METHOD FOR FORMING A WORKPIECE
    81.
    发明申请
    METHOD FOR FORMING A WORKPIECE 审中-公开
    形成工作的方法

    公开(公告)号:WO2015006221A1

    公开(公告)日:2015-01-15

    申请号:PCT/US2014/045588

    申请日:2014-07-07

    Inventor: GRAHAM, David C.

    CPC classification number: B24B7/22 B24B19/009

    Abstract: A method of forming a workpiece having machinability rating not greater than a machinability rating of Inconel 718. The method may include removing material from the workpiece by moving at least one grinding tool relative to the workpiece and may be conducted at a specific grinding energy of not greater than about 7 Hp/in 3 min (about 19 J/mm 3 ) for a material removal rate of at least about 2.5 in 3 /min•in (about 25 mm 3 sec/mm).

    Abstract translation: 一种形成可切削性等级不大于Inconel 718的机械加工性能的工件的方法。该方法可以包括通过相对于工件移动至少一个研磨工具从工件移除材料,并且可以以不特定的特定研磨能量进行 大于约7Hp / in3分钟(约19J / mm3),材料去除率至少为2.5in3 / min·in(约25mm3sec / mm)。

    BONDED ABRASIVE ARTICLE AND METHOD OF GRINDING
    82.
    发明申请
    BONDED ABRASIVE ARTICLE AND METHOD OF GRINDING 审中-公开
    粘结磨砂制品和研磨方法

    公开(公告)号:WO2014106159A1

    公开(公告)日:2014-07-03

    申请号:PCT/US2013/078231

    申请日:2013-12-30

    CPC classification number: B24D3/06 B24D3/008

    Abstract: An abrasive article comprising: a first body comprising a first bond material having abrasive particles contained within the first bond material, wherein the first body comprising the first bond material comprises a ratio of V AG(1) /V BM(1) of at least about 1.3; a second body comprising a second bond material having abrasive particles contained within the second bond material, wherein the second body comprising the second bond material comprises a ratio of V AG(2) /V BM(2) of less than about 1.3, and wherein V AG is a volume percent of abrasive particles within a total volume of the first or second body respectively and V BM is a volume percent of the first or second bond material within the total volume of the first or second body respectively.

    Abstract translation: 一种磨料制品,包括:第一主体,包括具有包含在所述第一粘合材料内的磨料颗粒的第一粘合材料,其中所述包含所述第一粘合材料的所述第一体包含至少约1.3的VAG(1)/ VBM(1) ; 第二主体,包括具有包含在第二接合材料内的磨料颗粒的第二粘合材料,其中包含第二粘合材料的第二体包含小于约1.3的VAG(2)/ VBM(2)的比率,并且其中VAG为 分别在第一或第二主体的总体积内的磨料颗粒的体积百分数,VBM分别为第一或第二体的总体积内的第一或第二粘合材料的体积百分数。

    BONDED ABRASIVE ARTICLE AND METHOD OF GRINDING
    83.
    发明申请
    BONDED ABRASIVE ARTICLE AND METHOD OF GRINDING 审中-公开
    粘结磨砂制品和研磨方法

    公开(公告)号:WO2014106157A1

    公开(公告)日:2014-07-03

    申请号:PCT/US2013/078227

    申请日:2013-12-30

    CPC classification number: B24D3/06 B24B1/00 B24B9/00 B24D3/008 B24D3/342 B24D5/00

    Abstract: An abrasive article configured to grind a workpiece having a fracture toughness at least about 7 MPa•m 0 5 includes a body comprising abrasive particles contained within a bond material comprising a metal, wherein the body comprises a ratio of V AG /V BM of at least about 1.3, wherein V AG is a volume percent of abrasive particles within a total volume of the body and V BM is a volume percent of bond material within the total volume of the body, and wherein the abrasive particles have an average particle size of 40 to 60 microns.

    Abstract translation: 构造成研磨具有至少约7MPa·m0 5的断裂韧度的工件的研磨制品包括包含包含在包含金属的粘合材料内的磨料颗粒的主体,其中所述主体包含至少约1.3的VAG / VBM比 其中VAG是体积总体积内磨料颗粒的体积百分比,VBM是体内总体积内的粘合材料的体积百分数,并且其中磨料颗粒的平均粒度为40至60微米。

    SUPPORT SYSTEM FOR TRANSPARENT DEVICES
    88.
    发明申请

    公开(公告)号:WO2022192903A1

    公开(公告)日:2022-09-15

    申请号:PCT/US2022/071092

    申请日:2022-03-11

    Abstract: A display framing system is disclosed. The display framing system can include a first pane and a framing system to support the first pane. The framing system can include a first side. The display framing system can also include a transparent electroactive device and a support system coupled to the transparent electroactive device and coupled to the first side of the framing system. The support system can include a body that is orthogonal to the first side of the framing system. In one embodiment, the first pane can include an electrochromic device.

    SUPPORT SYSTEM FOR ELECTROCHROMIC DEVICES
    89.
    发明申请

    公开(公告)号:WO2022140757A1

    公开(公告)日:2022-06-30

    申请号:PCT/US2021/073025

    申请日:2021-12-20

    Abstract: A frameless support system for electroactive devices is disclosed. The frameless system can include a non-penetrating mount, a first electroactive device, and a second electroactive device adjacent the first electroactive device where the non-penetrating mount connects the first electroactive device to the second electroactive device, and where the non-penetrating mount is on only a single surface of the first and second electroactive devices. In a further embodiment, and least one of the first and second electroactive devices can further include: a substrate; a first transparent conductive layer; a second transparent conductive layer between the substrate and the first transparent conductive layer; an electrochromic layer between the first transparent conductive layer and the second transparent conductive layer; and an anodic electrochemical layer between the first transparent conductive layer and the second transparent conductive layer.

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