公开(公告)号：WO2013100336A1

公开(公告)日：2013-07-04

申请号：PCT/KR2012/008315

申请日：2012-10-12

Applicant: CHEIL INDUSTRIES INC.

Inventor： KIM, In-Chol ,  HA, Jin-Uk ,  HONG, Chang-Min

IPC: C08L5/02 ,  C08L25/12 ,  C08J5/00

CPC classification number: C08L69/00 ,  C08L55/02 ,  C08L25/12

Abstract: Disclosed is a thermoplastic resin composition that includes (A) a polycarbonate resin; (B) a graft copolymer including an aromatic vinyl compound and a vinyl cyanide compound grafted on a conjugated diene-based rubbery polymer; and (C) a copolymer of an aromatic vinyl compound and a vinyl cyanide compound, wherein the copolymer (C) of an aromatic vinyl compound and a vinyl cyanide compound includes a repeating unit derived from the vinyl cyanide compound in an amount of about 18 wt% to about 22 wt%, based on the total amount of the copolymer (C). A molded product prepared using the thermoplastic resin composition is also provided.

Abstract translation: 公开了一种热塑性树脂组合物，其包含（A）聚碳酸酯树脂; （B）接枝共轭二烯类橡胶状聚合物的接枝共聚物，包括芳族乙烯基化合物和氰化乙烯基化合物; 和（C）芳族乙烯基化合物和乙烯基氰化合物的共聚物，其中芳族乙烯基化合物和乙烯基氰化合物的共聚物（C）包含衍生自乙烯基氰化合物的重复单元，其量为约18重量％ ％至约22重量％，基于共聚物（C）的总量。 还提供了使用热塑性树脂组合物制备的模制产品。

公开(公告)号：WO2010071378A3

公开(公告)日：2010-06-24

申请号：PCT/KR2009/007584

申请日：2009-12-18

Applicant: CHEIL INDUSTRIES INC. ,  PARK, Joon Hyun ,  SON, Chang Ho ,  KIM, Dong Hee ,  PARK, Eung Seo

Inventor： PARK, Joon Hyun ,  SON, Chang Ho ,  KIM, Dong Hee ,  PARK, Eung Seo

IPC: C04B28/26 ,  C04B28/24

Abstract: The present invention provides an inorganic artificial marble having excellent impact strength and weather resistance. The inorganic artificial marble can be a substitute for natural stone and used as an exterior finishing material.

公开(公告)号：WO2010053225A1

公开(公告)日：2010-05-14

申请号：PCT/KR2008/007778

申请日：2008-12-30

Applicant: CHEIL INDUSTRIES INC. ,  KIM, Sung-Jun ,  HONG, Chang-Min

Inventor： KIM, Sung-Jun ,  HONG, Chang-Min

IPC: C08L77/00

CPC classification number: C08K7/06 ,  C08K3/08 ,  Y10T428/298

Abstract: An electrically insulating highly thermally conductive resin composition includes (A) 100 parts by weight of a polyamide-based resin, and (B) 10 to 80 parts by weight of a long metal fiber including a metal selected from the group consisting of copper, nickel, aluminum, iron, chromium, molybdenum, and alloys thereof. The electrically insulating highly thermally conductive resin composition shows high hardness and high strength as well as an excellent electrically insulating property and thermal conductivity, so as to be applicable to various molded products requiring high thermal conductivity and excellent mechanical characteristics.

Abstract translation: 电绝缘性高导热性树脂组合物包含（A）100重量份的聚酰胺类树脂，（B）10〜80重量份的长金属纤维，其包含选自铜，镍 ，铝，铁，铬，钼及其合金。 电绝缘高导热性树脂组合物显示出高硬度和高强度以及优异的电绝缘性和导热性，从而适用于需要高导热性和优异的机械特性的各种模制产品。

公开(公告)号：WO2009139535A1

公开(公告)日：2009-11-19

申请号：PCT/KR2008/007905

申请日：2008-12-31

Applicant: CHEIL INDUSTRIES INC. ,  JUNG, Hyuk-Jin ,  LIM, Jong-Cheol

Inventor： JUNG, Hyuk-Jin ,  LIM, Jong-Cheol

IPC: C08L69/00

CPC classification number: C08L69/00 ,  C08K3/22 ,  C08K9/02 ,  C08L27/12 ,  C08L67/02 ,  C08L83/04 ,  C08L2666/02

Abstract: The present invention relates to a polycarbonate resin composition having excellent light stability and dimensional stability, that includes (A) 70 to 95 parts by weight of a thermoplastic polycarbonate resin; (B) 5 to 40 parts by weight of a thermoplastic non-crystalline polyester copolymer; (C) 5 to 50 parts by weight of titanium dioxide; (D) 0.1 to 10 parts by weight of an organic siloxane copolymer; and (E) 0.05 to 5 parts by weight of a fluorinated polyolefin-based resin. The polycarbonate resin composition having excellent light stability and dimensional stability shows excellent mechanical strength without reduction of impact strength and workability, so it is applicable to molded products of LCD backlight parts requiring fine product dimensional stability and other parts requiring light stability.

