Abstract:
An electrical connector assembly having shielded cage assembly with at least one port for receiving modules, and methods of manufacture and use thereof. In one embodiment, the modules comprise SFP -type (small form-factor pluggable) modules, and the shielded cage assembly comprises an EMI shield member that is disposed at a port opening for the electrical connector assembly, hi one variant, the EMI shield member can be disposed on the electrical connector cage assembly without the need for secondary processing techniques such as soldering, or resistance welding. This is accomplished via for example the utilization of mechanical snap features.
Abstract:
A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non¬ conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.
Abstract:
A multi-core inductive device assembly for electrical or electronic applications. In one embodiment, the device assembly comprises a multiple core component structure providing multiple inductive devices (for example, that has N inductors and two core elements). Conductive windings are disposed between the core elements. The core elements comprise risers for each of the inductive devices which permit, among other things, individual control of the gap formed between the risers, and hence the magnetic and other performance aspects of each inductive device. This topology allows for a multi- element (N) inductor array with substantial isolation properties, and which allows for individualized control of saturated output power performance for each of the N inductors. Methods for use and manufacturing are also disclosed.
Abstract:
An advanced modular plug connector assembly incorporating a substrate disposed in the rear portion of the connector housing, the substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. In one embodiment, the connector assembly comprises a single port pair with a single substrate disposed in the rear portion of the housing. In another embodiment, the assembly comprises a mufti-port "row-and-column" housing with multiple substrates (one per port) received within the rear of the housing, each substrate having signal conditioning electronics which condition the input signal received from the corresponding modular plug before egress from the connector assembly. In yet another embodiment, the connector assembly comprises an indicator assembly having a plurality of optically transmissive conduits, the assembly being disposed largely outside the external noise shield of the connector and removable therefrom. Methods for manufacturing the aforementioned embodiments are also disclosed.
Abstract:
A multi-piece microelectronic connector is disclosed which permits rapid assembly of the connector components during manufacture. The connector is comprised of an insert and a connector body. The insert has a cavity configured to receive at least one electrical component. The insert also has leads for electrically connecting the electrical component with a modular plug. The connector body has a front, a back and a dividing wall separating the front and the back. The front of the connector body has a cavity for receiving a modular plug therein. The back has a cavity for receiving the insert therein. The dividing wall has a set of openings providing communication between the cavity in the front and the cavity in the back. The set of leads of the insert are configured to protrude through the set of openings in the dividing wall and into the cavity in the front of the connector body.
Abstract:
A low cost, high performance inductive device 100 for use in, e.g. electronic circuits is disclosed. In one exemplary embodiment, the device includes a two-legged magnetically permeable core 110 optimized for fitting with one or more windings 120. Preferably, the device is also self-leaded, thereby simplifying its installation and mating to a parent device (e.g., PCB). In another embodiment, one or more low profile magnetically permeable cores are mounted on a surface of the self-leaded magnetically permeable core, preferably with a gap. In yet another embodiment, the aforementioned gap G is obviated. In yet another embodiment, spacers 320a, 320b are positioned on a surface of the self-leaded magnetically permeable core device to position the low profile magnetically permeable at a predetermined distance from the self-leaded magnetically permeable core. In yet another embodiment, a bead inductor is disclosed comprising a plurality turns. Methods for manufacturing and utilizing the devices are also disclosed.
Abstract:
An electrical connector assembly having shielded cage assembly with a plurality of ports for receiving modules. In one embodiment, the modules comprise SFP (small form-factor pluggable) modules, and the electrical connector assembly is adapted for low-profile applications, thereby optimizing the amount of area and volume occupied by the SFP assembly. In one variant, the SFP modules are pluggable into individual ports, whereby two modules are interconnected to a single header connector interconnected to a motherboard. Methods of manufacturing the connector assembly are also disclosed.
Abstract:
An advanced modular plug connector assembly incorporating an insert assembly disposed in the rear portion of the connector housing. In one embodiment, the connector has a plurality of ports in multi-row configuration, and the insert assembly includes a substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. The substrate also interfaces with the conductors of two modular ports of the connector, and is removable from the housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet and 10/100). In yet another embodiment, the connector assembly comprises a plurality of light sources (e.g., LEDs) received within the housing. Methods for manufacturing the aforementioned embodiments are also disclosed.
Abstract:
A simplified microelectronic transformer suitable for surface mount applications comprises a central spool (102) upon which the transformer primary (104) and secondary (106) windings are wound. A series of "E" shaped laminar core elements (108) are fitted within the spool in an alternating, interlocking fashion so as to form a substantially rectangular core assembly. A molded cover (120) is fitted within the central region of the wound bobbin assembly; the cover "snaps" into the core thereby retaining it in a substantially fixed position with respect to the spool and other transformer components. This arrangement obviates the need for varnish or other coatings to maintain the core elements in place, and improves the thermal and electrical performance of the transformer. A method of fabricating the simplified transformer is also disclosed.
Abstract:
An advanced connector assembly enabled to receive and distribute power signals. In one embodiment, the connector comprises a single port modular jack, and incorporates an insert assembly disposed in the rear portion of the connector housing. The insert assembly includes first and second substrates and a cavity adapted to receive one or more electronic or signal conditioning components. Heat removal features are also utilized within the jack to effectively dissipate heat produced by the electronic or signal conditioning components. The insert assembly is also optionally made removable from the jack housing such that an insert assembly of a different electronics or terminal configuration can be substituted therefor. In this fashion, the connector can be configured to a plurality of different standards (e.g., Gigabit Ethernet, 10/100, etc.). Methods for manufacturing the aforementioned embodiments are also disclosed.