公开(公告)号：WO2004114731A2

公开(公告)日：2004-12-29

申请号：PCT/US2004/019716

申请日：2004-06-18

Applicant: WAVEZERO, INC. ,  ARNOLD, Rocky, R.

Inventor： ARNOLD, Rocky, R.

IPC: H05K

CPC classification number: H05K9/0024 ,  H01L23/24 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/315 ,  H01L23/552 ,  H01L2924/16251 ,  H01L2924/166 ,  H05K9/003

Abstract: The present invention provides printed circuit boards, EMI shields, and methods that provide an EMI absorbing material and an EMI reflecting material. In one embodiment, the EMI shield comprises a shield body and an EMI absorbing material coupled to the shield body.

Abstract translation: 本发明提供了提供EMI吸收材料和EMI反射材料的印刷电路板，EMI屏蔽和方法。 在一个实施例中，EMI屏蔽包括屏蔽体和耦合到屏蔽体的EMI吸收材料。

公开(公告)号：WO2004093505A2

公开(公告)日：2004-10-28

申请号：PCT/US2004/011992

申请日：2004-04-15

Applicant: WAVEZERO, INC. ,  ARNOLD, Rocky R. ,  ZARGANIS, John C. ,  MONTAUTI, Fabrizio

Inventor： ARNOLD, Rocky R. ,  ZARGANIS, John C. ,  MONTAUTI, Fabrizio

IPC: H05K

CPC classification number: H01L23/04 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K9/003 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: The present invention provide methods and devices for shielding an electronic component package. In one embodiment, an EMI shield is integrally formed within the package adjacent the die and grounded. The EMI shield may be a metallized shaped polymer layer and may be disposed fully within the package or it may extend out of the package.

Abstract translation: 本发明提供了用于屏蔽电子部件封装的方法和装置。 在一个实施例中，EMI屏蔽件（42）在邻近管芯（12）的封装内整体形成并接地。 EMI屏蔽（42）可以是金属化形状的聚合物层（34），并且可以完全设置在封装内，或者它可以延伸出封装。

公开(公告)号：WO2007106716A3

公开(公告)日：2008-05-02

申请号：PCT/US2007063604

申请日：2007-03-08

Applicant: WAVEZERO INC ,  ARNOLD ROCKY R ,  ANTONIUCCI PIER GIORGIO

Inventor： ARNOLD ROCKY R ,  ANTONIUCCI PIER GIORGIO

IPC: G08B13/14

CPC classification number: B31D1/021 ,  B31D1/028 ,  G06K19/07722 ,  G06K19/07749

Abstract: An RFID smart label includes a plurality of layers, wherein one of the plurality of layers is an RFID inlay with a depression/recession region for holding the RFID chip/strap so that it does not extend above the surface of the antenna. The depressed/recessed region can have substantially the same depth as the thickness of the RFID chip/strap. High speed printing processes are then used to economically print labels on the RFID inlays having the RFID chip/strap embedded because there are no bumps to impede the printing process. A method for reliably and economically manufacturing a radiofrequency identification (RFID) antenna includes impressing a pattern on a surface of a substrate to make a first portion of the substrate having a positive image of the RFID antenna and a second portion of the substrate having a negative image of the WID antenna.

Abstract translation: RFID智能标签包括多个层，其中多个层中的一个是具有用于保持RFID芯片/带的凹陷/凹陷区域的RFID嵌体，使得其不在天线的表面上方延伸。 凹陷/凹陷区域可以具有与RFID芯片/带的厚度基本相同的深度。 然后使用高速印刷工艺来经济地印刷具有嵌入的RFID芯片/带的RFID嵌体上的标签，因为没有凸起阻碍印刷过程。 一种用于可靠和经济地制造射频识别（RFID）天线的方法，包括在基板的表面上印刷图案，以使基板的第一部分具有RFID天线的正像，并且基板的第二部分具有负 WID天线的图像。