Abstract translation: 本发明涉及具有优异的光稳定性和尺寸稳定性的聚碳酸酯树脂组合物，其包含（A）70至95重量份的热塑性聚碳酸酯树脂; （B）5〜40重量份的热塑性非结晶性聚酯共聚物; （C）5〜50重量份的二氧化钛; （D）0.1〜10重量份有机硅氧烷共聚物; 和（E）0.05〜5重量份的氟化聚烯烃类树脂。 具有优异的光稳定性和尺寸稳定性的聚碳酸酯树脂组合物在不降低冲击强度和加工性的情况下显示出优异的机械强度，因此适用于需要精细的产品尺寸稳定性的LCD背光部件和需要光稳定性的其它部件的成型产品。

公开(公告)号：WO2009128601A1

公开(公告)日：2009-10-22

申请号：PCT/KR2008/007838

申请日：2008-12-31

Applicant: CHEIL INDUSTRIES INC. ,  KWON, Kee Hae ,  KIM, Il Jin

Inventor： KWON, Kee Hae ,  KIM, Il Jin

IPC: C08L69/00

CPC classification number: C08L69/00 ,  C08K5/0066 ,  C08L25/02 ,  C08L33/06 ,  C08L51/04 ,  C08L55/02

Abstract: Disclosed herein is a f lame-ret ardant scratch-resistant thermoplastic resin composition comprising (A) about 20 to about 95 parts by weight of a polycarbonate resin! (B) about 1 to about 50 parts by weight of a copolymer resin comprising (Bl) about 0 to about 100 % by weight of a rubber modified vinyl graft copolymer resin and (B2) about 0 to about 100 % by weight of a vinyl copolymer resin; (C) about 1 to about 50 parts by weight of a (meth)acrylic copolymer resin with a refractive index of about 1.50 to about 1.59; and (D) about 0.1 to about 40 parts by weight of a flame retardant, per 100 parts by weight of a base resin comprising (A) + (B) + (C).

Abstract translation: 本发明公开了一种防褪色耐刮擦热塑性树脂组合物，其包含（A）约20至约95重量份的聚碳酸酯树脂！ （B）约1至约50重量份的共聚物树脂，其包含（B1）约0至约100重量％的橡胶改性的乙烯基接枝共聚物树脂和（B2）约0至约100重量％的乙烯基 共聚树脂; （C）约1至约50重量份的折射率为约1.50至约1.59的（甲基）丙烯酸共聚物树脂; 和（D）每100重量份包含（A）+（B）+（C）的基础树脂约0.1至约40重量份的阻燃剂。

公开(公告)号：WO2009091155A3

公开(公告)日：2009-07-23

申请号：PCT/KR2008/007892

申请日：2008-12-31

Applicant: CHEIL INDUSTRIES INC. ,  LEE, Byung-Choon ,  KIM, Tae-Uk ,  CHO, Jin-Kyung

Inventor： LEE, Byung-Choon ,  KIM, Tae-Uk ,  CHO, Jin-Kyung

IPC: C08L69/00

Abstract: A thermoplastic resin composition includes a polycarbonate resin, a low molecular weight polymethyl (meth)acrylate resin, and a core-shell graft copolymer, and the low molecular weight polymethyl (meth)acrylate resin has a weight average molecular weight ranging from 5000 to 30,000. The thermoplastic resin composition has excellent scratch resistance, impact resistance, and transparency, and can thereby be applied to various molded products such as external parts of electronics, external materials of a car, and the like, which simultaneously require scratch and impact resistance and transparency.

公开(公告)号：WO2009088177A3

公开(公告)日：2009-07-16

申请号：PCT/KR2008/007886

申请日：2008-12-31

Applicant: CHEIL INDUSTRIES INC. ,  KIM, Sang Kyun ,  CHO, Hyeon Mo ,  KOH, Sang Ran ,  KIM, Mi Young ,  YUN, Hui Chan ,  CHUNG, Yong Jin ,  KIM, Jong Seob

Inventor： KIM, Sang Kyun ,  CHO, Hyeon Mo ,  KOH, Sang Ran ,  KIM, Mi Young ,  YUN, Hui Chan ,  CHUNG, Yong Jin ,  KIM, Jong Seob

IPC: G03F7/11

Abstract: A silicon-based hardmask composition is provided. The hardmask composition comprises (a) an organosilane polymer and (b) a solvent. The organosilane polymer is represented by Formula 1: { (SiO 1.5 - Y-SiO 1.5 ) x (R 3 SiO 1.5 ) y (XSiO 1.5 ) z }(OH) e (OR 6 )f (1). In Formula 1, x, y and z represent the relative ratios of the repeating units (SiO 1.5 - Y-SiO 1.5 ), (R 3 SiO 1.5 ) and (XSiO 1.5 ) in the polymer and satisfy the relations 0.05 ≤ x ≤ 0.9, 0.05 ≤ y ≤ 0.9, 0 ≤ z ≤ 0.9 and x + y + z = l; e and f represent the ratios of the numbers of the terminal -OH groups and -OR groups bonded to the silicon (Si) atoms to the number of the 2x+y+z silicon (Si) atoms in the polymer, respectively, and satisfy the relations 0.03 ≤ e ≤ 0.2 and 0.03 ≤ f ≤ 0.25; X is a C 6 -C 30 functional group containing at least one substituted or unsubstituted aromatic ring; R 3 is a C 1 -C 6 alkyl group; Y is a linking group selected from the group consisting of an aromatic ring, a substituted or unsubstituted linear or branched C 1 -C 20 alkylene group, a C 1 -C 20 alkylene group containing at least one aromatic or heterocyclic ring or having at least one urea or isocyanurate group in the backbone, and a C 2 -C 20 hydrocarbon group containing at least one multiple bond; and R 6 is a C 1 -C 6 alkyl group.

