Abstract:
A lift pin comprises a main body and a support unit, wherein said main body is inserted into a through-hole of a susceptor on which a wafer is disposed, such that the main body is vertically movable, and wherein said support unit is coupled to the upper surface of the main body to support the wafer, and made of a material having a hardness lower than that of the wafer to protect the surface of the wafer from scratches.
Abstract:
An electrostatic chuck comprises an electrostatic layer and a heat-emitting layer. The electrostatic layer has disposed therein an electrostatic electrode which generates an electrostatic force for securing a substrate placed thereon, while also having a first heat transfer coefficient. The heat-emitting layer is disposed underneath the electrostatic layer and has disposed therein a heat-emitting electrode for heating the substrate, while also having a second heat transfer coefficient higher than the first heat transfer coefficient.