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    RF SHIELDED CAPACITIVELY COUPLED CONNECTOR
    41.
    发明申请
    RF SHIELDED CAPACITIVELY COUPLED CONNECTOR 审中-公开
    射频屏蔽电容耦合连接器

    公开(公告)号：WO2014074222A1

    公开(公告)日：2014-05-15

    申请号：PCT/US2013/059845

    申请日：2013-09-16

    Applicant: ANDREW LLC

    Inventor： VAN SWEARINGEN, Kendrick ,  VACCARO, Ronald ,  PAYNTER, Jeffrey

    IPC: H01R24/38

    CPC classification number: H01R13/6592 ,  H01G2/10 ,  H01P3/06 ,  H01P5/026 ,  H01Q1/00 ,  H01R13/6598 ,  H01R24/40 ,  Y02E40/64 ,  Y10S439/95

    Abstract: A connector with a capacitively coupled connector interface for interconnection with a female portion is provided with an annular groove, with a sidewall, open to an interface end of the female portion. A male portion is provided with a male outer conductor coupling surface at an interface end, covered by an outer conductor dielectric spacer. A waveguide path between the male outer conductor coupling surface and the female portion, while in the interlocked position, may extend from the outer conductor dielectric spacer to an exterior of the interconnection through an s-bend in a radial direction, to improve RF isolation. Alternatively and/or additionally an overbody may be provided as an RF absorbing chamber including RF absorbing material and which may include a plurality of RF absorbing chambers isolated from one another, where multiple interconnections are present.

    Abstract translation: 具有用于与阴部分互连的电容耦合连接器接口的连接器设置有环形凹槽，其具有通向阴部分的界面端的侧壁。 阳部分在接口端处设置有由外导体电介质间隔件覆盖的阳外导体耦合表面。 阳性外部导体耦合表面和阴性部分之间的波导路径在互锁位置处可以从外部导体电介质间隔物沿着径向方向通过s形弯曲而延伸到互连的外部，以改善RF隔离。 可替换地和/或另外地，可以提供超体，其作为包括RF吸收材料的RF吸收室，并且其可以包括彼此隔离的多个RF吸收室，其中存在多个互连。

    ELECTRICAL CONNECTORS INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) ABSORBING MATERIAL
    43.
    发明申请
    ELECTRICAL CONNECTORS INCLUDING ELECTROMAGNETIC INTERFERENCE (EMI) ABSORBING MATERIAL 审中-公开
    电气连接器，包括电磁干扰（EMI）吸收材料

    公开(公告)号：WO2012082518A1

    公开(公告)日：2012-06-21

    申请号：PCT/US2011/063939

    申请日：2011-12-08

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  BARR, Alexander W.

    Inventor： BARR, Alexander W.

    IPC: H01R13/6585 ,  H05K9/00 ,  H01R13/6597 ,  H01R13/6598

    CPC classification number: H01R13/6598 ,  H01R13/6585 ,  H01R13/6586 ,  H01R13/6597

    Abstract: Examples of electrical connectors that incorporate electromagnetic interference (EMI) absorbing materials are described. In one example, an electrical connector includes a first pair of conductors, a second pair of conductors, and electromagnetic interference (EMI) absorbing material at least partially separating the first pair of conductors from the second pair of conductors. Each of the first and second pairs of conductors defines one of a differential pair or a signal conductor/ground pair. The EMI absorbing material may be configured to attenuate, primarily by absorption, an electromagnetic field generated due to transmission of electrical signals via one of the first pair and second pair of conductors to reduce the electromagnetic inference from the electromagnetic field on the other of the first pair and second pair of conductors.

    Abstract translation: 描述了包含电磁干扰（EMI）吸收材料的电连接器的例子。 在一个示例中，电连接器包括第一对导体，第二对导体和至少部分地将第一对导体与第二对导体分离的电磁干扰（EMI）吸收材料。 第一和第二对导体中的每一个限定差分对或信号导体/接地对中的一个。 EMI吸收材料可以被配置为主要通过吸收来衰减由于通过第一对和第二对导体中的一个传导电信号而产生的电磁场，以减少来自第一对和第二对导体中的另一个的电磁场的电磁推断 对和第二对导体。

    ANSCHLUSSELEMENT FÜR DIE KOMMUNIKATIONS- UND DATENTECHNIK
    45.
    发明申请
    ANSCHLUSSELEMENT FÜR DIE KOMMUNIKATIONS- UND DATENTECHNIK 审中-公开
    连接元件用于通信和数据技术