公开(公告)号：WO2009084831A2

公开(公告)日：2009-07-09

申请号：PCT/KR2008/007434

申请日：2008-12-16

Applicant: CHEIL INDUSTRIES INC. ,  LEE, Young Kyun ,  LEE, Eun Jung ,  PARK, Yoon Kok

Inventor： LEE, Young Kyun ,  LEE, Eun Jung ,  PARK, Yoon Kok

IPC: C08L63/00

CPC classification number: C08G59/38 ,  C08G59/621 ,  C08K3/36 ,  C08K2201/014 ,  C08L63/00 ,  H01L2924/0002 ,  C08L2666/14 ,  H01L2924/00

Abstract: Provided is an epoxy resin composition for encapsulating a semiconductor device. The epoxy resin composition includes one or more epoxy resins, one or more curing agents, a curing accelerator and one or more inorganic fillers. A content of prismatic cristobalite as one of the inorganic fillers is in the range of 1 to 50% by weight, based on the total weight of the epoxy resin composition. The epoxy resin composition is capable of alleviating or reducing warpage of a semiconductor device having an asymmetric one-sided encapsulation structure while simultaneously providing excellent workability, flame retardancy, moldability and reliability.

Abstract translation: 提供用于封装半导体器件的环氧树脂组合物。 环氧树脂组合物包含一种或多种环氧树脂，一种或多种固化剂，固化促进剂和一种或多种无机填料。 基于环氧树脂组合物的总重量，作为无机填料之一的棱柱方石英的含量在1至50重量％的范围内。 该环氧树脂组合物能够缓解或减少具有不对称单侧封装结构的半导体器件的翘曲，同时提供优异的可加工性，阻燃性，成型性和可靠性。

公开(公告)号：WO2009069847A1

公开(公告)日：2009-06-04

申请号：PCT/KR2007/007038

申请日：2007-12-31

Applicant: CHEIL INDUSTRIES INC. ,  CHOI, Sang-Jun ,  CHO, Youn-Jin ,  SHIN, Seung-Wook ,  KIM, Hye-Won

Inventor： CHOI, Sang-Jun ,  CHO, Youn-Jin ,  SHIN, Seung-Wook ,  KIM, Hye-Won

IPC: G03F7/004

CPC classification number: G03F7/0397

Abstract: The present invention provides a first polymer including a repeating unit represented by a predetermined chemical formula, (b) a second polymer including a repeating unit represented by a predetermined chemical formula, (c) a photoacid generator (PAG), and (d) a solvent. The resist composition has excellent resistance for dry etching and excellent adhesion characteristics for an underlayer, and good lithography performance for an exposure light source having an ultrashort wavelength region.

Abstract translation: 本发明提供了包含由规定的化学式表示的重复单元的第一聚合物，（b）包含由规定的化学式表示的重复单元的第二聚合物，（c）光酸产生剂（PAG），和（d） 溶剂。 抗蚀剂组合物具有优异的干蚀刻电阻和优异的底层粘合特性，以及具有超短波长区域的曝光光源的良好光刻性能。

公开(公告)号：WO2009064133A3

公开(公告)日：2009-05-22

申请号：PCT/KR2008/006727

申请日：2008-11-14

Applicant: CHEIL INDUSTRIES INC. ,  CHANG, Young Kyu ,  BAE, Seung Yong ,  LEE, Young Sil ,  LEE, Young Hee ,  GENG, Hong Zhang

Inventor： CHANG, Young Kyu ,  BAE, Seung Yong ,  LEE, Young Sil ,  LEE, Young Hee ,  GENG, Hong Zhang

IPC: B82B3/00 ,  B32B37/00 ,  B32B7/02 ,  G02F1/133 ,  H01B5/14

Abstract: Disclosed herein is a method of fabricating a transparent conductive film, including preparing a carbon nanotube composite composition by blending a carbon nanotube in a solvent; coating the carbon nanotube composite composition on a base substrate to form a carbon nanotube composite film, and acid-treating the carbon nanotube composite film by dipping the carbon nanotube composite film in an acid solution, followed by washing the carbon nanotube composite film with distilled water and drying the washed carbon nanotube composite film to form a transparent electrode on the base substrate. The transparent conductive film is imparted with excellent conductivity, transparency and bending properties through acid treatment, so that it can be applied to touch screens and transparent electrodes of foldable flat panel displays. Further, the carbon nanotube composite conductive film has improved conductivity while maintaining transparency after acid treatment.