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公开(公告)号：WO2007133628A3
公开(公告)日：2008-01-10
申请号：PCT/US2007011295
申请日：2007-05-09
Applicant: WAVEZERO INC , ARNOLD ROCKY RICHARD
Inventor： ARNOLD ROCKY RICHARD
IPC: H01R9/03
CPC classification number: H05K9/0084 , C23C26/02 , C23C28/00 , C23C28/023 , Y10T428/24479 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
Abstract: An electromagnetic interference shield includes a polymer thin film metalized with conductive metals and a solderable material deposited over the conductive metals. The solderable material has a low melting temperature so that the solder can be heated to form a weld joint between a chip (or component) and the solder without damaging the metalized polymer thin film. One example of a low melting temperature solder is SnBi.
Abstract translation: 电磁干扰屏蔽包括用导电金属金属化的聚合物薄膜和沉积在导电金属上的可焊材料。 可焊接材料具有低的熔化温度，使得可以加热焊料以在芯片（或组件）和焊料之间形成焊接接头，而不会损坏金属化的聚合物薄膜。 低熔点焊料的一个例子是SnBi。
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公开(公告)号：WO2007133628A2
公开(公告)日：2007-11-22
申请号：PCT/US2007/011295
申请日：2007-05-09
Applicant: WAVEZERO, INC. , ARNOLD, Rocky, Richard
Inventor： ARNOLD, Rocky, Richard
CPC classification number: H05K9/0084 , C23C26/02 , C23C28/00 , C23C28/023 , Y10T428/24479 , Y10T428/269 , Y10T428/31678 , Y10T428/31681
Abstract: An electromagnetic interference shield includes a polymer thin film metalized with conductive metals and a solderable material deposited over the conductive metals. The solderable material has a low melting temperature so that the solder can be heated to form a weld joint between a chip (or component) and the solder without damaging the metalized polymer thin film. One example of a low melting temperature solder is SnBi.
Abstract translation: 电磁干扰屏蔽包括用导电金属金属化的聚合物薄膜和沉积在导电金属上的可焊材料。 可焊接材料具有低的熔化温度，使得可以加热焊料以在芯片（或组件）和焊料之间形成焊接接头，而不会损坏金属化的聚合物薄膜。 低熔点焊料的一个例子是SnBi。
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3.发明申请
公开(公告)号：WO2007143477A3
公开(公告)日：2007-12-13
申请号：PCT/US2007/069993
申请日：2007-05-30
Applicant: WAVEZERO, INC. , LAKEMAN, Russell, Ernest , ARNOLD, Rocky, Richard
Inventor： LAKEMAN, Russell, Ernest , ARNOLD, Rocky, Richard
Abstract: An RFID antenna that is protected from corrosion and is configured for easy attachment to an electronic chip is very advantageous. The electrically conductive RFID antenna pattern (107) is coated with a layer of solderable material (110) that protects the copper from corroding. The solderable material has a low melting temperature so that the solderable material can be heated to form a weld joint (120) between a chip (115) and the solderable material without damaging the chip.
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4.发明申请SYSTEM AND METHOD FOR ATTACHING RADIOFREQUENCY IDENTIFICATION CHIPS TO METALIZED ANTENNA 审中-公开将金属化天线的无线电识别信号连接的系统和方法
公开(公告)号：WO2007143477A2
公开(公告)日：2007-12-13
申请号：PCT/US2007069993
申请日：2007-05-30
Applicant: WAVEZERO INC , LAKEMAN RUSSELL ERNEST , ARNOLD ROCKY RICHARD
Inventor： LAKEMAN RUSSELL ERNEST , ARNOLD ROCKY RICHARD
IPC: G08B13/14
CPC classification number: G06K19/07749 , G06K19/0775 , G06K19/07786 , H01L2224/16225 , H01L2224/16227 , H01Q1/2208 , H01Q9/28
Abstract: An RFID antenna that is protected from corrosion and is configured for easy attachment to an electronic chip is very advantageous. The electrically conductive RFID antenna pattern is coated with a layer of solderable material that protects the copper from corroding. The solderable material has a low melting temperature so that the solderable material can be heated to form a weld joint between a chip and the solderable material without damaging the chip.
Abstract translation: 防止腐蚀并被配置为便于附接到电子芯片的RFID天线是非常有利的。 导电RFID天线图案涂覆有可焊接材料层，其保护铜不被腐蚀。 可焊接材料具有低熔融温度，使得可焊接材料可被加热以在芯片和可焊接材料之间形成焊接接头而不损坏芯片。
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