公开(公告)号：WO2013033402A1

公开(公告)日：2013-03-07

申请号：PCT/US2012053148

申请日：2012-08-30

Applicant: WATLOW ELECTRIC MFG ,  PTASIENSKI KEVIN ,  BOLDT ALLEN NORMAN ,  SMITH JANET LEA ,  SWANSON CAL THOMAS ,  NOSRATI MOHAMMAD ,  SMITH KEVIN ROBERT

Inventor： PTASIENSKI KEVIN ,  BOLDT ALLEN NORMAN ,  SMITH JANET LEA ,  SWANSON CAL THOMAS

IPC: H05B3/26 ,  H01L21/67 ,  H05B1/02

CPC classification number: H01L21/67103 ,  H01L21/67098 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6833 ,  H05B1/00 ,  H05B1/02 ,  H05B1/0202 ,  H05B1/0227 ,  H05B1/0233 ,  H05B3/02 ,  H05B3/06 ,  H05B3/20 ,  H05B2203/005 ,  H05B2203/013 ,  H05B2213/03 ,  Y10T156/10

Abstract: Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.

Abstract translation: 提供制造加热器的方法，其通常包括形成具有介电层，第一双面粘合介电层和导电层的层压体。 接下来，在导电层中形成电路图案，然后用第二双面粘合介电层覆盖电路图案。 第二双面粘合介电层被牺牲层覆盖，然后形成加热器，加热器包括电介质层，第一双面粘合介电层，导电层和第二双面粘合介电层 层。 随后，除去牺牲层。

公开(公告)号：WO2013033402A8

公开(公告)日：2013-03-07

申请号：PCT/US2012/053148

申请日：2012-08-30

Applicant: WATLOW ELECTRIC MANUFACTURING COMPANY ,  PTASIENSKI, Kevin ,  BOLDT, Allen, Norman ,  SMITH, Janet, Lea ,  SWANSON, Cal, Thomas ,  NOSRATI, Mohammad ,  SMITH, Kevin, Robert

Inventor： PTASIENSKI, Kevin ,  BOLDT, Allen, Norman ,  SMITH, Janet, Lea ,  SWANSON, Cal, Thomas ,  NOSRATI, Mohammad ,  SMITH, Kevin, Robert

IPC: H05B3/26 ,  H01L21/67 ,  H05B1/02

Abstract: Methods of manufacturing a heater are provided that generally include forming a laminate having a dielectric layer, a first double-sided adhesive dielectric layer, and a conductive layer. Next, a circuit pattern is created into the conductive layer, and then the circuit pattern is covered with a second double-sided adhesive dielectric layer. The second double-sided adhesive dielectric layer is covered with a sacrificial layer, and then the heater is formed, the heater comprising the dielectric layer, the first double-sided adhesive dielectric layer, the conductive layer, and the second double-sided adhesive dielectric layer. Subsequently, the sacrificial layer is removed.