公开(公告)号：WO2004023386A1

公开(公告)日：2004-03-18

申请号：PCT/KR2003/000832

申请日：2003-04-24

Applicant: 3B SYSTEM, INC. ,  BYUN, Su-Ryong

Inventor： BYUN, Su-Ryong

IPC: G06K19/07

CPC classification number: G06K19/07769 ,  G06K19/077 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49109 ,  H01L2924/01057

Abstract: The present invention provides with a combination-type IC card, that can remove badness fundamentally and epochally and be manufactured easily and inexpensively. The combination-type IC card is characterized by comprising: a front sheet (50) and an intermediate sheet (60) each having an insertion opening (51 or 61) into which a board (12 or 32) and an IC chip (11a or 31a) are inserted, each contact terminal (72) of a loof antenna (70) being arranged so as to be in electrical contact with each of the loop antenna contact portions (16 or 36) of the board (12 or 32) when the board (12 or 32) and the IC chip (11a or 31a) are inserted into the insertion openings (51) and (61).

Abstract translation: 本发明提供一种组合型IC卡，其可以从根本上和划时代地去除不良情况并且容易且廉价地制造。 组合型IC卡的特征在于包括：前片（50）和中间片（60），每个片具有插入开口（51或61），板（12或32）和IC芯片（11a或 31a）插入时，天线（70）的每个接触端子（72）布置成与板（12或32）的每个环形天线接触部分（16或36）电接触， 板（12或32）和IC芯片（11a或31a）插入到插入开口（51）和（61）中。

公开(公告)号：WO2004040508A1

公开(公告)日：2004-05-13

申请号：PCT/KR2003/000837

申请日：2003-04-25

Applicant: 3B SYSTEM, INC. ,  CHOI, Beak-Young ,  BYUN, Su-Ryong

Inventor： CHOI, Beak-Young ,  BYUN, Su-Ryong

IPC: G06K19/077

CPC classification number: G06K19/07749 ,  G06K19/077 ,  G06K19/07769

Abstract: The present invention is to provide technology on a smart card of a combination type wherein the prior art milling process removed and a lamination process is used after connection between a chip on a COB and an antenna in order to improve physical reliability of a smart card of a combination type, thereby reducing the manufacturing cost of the smart card of a combination type and being capable of taking charge of an important role in introduction of a multiple-operation system of a smart card into a market and in market extension. The smart card according to the present invention comprises three or less lines in an antenna terminal portion as shown as reference numeral (2) in Fig. 6 so as to minimize an overlapped portion(A in Fig. 4a) between the antenna terminal portion and the COB for minimizing a value C mount.

Abstract translation: 本发明是提供一种组合型智能卡上的技术，其中在COB上的芯片与天线之间的连接之后，去除了现有技术的铣削过程并且使用层压工艺，以提高智能卡的智能卡的物理可靠性 组合型，从而降低组合型智能卡的制造成本，并且能够在将智能卡的多操作系统引入市场和市场扩展中起重要作用。 根据本发明的智能卡在图1中的附图标记（2）所示的天线端子部分中包括三条或更少线。 6，以便最小化天线端子部分和COB之间的重叠部分（图4a中的A），以使值安装最小化。