公开(公告)号：WO2013033381A8

公开(公告)日：2014-06-26

申请号：PCT/US2012053117

申请日：2012-08-30

Applicant: WATLOW ELECTRIC MFG ,  PTASIENSKI KEVIN ,  SMITH KEVIN ROBERT ,  SWANSON CAL THOMAS ,  SCHMIDT PHILIP STEVEN ,  NOSRATI MOHAMMAD ,  LINDLEY JACOB ,  BOLDT ALLEN NORMAN ,  ZHANG SANHONG ,  STEINHAUSER LOUIS P ,  GRIMARD DENNIS STANLEY

Inventor： PTASIENSKI KEVIN ,  SMITH KEVIN ROBERT ,  SWANSON CAL THOMAS ,  SCHMIDT PHILIP STEVEN ,  NOSRATI MOHAMMAD ,  LINDLEY JACOB ,  BOLDT ALLEN NORMAN ,  ZHANG SANHONG ,  STEINHAUSER LOUIS P ,  GRIMARD DENNIS STANLEY

IPC: H05B1/02 ,  H01L21/67 ,  H05B3/26

CPC classification number: H01L21/67103 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6833 ,  H05B1/00 ,  H05B1/02 ,  H05B1/0202 ,  H05B1/0227 ,  H05B1/0233 ,  H05B3/02 ,  H05B3/06 ,  H05B3/20 ,  H05B2203/005 ,  H05B2203/013 ,  H05B2213/03 ,  Y10T156/10

Abstract: An apparatus is provided, by way of example, a heater for use in semiconductor processing equipment that includes a base functional layer having at least one functional zone. A substrate is secured to the base functional layer, and a tuning layer is secured to the substrate opposite the base functional layer. The tuning layer includes a plurality of zones that is greater in number than the zones of the base functional layer, and the tuning layer has lower power than the base functional layer. Further, a component, such as a chuck by way of example, is secured to the tuning layer opposite the substrate. The substrate defines a thermal conductivity to dissipate a requisite amount of power from the base functional layer.

Abstract translation: 例如，提供一种用于半导体处理设备的加热器，该加热器包括具有至少一个功能区的基本功能层。 将基板固定到基底功能层，并且调谐层固定到与基底功能层相对的基板。 调谐层包括多个区域，其数量大于基底功能层的区域，并且调谐层具有比基底功能层低的功率。 此外，通过示例的方式将诸如卡盘的部件固定到与基板相对的调谐层。 衬底限定热导率以从基底功能层消散所需量的功率。

公开(公告)号：WO2013033402A1

公开(公告)日：2013-03-07

申请号：PCT/US2012053148

申请日：2012-08-30

Applicant: WATLOW ELECTRIC MFG ,  PTASIENSKI KEVIN ,  BOLDT ALLEN NORMAN ,  SMITH JANET LEA ,  SWANSON CAL THOMAS ,  NOSRATI MOHAMMAD ,  SMITH KEVIN ROBERT

Inventor： PTASIENSKI KEVIN ,  BOLDT ALLEN NORMAN ,  SMITH JANET LEA ,  SWANSON CAL THOMAS

IPC: H05B3/26 ,  H01L21/67 ,  H05B1/02

CPC classification number: H01L21/67103 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6833 ,  H05B1/00 ,  H05B1/02 ,  H05B1/0202 ,  H05B1/0227 ,  H05B1/0233 ,  H05B3/02 ,  H05B3/06 ,  H05B3/20 ,  H05B2203/005 ,  H05B2203/013 ,  H05B2213/03 ,  Y10T156/10

Abstract: Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.

Abstract translation: 提供制造加热器的方法，其通常包括形成具有介电层，第一双面粘合介电层和导电层的层压体。 接下来，在导电层中形成电路图案，然后用第二双面粘合介电层覆盖电路图案。 第二双面粘合介电层被牺牲层覆盖，然后形成加热器，加热器包括电介质层，第一双面粘合介电层，导电层和第二双面粘合介电层 层。 随后，除去牺牲层。

公开(公告)号：WO2013033394A3

公开(公告)日：2013-06-06

申请号：PCT/US2012053137

申请日：2012-08-30

Applicant: WATLOW ELECTRIC MFG ,  SMITH KEVIN ROBERT ,  PTASIENSKI KEVIN ,  DERLER RAY ALAN ,  SWANSON CAL THOMAS ,  SCHMIDT PHILIP STEVEN ,  NOSRATI MOHAMMAD ,  LINDLEY JACOB ROBERT ,  BOLDT ALLEN NORMAN ,  ZHANG SANHONG ,  STEINHAUSER LOUIS P ,  GRIMARD DENNIS STANLEY