公开(公告)号：WO2007143477A2

公开(公告)日：2007-12-13

申请号：PCT/US2007069993

申请日：2007-05-30

Applicant: WAVEZERO INC ,  LAKEMAN RUSSELL ERNEST ,  ARNOLD ROCKY RICHARD

Inventor： LAKEMAN RUSSELL ERNEST ,  ARNOLD ROCKY RICHARD

IPC: G08B13/14

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  G06K19/07786 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01Q1/2208 ,  H01Q9/28

Abstract: An RFID antenna that is protected from corrosion and is configured for easy attachment to an electronic chip is very advantageous. The electrically conductive RFID antenna pattern is coated with a layer of solderable material that protects the copper from corroding. The solderable material has a low melting temperature so that the solderable material can be heated to form a weld joint between a chip and the solderable material without damaging the chip.

Abstract translation: 防止腐蚀并被配置为便于附接到电子芯片的RFID天线是非常有利的。 导电RFID天线图案涂覆有可焊接材料层，其保护铜不被腐蚀。 可焊接材料具有低熔融温度，使得可焊接材料可被加热以在芯片和可焊接材料之间形成焊接接头而不损坏芯片。

公开(公告)号：WO2005112591A2

公开(公告)日：2005-12-01

申请号：PCT/US2005016946

申请日：2005-05-11

Applicant: WAVEZERO INC ,  ARNOLD ROCKY R ,  MONTAUTI FABRIZIO ,  ZARGANIS JOHN C ,  BEECK GREGG

Inventor： ARNOLD ROCKY R ,  MONTAUTI FABRIZIO ,  ZARGANIS JOHN C ,  BEECK GREGG

IPC: G06K19/077 ,  H01Q1/22

CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  G06K19/0775 ,  G08B13/2417 ,  G08B13/244 ,  H01Q1/22

Abstract: The present invention provides improved RFID antennae and tags and methods of manufacturing the RFID antennas. The RFID tags of the present invention include a substrate that comprises an antenna assembly. A radiofrequency integrated circuit is in electrical communication with a portion of the antenna assembly. The RFID tag may include a structure, such as a lid element, that clamps and/or compresses the radiofrequency integrated circuit into contact with the antenna assembly, without the need for a conductive adhesive. In some embodiments, the antenna assembly is vacuum metallized or otherwise applied onto the substrate through patterned openings in a mask, such as a patterned masking cliché or a patterned polymer layer.

Abstract translation: 本发明提供了改进的RFID天线和标签以及制造RFID天线的方法。 本发明的RFID标签包括包括天线组件的基板。 射频集成电路与天线组件的一部分电连通。 RFID标签可以包括诸如盖元件的结构，其夹持和/或压缩射频集成电路与天线组件接触，而不需要导电粘合剂。 在一些实施例中，天线组件被真空金属化或以其它方式通过掩模中的图案化开口施加到基板上，例如图案化掩模底片或图案化聚合物层。

公开(公告)号：WO2007143477A3

公开(公告)日：2007-12-13

申请号：PCT/US2007/069993

申请日：2007-05-30

Applicant: WAVEZERO, INC. ,  LAKEMAN, Russell, Ernest ,  ARNOLD, Rocky, Richard

Inventor： LAKEMAN, Russell, Ernest ,  ARNOLD, Rocky, Richard

IPC: H01Q1/38 ,  G08B13/14

Abstract: An RFID antenna that is protected from corrosion and is configured for easy attachment to an electronic chip is very advantageous. The electrically conductive RFID antenna pattern (107) is coated with a layer of solderable material (110) that protects the copper from corroding. The solderable material has a low melting temperature so that the solderable material can be heated to form a weld joint (120) between a chip (115) and the solderable material without damaging the chip.

