公开(公告)号：WO2011093617A3

公开(公告)日：2011-12-08

申请号：PCT/KR2011000423

申请日：2011-01-21

Applicant: SNU PRECISION CO LTD ,  BAK BYEONG MIN ,  GONG DOO WON ,  KWON JIN HAON ,  JUNG YONG BEOM ,  CHO WHANG SIN ,  JUNG SUNG JAE

Inventor： BAK BYEONG MIN ,  GONG DOO WON ,  KWON JIN HAON ,  JUNG YONG BEOM ,  CHO WHANG SIN ,  JUNG SUNG JAE

IPC: H01L21/205

CPC classification number: C23C14/56 ,  C23C16/4412 ,  C23C16/54

Abstract: Disclosed is a vacuum deposition apparatus, which comprises: a chamber mounted with a source for jetting an application material in the gaseous state for deposition onto a substrate; heaters formed to the inner wall of the chamber and internal parts; a pump for aspirating air out of the chamber; and a plurality of cold traps interposed between the chamber and the pump for cooling the air aspirated by the pump to remove the application material from the air. According to the vacuum deposition apparatus, it is possible to prevent direct damage to the internal parts or the inner wall of the chamber by application materials accumulated thereon. Additionally, the plurality of cold traps prevent pollution and stoppage in continuous production which allows substitution to be carried out without stoppage. Therefore, productivity may be improved compared to other equipment with similar specifications.

Abstract translation: 公开了一种真空沉积设备，其包括：腔室，其安装有用于喷射处于气态的涂覆材料以沉积到基板上的源; 形成在腔室内壁和内部部件上的加热器; 用于将空气抽出腔室的泵; 以及置于腔室和泵之间的多个冷阱，用于冷却由泵吸入的空气以从空气中除去涂敷材料。 根据该真空蒸镀装置，能够防止堆积的涂布材料直接损伤腔室内部或内壁。 此外，多个冷阱在连续生产中防止污染和停止，这允许在不停止的情况下进行替代。 因此，与具有类似规格的其他设备相比，生产率可能会提高。

公开(公告)号：WO2011043566A3

公开(公告)日：2011-11-03

申请号：PCT/KR2010006749

申请日：2010-10-04

Applicant: SNU PRECISION CO LTD ,  BAK BYEONG-MIN ,  GONG DOO WON ,  SON SUNG KWAN ,  CHO WHANG SIN ,  JUNG SUNG JAE ,  PAHK HEUI JAE

Inventor： BAK BYEONG-MIN ,  GONG DOO WON ,  SON SUNG KWAN ,  CHO WHANG SIN ,  JUNG SUNG JAE ,  PAHK HEUI JAE

IPC: H01L21/20 ,  H01L31/042

CPC classification number: H01L21/6776 ,  C23C16/4401 ,  C23C16/4411 ,  C23C16/45563 ,  C23C16/4557 ,  C23C16/54 ,  H01L21/6715

Abstract: There is provided a substrate processing apparatus and method capable of preventing the substrate from being heated and efficiently collecting residual deposition material. The substrate processing apparatus includes a chamber unit including an inner space divided into an introduction section, a film formation section, and a discharge section, at least one material injection nozzle unit disposed in the film formation section of the chamber unit to inject a deposition material to a substrate being transferred, and a cooling plate unit disposed to surround the film formation section of the chamber unit and adapted to cool inside of the film formation section. In addition, the substrate processing apparatus further includes at least one cold trap unit disposed at a lower part of the material injection nozzle unit to collect residual deposition material not deposited on the substrate but left from the whole deposition material injected from the material injection nozzle unit.

Abstract translation: 提供了能够防止基板被加热并有效地收集残留沉积材料的基板处理装置和方法。 基板处理装置包括：室单元，包括分为导入部，成膜部和排出部的内部空间;至少一个注入喷嘴单元，设置在室单元的成膜部中，以将沉积材料 到被转印的基板，以及冷却板单元，设置成围绕室单元的成膜部分并且适于在成膜部分内部冷却。 此外，基板处理装置还包括至少一个冷阱单元，其设置在材料注入喷嘴单元的下部，以收集未沉积在基板上但留在从材料注入喷嘴单元注入的整个沉积材料的残留沉积材料 。

公开(公告)号：WO2011043566A2

公开(公告)日：2011-04-14

申请号：PCT/KR2010/006749

申请日：2010-10-04

Applicant: SNU PRECISION CO., LTD ,  BAK, Byeong-Min ,  GONG, Doo Won ,  SON, Sung Kwan ,  CHO, Whang Sin ,  JUNG, Sung Jae ,  PAHK, Heui Jae

Inventor： BAK, Byeong-Min ,  GONG, Doo Won ,  SON, Sung Kwan ,  CHO, Whang Sin ,  JUNG, Sung Jae ,  PAHK, Heui Jae

IPC: H01L21/20 ,  H01L31/042

CPC classification number: H01L21/6776 ,  C23C16/4401 ,  C23C16/4411 ,  C23C16/45563 ,  C23C16/4557 ,  C23C16/54 ,  H01L21/6715

Abstract: There is provided a substrate processing apparatus and method capable of preventing the substrate from being heated and efficiently collecting residual deposition material. The substrate processing apparatus includes a chamber unit including an inner space divided into an introduction section, a film formation section, and a discharge section, at least one material injection nozzle unit disposed in the film formation section of the chamber unit to inject a deposition material to a substrate being transferred, and a cooling plate unit disposed to surround the film formation section of the chamber unit and adapted to cool inside of the film formation section. In addition, the substrate processing apparatus further includes at least one cold trap unit disposed at a lower part of the material injection nozzle unit to collect residual deposition material not deposited on the substrate but left from the whole deposition material injected from the material injection nozzle unit.

Abstract translation: 提供了能够防止衬底被加热并有效地收集残留沉积材料的衬底处理设备和方法。 该基板处理装置包括：腔室单元，其包括被分成引入部分，成膜部分和排出部分的内部空间;至少一个材料注入喷嘴单元，其设置在腔室单元的成膜部分中以注入沉积材料 与被转印的基板连接的冷却板单元，以及包围该腔室单元的成膜部并适于冷却成膜部的内部的冷却板单元。 另外，所述基板处理装置还包括至少一个冷阱单元，所述冷阱单元设置在所述材料注入喷嘴单元的下部，以收集未沉积在所述基板上但是残留在从所述材料注入喷嘴单元注入的整个沉积材料上的残余沉积材料