公开(公告)号：WO2010080778A2

公开(公告)日：2010-07-15

申请号：PCT/US2010/020180

申请日：2010-01-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  BANERJEE, Swagata, R. ,  CHATTERTON, Jacob, D. ,  JOHNSON, Justin, M. ,  MOLINET, Michael, C. ,  SAINATI, Robert, A.

Inventor： BANERJEE, Swagata, R. ,  CHATTERTON, Jacob, D. ,  JOHNSON, Justin, M. ,  MOLINET, Michael, C. ,  SAINATI, Robert, A.

IPC: G06K19/07

CPC classification number: G06K19/07749 ,  G06K19/041 ,  G06K19/07786

Abstract: One exemplary electrically conductive, RFID-enabled signage includes (1) an electrically conductive article including an opening and (2) an assembled device that is coupled to the electrically conductive article to provide RFID functionality to the electrically conductive article. One exemplary kit includes (1) an RFID IC arrangement including conductive leads adjacent to an integrated circuit; (2) an insert attached to the RFID IC arrangement; and (3) an attachment device capable of attaching the RFID IC arrangement-insert combination to an electrically conductive signage such that the RFID IC arrangement is positioned to span at least a portion of an opening in the signage and to electrically couple the integrated circuit to the electrically conductive signage. One exemplary method involves providing an assembled device including and RFID IC arrangement and an insert and coupling the assembled device with an electrically conductive signage.

Abstract translation: 一个示例性的导电的，具有RFID功能的标牌包括（1）导电制品，其包括开口和（2）组装的装置，其耦合到导电制品以向导电制品提供RFID功能。 一个示例性套件包括（1）包括与集成电路相邻的导电引线的RFID IC装置; （2）附接到RFID IC装置的插入件; 以及（3）能够将RFID IC布置插入组合附接到导电标牌的附接装置，使得RFID IC装置被定位成跨越标牌中的开口的至少一部分并将集成电路电耦合到 导电标牌。 一种示例性方法包括提供包括RFID IC装置的组装装置，以及将组装好的装置插入并连接到导电标牌上。

公开(公告)号：WO2012082300A1

公开(公告)日：2012-06-21

申请号：PCT/US2011/061188

申请日：2011-11-17

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  FREY, Matthew H. ,  ZU, Lijun ,  EGBERT, William C. ,  BANERJEE, Swagata R. ,  SAINATI, Robert A.

Inventor： FREY, Matthew H. ,  ZU, Lijun ,  EGBERT, William C. ,  BANERJEE, Swagata R. ,  SAINATI, Robert A.

IPC: H01Q7/00 ,  G06K19/077

CPC classification number: G06K19/07773 ,  C23F1/02 ,  G06K19/07783 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00

Abstract: Antennas suitable for use in RFID devices include an insulating substrate and a first conductive micropattern disposed on or in the substrate, the first conductive micropattern defining a contiguous mesh conductor. The first conductive micropattern forms an antenna responsive to at least a frequency of 915 MHz, and includes interconnected traces having a trace width in a range from 0.5 to 20 microns. Furthermore, the first conductive micropattern is characterized by an open area fraction of at least 80% or 90%. RFID devices include such an antenna and an integrated circuit configured to transmit and receive signals using the antenna. Cards, such as financial transaction cards or identification cards, include such an antenna carried by a card layer.

Abstract translation: 适用于RFID器件的天线包括绝缘衬底和设置在衬底上或衬底中的第一导电微图案，第一导电微图案限定连续的网状导体。 第一导电微图案形成响应于至少915MHz的频率的天线，并且包括具有0.5至20微米范围内的迹线宽度的互连迹线。 此外，第一导电微图案的特征在于开口面积分数为至少80％或90％。 RFID设备包括这样的天线和被配置为使用天线发射和接收信号的集成电路。 诸如金融交易卡或身份证之类的卡片包括由卡层承载的这种天线。

公开(公告)号：WO2008131243A1

公开(公告)日：2008-10-30

申请号：PCT/US2008/060853

申请日：2008-04-18

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  JESME, Ronald D., ,  SAINATI,, Robert A., ,  BANERJEE, Swagata R.,

Inventor： JESME, Ronald D., ,  SAINATI,, Robert A., ,  BANERJEE, Swagata R.,

IPC: G06K19/067 ,  G06K19/07

CPC classification number: H04Q9/00 ,  G06K19/0675 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07771 ,  G06K19/07783 ,  G06K19/07786 ,  H04Q2209/47 ,  Y10T29/49124 ,  Y10T428/24934

Abstract: The present disclosure relates to multiple embodiments of a signage (50, 100) having radio-frequency responsive features, methods of making and using the signage (50, 100), and the performance characteristics of the signage (50, 100). These embodiments include a cutout, aperture, or opening (108) in an electrically conductive element into which or adjacent to which is placed an RFID tag or chip (110).

Abstract translation: 本公开涉及具有射频响应特征的标牌（50,100）的多个实施例，制造和使用标牌（50,100）的方法以及标牌（50,100）的性能特征。 这些实施例包括导电元件中的切口，孔或开口（108），其中放置有RFID标签或芯片（110）或邻近的导电元件。

公开(公告)号：WO2010080778A3

公开(公告)日：2010-10-21

申请号：PCT/US2010020180

申请日：2010-01-06

Applicant: 3M INNOVATIVE PROPERTIES CO ,  BANERJEE SWAGATA R ,  CHATTERTON JACOB D ,  JOHNSON JUSTIN M ,  MOLINET MICHAEL C ,  SAINATI ROBERT A

Inventor： BANERJEE SWAGATA R ,  CHATTERTON JACOB D ,  JOHNSON JUSTIN M ,  MOLINET MICHAEL C ,  SAINATI ROBERT A

IPC: G06K19/07

CPC classification number: G06K19/07749 ,  G06K19/041 ,  G06K19/07786

Abstract: One exemplary electrically conductive, RFID-enabled signage includes (1) an electrically conductive article including an opening and (2) an assembled device that is coupled to the electrically conductive article to provide RFID functionality to the electrically conductive article. One exemplary kit includes (1) an RFID IC arrangement including conductive leads adjacent to an integrated circuit; (2) an insert attached to the RFID IC arrangement; and (3) an attachment device capable of attaching the RFID IC arrangement-insert combination to an electrically conductive signage such that the RFID IC arrangement is positioned to span at least a portion of an opening in the signage and to electrically couple the integrated circuit to the electrically conductive signage. One exemplary method involves providing an assembled device including and RFID IC arrangement and an insert and coupling the assembled device with an electrically conductive signage.

Abstract translation: 一个示例性的导电的，启用RFID的标牌包括（1）包括开口的导电制品和（2）联接到导电制品的组装装置，以向导电制品提供RFID功能。 一个示例性套件包括（1）包括与集成电路相邻的导电引线的RFID IC布置; （2）附接到RFID IC装置的插件; （3）能够将RFID IC排列 - 插入物组合附接到导电标牌的附着装置，使得RFID IC排列被定位成跨越标牌中的开口的至少一部分，并且将集成电路电耦合到 导电标牌。 一种示例性方法涉及提供包括RFID IC装置和插入件的组装装置，并且将组装的装置与导电标牌联接。