公开(公告)号：WO2004077898A3

公开(公告)日：2007-10-04

申请号：PCT/US2004005997

申请日：2004-02-26

Applicant: WAVEZERO INC ,  ZARGANIS JOHN ,  ARNOLD ROCKY R

Inventor： ZARGANIS JOHN ,  ARNOLD ROCKY R

IPC: H05K9/00 ,  H05K20060101

CPC classification number: H05K9/003 ,  H01R13/6595

Abstract: an electronic device includes a printed circuit board (14) and an EMI shield (10) that has a flange around at least a portion of a perimeter of the EMI shield. One ore more connecotrs (20) coupled to the flange remobvably contact the flange to a ground trace (12) of the printed circuit board

Abstract translation: 电子设备包括印刷电路板（14）和EMI屏蔽（10），EMI屏蔽（10）具有围绕EMI屏蔽的周边的至少一部分的凸缘。 连接到凸缘的一个或多个连接器（20）可再次接触凸缘到印刷电路板的接地迹线（12）

公开(公告)号：WO2004093505A3

公开(公告)日：2004-12-09

申请号：PCT/US2004011992

申请日：2004-04-15

Applicant: WAVEZERO INC ,  ARNOLD ROCKY R ,  ZARGANIS JOHN C ,  MONTAUTI FABRIZIO

Inventor： ARNOLD ROCKY R ,  ZARGANIS JOHN C ,  MONTAUTI FABRIZIO

IPC: H01L23/04 ,  H01L23/31 ,  H01L23/433 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/04 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K9/003 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: The present invention provide methods and devices for shielding an electronic component package. In one embodiment, an EMI shield (42) is integrally formed within the package adjacent the die (12) and grounded. The EMI shield (42) may be a metallized shaped polymer layer (34) and may be disposed fully within the package or it may extend out of the package.

Abstract translation: 本发明提供了用于屏蔽电子元件封装的方法和装置。 在一个实施例中，EMI屏蔽件（42）在邻近管芯（12）的封装内整体形成并接地。 EMI屏蔽件（42）可以是金属化成形聚合物层（34），并且可以完全布置在封装内，或者其可以延伸出封装。

公开(公告)号：WO2004093506A2

公开(公告)日：2004-10-28

申请号：PCT/US2004/012014

申请日：2004-04-15

Applicant: WAVEZERO, INC. ,  ARNOLD, Rocky, R. ,  ZARGANIS, John, C. ,  MONTAUTI, Fabrizio

Inventor： ARNOLD, Rocky, R. ,  ZARGANIS, John, C. ,  MONTAUTI, Fabrizio

IPC: H05K

CPC classification number: H01L23/04 ,  H01L21/50 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K9/003 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: The present invention provides shielded printed circuit boards and electronic devices. The printed circuit board may comprise an internal network of grounded conductive elements that are coupleable to an EMI shield that is mounted on the printed circuit board. The network of grounded conductive elements are coupleable to a grounded layer and to the EMI shield and provides improved EMI shielding through the volume of the printed circuit board below an electronic component mounted on the printed circuit board.

Abstract translation: 本发明提供屏蔽印刷电路板和电子设备。 印刷电路板可以包括可连接到安装在印刷电路板上的EMI屏蔽的接地导电元件的内部网络。 接地导电元件的网络可耦合到接地层和EMI屏蔽层，并通过安装在印刷电路板上的电子元件下面的印刷电路板的体积提供改进的EMI屏蔽。

公开(公告)号：WO2005112591A3

公开(公告)日：2005-12-01

申请号：PCT/US2005/016946

申请日：2005-05-11

Applicant: WAVEZERO, INC. ,  ARNOLD, Rocky R. ,  MONTAUTI, Fabrizio ,  ZARGANIS, John C. ,  BEECK, Gregg

Inventor： ARNOLD, Rocky R. ,  MONTAUTI, Fabrizio ,  ZARGANIS, John C. ,  BEECK, Gregg

IPC: G06K19/06

Abstract: The present invention includes an improved RFID antennae (14) and tags (18) and methods of manufacturing the RFID antennas. The RFID tags (18) of the present invention include a substrate that comprises an antenna assembly. A radiofrequency integrated circuit is in electrical communication with a portion of the antenna assembly. The RFID tag may include a structure, such as a lid element, that clamps and/or compresses the radiofrequency integrated circuit into contact with the antenna assembly, without the need for a conductive adhesive. In some embodiments, the antenna assembly is vacuum metallized or otherwise applied onto the substrate through patterned openings in a mask, such as a patterned masking cliche or a patterned polymer layer.