公开(公告)号：WO2007013742A3

公开(公告)日：2007-03-22

申请号：PCT/KR2006002601

申请日：2006-07-03

Applicant: KO HEUI SOO ,  SHIN DONG-SIK ,  BAEK CHANG-KUN

Inventor： SHIN DONG-SIK ,  BAEK CHANG-KUN

IPC: H02K1/06

CPC classification number: H02K16/00 ,  H02K7/006 ,  H02K2207/03

Abstract: The present invention relates to first and second stators for generating a magnetic force if an electric current is applied to a coil; first and second rotors each having a plurality of permanent magnets, a core and a shaft in such a manner as to be mounted rotatably with respect to the first and second stators; a power transmission shaft rotated integrally with the first and second rotors; a pedal side gear rotatably mounted integrally along the outer periphery of the power transmission shaft in such a manner as to be engaged with a gear attached to a pedal; and a rear wheel side gear rotatably mounted integrally along the outer periphery of the power transmission shaft in such a manner as to be engaged with a gear attached to a rotary shaft of a rear wheel. The motor with an integral body type of power transmission shaft is easily mounted to an electric bicycle, thereby providing excellent assembling and productivity, and reduces the losses of power by the simplicity of parts therein, thereby making the efficiency of transmission of power desirably optimized.

Abstract translation: 本发明涉及一种用于在向线圈施加电流时产生磁力的第一和第二定子; 第一和第二转子各自具有多个永磁体，芯和轴，以相对于第一和第二定子可旋转地安装; 动力传递轴与第一和第二转子一体地旋转; 沿着动力传递轴的外周一体地旋转地安装的踏板侧齿轮，以便与附接到踏板的齿轮接合; 以及沿着动力传递轴的外周一体地可旋转地安装的后轮侧齿轮，以便与附接到后轮的旋转轴的齿轮接合。 具有整体式动力传递轴的电动机容易地安装到电动自行车上，从而提供优异的组装和生产率，并且通过其中部件的简单性来减少功率损失，从而使功率传输的效率期望地优化。

公开(公告)号：WO2005089407A2

公开(公告)日：2005-09-29

申请号：PCT/US2005/008830

申请日：2005-03-16

Applicant: RAMBUS, INC. ,  BEST, Scott, C. ,  ABHYANKAR, Abhijit, M. ,  CHANG, Kun-Yung ,  LAMBRECHT, Frank

Inventor： BEST, Scott, C. ,  ABHYANKAR, Abhijit, M. ,  CHANG, Kun-Yung ,  LAMBRECHT, Frank

IPC: G06F1/04 ,  H04L7/00 ,  H04L7/10 ,  H04L25/14

CPC classification number: G06F1/08 ,  G06F1/12 ,  G11C29/02 ,  G11C29/022 ,  G11C29/028 ,  G11C29/50012 ,  H04L7/0004 ,  H04L7/0008 ,  H04L7/0033 ,  H04L7/0091 ,  H04L7/033 ,  H04L7/10 ,  H04L25/14

Abstract: A communication channel includes a first component having a transmitter coupled to a normal signal source, and a second component having a receiver coupled to a normal signal destination. A communication link couples the first and second components. Calibration logic provides for setting an operation value for a parameter of the communication channel, such as by executing an exhaustive calibration sequence at initialization of the link. A tracking circuit, including a monitoring function, tracks drift in the parameter by monitoring a feedback signal that has a characteristic that correlates with drift in the communication channel, and updates, or indicates the need for updating of, the operation value of the parameter in response to the monitoring function.

Abstract translation: 通信信道包括具有耦合到正常信号源的发射机的第一分量和具有耦合到正常信号目的地的接收机的第二分量。 通信链路耦合第一和第二组件。 校准逻辑提供了设置通信信道参数的操作值，例如通过在链路初始化时执行穷举校准序列。 包括监视功能的跟踪电路通过监视具有与通信信道中的漂移相关的特征的反馈信号来跟踪参数中的漂移，并且更新或指示更新参数的操作值的需要 响应监控功能。

公开(公告)号：WO1996007769A1

公开(公告)日：1996-03-14

申请号：PCT/US1995011039

申请日：1995-08-29

Applicant: VARIAN ASSOCIATES, INC. ,  OH, Kyu-Woon ,  LEE, Chang-Kun ,  KIM, Myung-Kil

Inventor： VARIAN ASSOCIATES, INC.

IPC: C23C14/34

CPC classification number: H01J37/3244 ,  C23C14/0063 ,  H01J37/34 ,  H01J2237/022

Abstract: An apparatus for manufacturing a thin film for a semiconductor device which includes a vacuum chamber (22), a heater block (23) installed in the vacuum chamber (22) for heating the wafer (200), asputtering source (24) installed above the heater block (23), a clamp (26) for clamping the wafer (200) installed on the heater block (23) against the heater block (23), and a gas supply means (40) for directly supplying gas to two specific sites in the vacuum chamber (22) which comprises a first gas supply (41) for supplying a first gas proximate the top of the wafer (200) from an opening (44) formed along the exterior surface of the sputtering source (24), and a second gas supply (45) positioned to supply a second gas to the top of the wafer (200). The present invention reduces the formation of undesirable particles in the vacuum chamber (22) thereby improving the characteristics of the deposited film and production efficiency.

Abstract translation: 一种用于制造半导体器件用薄膜的装置，包括真空室（22），安装在用于加热晶片（200）的真空室（22）中的加热器块（23），安装在晶片上方的溅射源（24） 加热器块（23），用于将安装在加热器块（23）上的晶片（200）夹持在加热器块（23）上的夹具（26）以及用于直接向两个特定位置供应气体的气体供应装置 在包括用于从沿着溅射源（24）的外表面形成的开口（44）提供靠近晶片（200）的顶部的第一气体的第一气体供应源（41）的真空室（22）中，以及 定位成将第二气体供应到晶片（200）的顶部的第二气体供应源（45）。 本发明减少了真空室（22）中不需要的颗粒的形成，从而提高了沉积膜的特性和生产效率。