Inventor： SMITH KEVIN ROBERT ,  PTASIENSKI KEVIN ,  DERLER RAY ALAN ,  SWANSON CAL THOMAS ,  SCHMIDT PHILIP STEVEN ,  NOSRATI MOHAMMAD ,  LINDLEY JACOB ROBERT ,  BOLDT ALLEN NORMAN ,  ZHANG SANHONG ,  STEINHAUSER LOUIS P ,  GRIMARD DENNIS STANLEY

IPC: H05B1/02 ,  H01L21/67 ,  H05B3/26

CPC classification number: H01L21/67103 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6833 ,  H05B1/00 ,  H05B1/02 ,  H05B1/0202 ,  H05B1/0227 ,  H05B1/0233 ,  H05B3/02 ,  H05B3/06 ,  H05B3/20 ,  H05B2203/005 ,  H05B2203/013 ,  H05B2213/03 ,  Y10T156/10

Abstract: An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two- phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.

Abstract translation: 提供了一种诸如加热器的装置，其包括具有至少一个流体通道的基座构件。 两相流体设置在流体通道内，两相流体的压力被控制，使得两相流体提供加热和冷却至少一个到基部构件。 调谐层被固定到基底构件上，调谐层包括多个区域。 此外，通过示例的方式将诸如卡盘的部件固定到调谐层。

公开(公告)号：WO2013033402A8

公开(公告)日：2013-03-07

申请号：PCT/US2012/053148

申请日：2012-08-30

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY ,  PTASIENSKI, Kevin ,  BOLDT, Allen, Norman ,  SMITH, Janet, Lea ,  SWANSON, Cal, Thomas ,  NOSRATI, Mohammad ,  SMITH, Kevin, Robert

Inventor： PTASIENSKI, Kevin ,  BOLDT, Allen, Norman ,  SMITH, Janet, Lea ,  SWANSON, Cal, Thomas ,  NOSRATI, Mohammad ,  SMITH, Kevin, Robert

IPC: H05B3/26 ,  H01L21/67 ,  H05B1/02

Abstract: Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.

公开(公告)号：WO2013033394A2

公开(公告)日：2013-03-07

申请号：PCT/US2012/053137

申请日：2012-08-30

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY ,  SMITH, Kevin, Robert ,  PTASIENSKI, Kevin ,  DERLER, Ray, Alan ,  SWANSON, Cal, Thomas ,  SCHMIDT, Philip, Steven ,  NOSRATI, Mohammad ,  LINDLEY, Jacob, Robert ,  BOLDT, Allen, Norman ,  ZHANG, Sanhong ,  STEINHAUSER, Louis, P ,  GRIMARD, Dennis, Stanley

Inventor： SMITH, Kevin, Robert ,  PTASIENSKI, Kevin ,  DERLER, Ray, Alan ,  SWANSON, Cal, Thomas ,  SCHMIDT, Philip, Steven ,  NOSRATI, Mohammad ,  LINDLEY, Jacob, Robert ,  BOLDT, Allen, Norman ,  ZHANG, Sanhong ,  STEINHAUSER, Louis, P ,  GRIMARD, Dennis, Stanley

IPC: H05B1/02 ,  H01L21/67 ,  H05B3/26

CPC classification number: H01L21/67103 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6833 ,  H05B1/00 ,  H05B1/02 ,  H05B1/0202 ,  H05B1/0227 ,  H05B1/0233 ,  H05B3/02 ,  H05B3/06 ,  H05B3/20 ,  H05B2203/005 ,  H05B2203/013 ,  H05B2213/03 ,  Y10T156/10

Abstract: An apparatus, such as a heater, is provided that includes a base member having at least one fluid passageway. A two-phase fluid is disposed within the fluid passageway, a pressure of the two-phase fluid being controlled such that the two- phase fluid provides at least one of heating and cooling to the base member. A tuning layer is secured to the base member, and the tuning layer includes a plurality of zones. Furthermore, a component, such as a chuck by way of example, is secured to the tuning layer.

Abstract translation: 提供了一种设备，例如加热器，其包括具有至少一个流体通道的基座构件。 两相流体设置在流体通道内，控制两相流体的压力，使得两相流体对基体构件提供加热和冷却中的至少一种。 调谐层固定到基座构件，并且调谐层包括多个区域。 此外，作为示例，诸如卡盘的部件被固定到调谐层。