    公开(公告)号：WO2008040406A1

    公开(公告)日：2008-04-10

    申请号：PCT/EP2007/006371

    申请日：2007-07-18

    Applicant: ADC GMBH ,  HETZER, Ulrich ,  MÖSSNER, Frank

    Inventor： HETZER, Ulrich ,  MÖSSNER, Frank

    IPC: H01R13/658

    CPC classification number: H01R4/2416 ,  H01R13/6598 ,  H01R13/6599 ,  H01R13/6658 ,  H01R24/64

    Abstract: Die Erfindung betrifft ein Anschlusselement für die Kommunikations- und Datentechnik, umfassend ein Gehäuse und Anschlusskontakte, die in dem Gehäuse angeordnet sind, wobei das Gehäuse elektrisch und/oder magnetisch leitende Teile aufweist, wobei die Oberfläche des Gehäuses vollständig aus elektrisch und/oder magnetisch nicht leitendem Material besteht, sowie ein Verfahren zur Herstellung eines Anschlusselements.

    Abstract translation: 本发明涉及一种用于通信和数据技术的连接元件，其包括外壳和连接它们布置在所述壳体接触，具有电和/或磁外壳导电部分，其中，所述壳体的表面完全的电和/或磁性非 导电材料，并产生一个连接元件的方法。

    INTERCONNECTION SYSTEM WITH IMPROVED HIGH FREQUENCY PERFORMANCE
    46.
    发明申请
    INTERCONNECTION SYSTEM WITH IMPROVED HIGH FREQUENCY PERFORMANCE 审中-公开
    具有提高高频性能的互连系统

    公开(公告)号：WO2004059801A1

    公开(公告)日：2004-07-15

    申请号：PCT/US2003/040642

    申请日：2003-12-20

    Applicant: TERADYNE, INC.

    Inventor： GAILUS, Mark, W.

    IPC: H01R13/658

    CPC classification number: H05K1/0233 ,  H01R13/6587 ,  H01R13/6598 ,  H01R13/719

    Abstract: An interconnection system is described. Absorptive material is selectively positioned throughout the system to improve the high frequency performance of the system. Various embodiments are illustrated, including a backplane-daughtercard connector and a printed circuit board.

    Abstract translation: 描述互连系统。 吸收材料选择性地定位在整个系统中以改善系统的高频性能。 示出了各种实施例，包括背板 - 子卡连接器和印刷电路板。

    HIGH SPEED, HIGH DENSITY INTERCONNECTION DEVICE
    47.
    发明申请
    HIGH SPEED, HIGH DENSITY INTERCONNECTION DEVICE 审中-公开
    高速，高密度互连装置

    公开(公告)号：WO2004001912A1

    公开(公告)日：2003-12-31

    申请号：PCT/US2003/019830

    申请日：2003-06-24

    Applicant: ADVANCED INTERCONNECTIONS CORPORATION ,  PERUGINI, Michael ,  SAYDAM, Erol, D. ,  EASTMAN, Gary, D. ,  LANGON, Alfred, J. ,  PREW, Raymond, A.

    Inventor： PERUGINI, Michael ,  SAYDAM, Erol, D. ,  EASTMAN, Gary, D. ,  LANGON, Alfred, J. ,  PREW, Raymond, A.

    IPC: H01R13/648

    CPC classification number: H01R12/716 ,  H01R12/52 ,  H01R13/187 ,  H01R13/405 ,  H01R13/514 ,  H01R13/6471 ,  H01R13/6477 ,  H01R13/6586 ,  H01R13/6591 ,  H01R13/6598

    Abstract: An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

    Abstract translation: 一种用于在具有电接地电路和底盘接地电路的数字或模拟传输系统内接收接触阵列的相互耦合部件，所述互耦部件包括由电绝缘材料形成的并具有上表面和下表面的部分，所述部分包括多个 设置在其上表面上并且布置成预定占地面积的一个或多个屏蔽构件，该屏蔽构件由导电材料形成，该屏蔽构件设置在该段内并被配置为连接到该系统的底盘接地电路。 相互耦合部件可以包括在设置在片段上的多个孔内的导电触点阵列。 这些触点中的一个或多个可以被配置为与系统的电接地电路电连接。 相互耦合组件还可以包括位于信号触头之间的空腔，以调整信号触点之间的差分阻抗。

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