstract: A device manufacturing method comprising: exposing a first substrate using a lithographic apparatus to form a patterned layer comprising first features; processing the first substrate to transfer the first features into the first substrate; determining displacements of the first features from their nominal positions in the first substrate; determining a correction to at least partly compensate for the displacements; and exposing a second substrate using a lithographic apparatus to form a patterned layer comprising the first features; wherein the correction is applied during the exposing the second substrate.

公开(公告)号：WO2018192759A1

公开(公告)日：2018-10-25

申请号：PCT/EP2018/057887

申请日：2018-03-28

Applicant: ASML NETHERLANDS B.V.

Inventor： BUTLER, Hans

IPC: G03F7/20 ,  G02B7/18

Abstract: The invention relates to support structure, comprising: a first body; a second body; a first support having a first stiffness; a second support having a second stiffness, wherein the second body supports the first body at a first location via the first support, wherein the second body supports the first body at a second location via the second support; a position measurement system arranged to generate a deformation signal representative of a difference of deformation of the first body and the second body relative to each other; a first actuator to apply a force between the first body and the second body at or near the first location; a second actuator to apply a force between the first body and the second body at or near the second location; wherein the support structure comprises a controller arranged to determine a deformation compensation signal on the basis of the first stiffness, the second stiffness and the deformation signal and to drive at least one of the first actuator and the second actuator on the basis of the deformation compensation signal to prevent or at least reduce deformation of the first body.

公开(公告)号：WO2018188891A1

公开(公告)日：2018-10-18

申请号：PCT/EP2018/056554

申请日：2018-03-15

Applicant: ASML NETHERLANDS B.V.

Inventor： PANDEY, Nitesh ,  LIAN, Jin ,  REHMAN, Samee Ur ,  JAK, Martin, Jacobus, Johan

IPC: G03F7/20

Abstract: Methods and apparatus for measuring a plurality of structures formed on a substrate are disclosed. In one arrangement, a method comprises obtaining data from a first measurement process. The first measurement process comprises individually measuring each of the plurality of structures to measure a first property of the structure. A second measurement process is used to measure a second property of each of the plurality of structures. The second measurement process comprises illuminating each structure with radiation having a radiation property that is individually selected for that structure using the measured first property for the structure.

公开(公告)号：WO2018188859A1

公开(公告)日：2018-10-18

申请号：PCT/EP2018/055699

申请日：2018-03-08

Applicant: ASML NETHERLANDS B.V.

Inventor： STEEGHS, Marco, Matheus, Louis ,  GANG, Tian ,  YOUSEFI MOGHADDAM, Mehdi

IPC: G03F7/20

Abstract: A mirror array, at least some of the mirrors of the array comprising a reflective surface and an arm which extends from a surface opposite to the reflective surface, wherein the mirror array further comprises a support structure provided with a plurality of sensing apparatuses, the sensing apparatuses being configured to measure gaps between the sensing apparatuses and the arms which extend from the mirrors.

公开(公告)号：WO2018177659A1

公开(公告)日：2018-10-04

申请号：PCT/EP2018/054360

申请日：2018-02-22

Applicant: ASML NETHERLANDS B.V.

Inventor： NIJE, Jelle ,  YPMA, Alexander ,  GKOROU, Dimitra ,  TSIROGIANNIS, Georgios ,  VAN WIJK, Robert Jan ,  CHEN, Tzu-Chao ,  SPIERING, Frans, Reinier ,  ROY, Sarathi ,  GROUWSTRA, Cédric, Désiré

IPC: G06K9/62 ,  G03F7/20

Abstract: A method of optimizing an apparatus for multi-stage processing of product units such as wafers, the method comprising: (a) receiving object data (210, 230) representing one or more parameters measured (206, 208) across wafers (204, 224) and associated with different stages of processing of the wafers; (b) determining fingerprints (213, 234) of variation of the object data across the wafers, the fingerprints being associated with different respective stages of processing of the wafers. The fingerprints may be determined by decomposing (212, 232) the object data into components using principal component analysis for each different respective stage; (c) analyzing (246) commonality of the fingerprints through the different stages to produce commonality results; and (d) optimizing (250- 258) an apparatus for processing (262) product units based on the commonality results.