公开(公告)号：WO2004100252A1

公开(公告)日：2004-11-18

申请号：PCT/AU2004/000594

申请日：2004-05-07

Applicant: ORIGIN ENERGY SOLAR PTY LTD ,  WONG, Paul, Charles ,  ABNOOS, Razmik ,  EVERETT, Vernie, Allan ,  KERR, Mark, John

Inventor： WONG, Paul, Charles ,  ABNOOS, Razmik ,  EVERETT, Vernie, Allan ,  KERR, Mark, John

IPC: H01L21/68

CPC classification number: H01L21/67706 ,  H01L21/67092 ,  H01L21/6776 ,  Y10T156/1092 ,  Y10T156/1097

Abstract: A method and an apparatus for separating elongated semiconductor strips (630) from a wafer (400) of semiconductor material are disclosed. Vacuum (500) is applied to the face of each semiconductor strip forming an edge of the wafer (400) or being adjacent to the edge. The wafer (400) and the source of the vacuum (500) are displaced to separate each elongated semiconductor strip (630) from the wafer (400). Further, a method and an apparatus for assembling elongated semiconductor strips (630) separated from a wafer (400) of semiconductor material into an array of strips (630) are disclosed. Still further, methods, apparatuses, and systems for assembling an array of elongated semiconductor strips (630) on a substrate are also disclosed.

Abstract translation: 公开了一种用于从半导体材料的晶片（400）分离细长半导体条（630）的方法和装置。 将真空（500）施加到形成晶片（400）的边缘或邻近边缘的每个半导体条的表面。 将晶片（400）和真空源（500）移位以将每个细长半导体条（630）与晶片（400）分离。 此外，公开了一种用于组装从半导体材料的晶片（400）分离成条带阵列（630）的细长半导体条（630）的方法和装置。 此外，还公开了用于在衬底上组装细长半导体条（630）阵列的方法，装置和系统。