Abstract:
This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.
Abstract:
This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.
Abstract:
Resin systems comprising a crosslinkable resin, a reactive diluent, and a plurality of reactive, surface-modified nanoparticles; and gel coats including such resin systems are described. Articles having such compositions attached to a surface of a substrate, e.g., a fibrous reinforced substrate, are also described.
Abstract:
This disclosure generally relates to films capable of use in electronic device modules and to electronic device modules including such films. The disclosure also generally relates to materials for use in such films.
Abstract:
Resin systems comprising a crosslinkable resin, a reactive diluent, and a plurality of reactive, surface-modified nanoparticles; and gel coats including such resin systems are described. Articles having such compositions attached to a surface of a substrate, e.g., a fibrous reinforced substrate, are also described.