公开(公告)号：WO2012036980A3

公开(公告)日：2012-08-16

申请号：PCT/US2011050964

申请日：2011-09-09

Applicant: 3M INNOVATIVE PROPERTIES CO ,  TRIMECH TECHNOLOGY PTE LTD ,  BUSMAN STANLEY C ,  ONG CHIN TEONG ,  SIM YI LIN ,  CHAN WEE HOCK ,  CHEN XINHE ,  TOY MENG SHENG

Inventor： BUSMAN STANLEY C ,  ONG CHIN TEONG ,  SIM YI LIN ,  CHAN WEE HOCK ,  CHEN XINHE ,  TOY MENG SHENG

IPC: G02F1/1339 ,  G02F1/13

CPC classification number: B05B15/04 ,  G02F1/1303 ,  G02F1/1339 ,  G02F2202/28 ,  H05K5/02 ,  H05K13/00 ,  Y10T428/24628 ,  Y10T428/24868

Abstract: The present invention discloses a display panel substrate assembly and an apparatus and method for forming a display panel substrate assembly, wherein the substrate assembly includes a first substrate and a second substrate. At least one of the first substrate and the second substrate is optically clear. The method includes the steps of screen printing a non-sag adhesive composition onto a surface of the first substrate, bringing the non-sag adhesive composition into contact with a surface of the second substrate in an environment having a pressure of less than or equal to about 5000 pascals, and curing the non-sag adhesive composition to yield an adhesive layer. The non-sag adhesive composition is of a type which is optically clear after curing.

Abstract translation: 本发明公开了一种显示面板基板组件以及用于形成显示面板基板组件的装置和方法，其中基板组件包括第一基板和第二基板。 第一衬底和第二衬底中的至少一个是光学透明的。 该方法包括以下步骤：将非凹陷粘合剂组合物丝网印刷到第一基底的表面上，使得非下垂粘合剂组合物在压力小于或等于的条件下与第二基底的表面接触 约5000帕斯卡，并固化不起泡粘合剂组合物以产生粘合剂层。 非流挂胶粘剂组合物是固化后光学透明的类型。

公开(公告)号：WO2010114482A1

公开(公告)日：2010-10-07

申请号：PCT/SG2009/000122

申请日：2009-04-02

Applicant: TRIMECH TECHNOLOGY PTE LTD ,  WILSON, Chan, Wee, Hock

Inventor： WILSON, Chan, Wee, Hock

IPC: B23K3/02 ,  B23K3/04 ,  H05K3/34

CPC classification number: H05B3/00 ,  B29C65/224 ,  B29C65/229 ,  B29C65/38 ,  B29C66/80 ,  B29C66/81261 ,  B29C66/81812 ,  B29C66/81831 ,  B29C66/81871 ,  B29C66/8322 ,  B29C66/91212 ,  B29C66/91231 ,  B29C66/91421

Abstract: The long thermode assembly for precision thermal bonding, comprises of a heating element, a thermally stable rigid electrical insulator pressure pad held by a rigid bar, air nozzle for cooling and maintaining the overall temperature of the thermode, a tensioning mount with the tension bar to hold the heating element in place.

Abstract translation: 用于精密热粘合的长热电偶组件包括加热元件，由刚性棒保持的热稳定的刚性电绝缘体压力垫，用于冷却和保持热电偶的整体温度的空气喷嘴，具有张力杆的张紧安装 将加热元件固定到位。

公开(公告)号：WO2012036980A2

公开(公告)日：2012-03-22

申请号：PCT/US2011/050964

申请日：2011-09-09

Applicant: 3M INNOVATIVE PROPERTIES COMPANY ,  TRIMECH TECHNOLOGY PTE. LTD. ,  BUSMAN, Stanley C. ,  ONG, Chin Teong ,  SIM, Yi Lin ,  CHAN, Wee Hock ,  CHEN, Xinhe ,  TOY, Meng Sheng

Inventor： BUSMAN, Stanley C. ,  ONG, Chin Teong ,  SIM, Yi Lin ,  CHAN, Wee Hock ,  CHEN, Xinhe ,  TOY, Meng Sheng

IPC: G02F1/1339 ,  G02F1/13

CPC classification number: B05B15/70 ,  B05B12/16 ,  G02F1/1303 ,  G02F1/1339 ,  G02F2202/28 ,  H05K5/02 ,  H05K13/00 ,  Y10T428/24628 ,  Y10T428/24868

Abstract: The present invention discloses a display panel substrate assembly and an apparatus and method for forming a display panel substrate assembly, wherein the substrate assembly includes a first substrate and a second substrate. At least one of the first substrate and the second substrate is optically clear. The method includes the steps of screen printing a non-sag adhesive composition onto a surface of the first substrate, bringing the non-sag adhesive composition into contact with a surface of the second substrate in an environment having a pressure of less than or equal to about 5000 pascals, and curing the non-sag adhesive composition to yield an adhesive layer. The non-sag adhesive composition is of a type which is optically clear after curing.

Abstract translation: 本发明公开了一种显示面板基板组件以及用于形成显示面板基板组件的设备和方法，其中所述基板组件包括第一基板和第二基板。 第一基板和第二基板中的至少一个是光学透明的。 该方法包括以下步骤：将非流挂粘合剂组合物丝网印刷到第一基底的表面上，使非流挂粘合剂组合物与压力小于或等于 约5000帕斯卡，并固化非流挂粘合剂组合物以产生粘合剂层。 非流挂粘合剂组合物是固化后光学透明的类型。

公开(公告)号：WO2010114495A1

公开(公告)日：2010-10-07

申请号：PCT/SG2010/000135

申请日：2010-04-05

Applicant: TRIMECH TECHNOLOGY PTE. LTD. ,  CHAN, Wee Hock, Wilson

Inventor： CHAN, Wee Hock, Wilson

IPC: H01L21/603 ,  H05B3/06

CPC classification number: H05B3/00 ,  B29C65/224 ,  B29C65/229 ,  B29C65/38 ,  B29C66/80 ,  B29C66/81261 ,  B29C66/81812 ,  B29C66/81831 ,  B29C66/81871 ,  B29C66/8322 ,  B29C66/91212 ,  B29C66/91231 ,  B29C66/91421

Abstract: A thermode assembly comprises a heating element comprising a material having a first thermal expansion coefficient and a base comprising a material having a second thermal expansion coefficient lower than the first thermal expansion coefficient. The thermode assembly also comprises a tensioning mechanism for tensioning the heating element in contact with the base.

Abstract translation: 热电偶组件包括加热元件，其包括具有第一热膨胀系数的材料和包含具有低于第一热膨胀系数的第二热膨胀系数的材料的基体。 热电偶组件还包括用于张紧与基座接触的加热元件的张紧机构。