Abstract:
Integrated signal pair elements are disclosed that can be inserted into and removed from a backplane connector housing as a single piece. Each element includes an insulative frame that supports a pair of conductive terminals in a spaced-apart arrangement. The frame is attached to a ground shield that provides a ground plane that extends around three sides of the signal pair. Cable wires are terminated to tail portions of the signal pair and an insulative material is molded over the cable wire termination area to form an integrated signal pair element. The individual signal pair elements may also be commoned together in a linear array of signal pair elements by a commoning member that contacts the ground shields of the array of signal pair elements.
Abstract:
A connector backshell assembly (10) configured to interconnect a cable (18) to a connector (20). The connector backshell assembly (10) has multiple cable portals (24, 26, 28) at exit angles, such as straight, 90 degree, and 45 degree relative to the connector (20). The connector backshell assembly (10) is separable into two halves (12) to allow easy access to the rear portion of the connector (20) for connecting and servicing the cable (18)/connector (20) interface. Unused cable portals (24, 26, 28) may be sealed with a plug (38). The connector backshell assembly (10) may be used with various Military specification (Mil Spec) types including M38999, M28840, M28876, M5015, and M64266.
Abstract:
An electrical connector assembly having shielded cage assembly with at least one port for receiving modules, and methods of manufacture and use thereof. In one embodiment, the modules comprise SFP -type (small form-factor pluggable) modules, and the shielded cage assembly comprises an EMI shield member that is disposed at a port opening for the electrical connector assembly, hi one variant, the EMI shield member can be disposed on the electrical connector cage assembly without the need for secondary processing techniques such as soldering, or resistance welding. This is accomplished via for example the utilization of mechanical snap features.