公开(公告)号：WO2013019534A3

公开(公告)日：2013-06-06

申请号：PCT/US2012048259

申请日：2012-07-26

Applicant: CREE INC ,  VILLARD RUSSEL G ,  KEENEY SHAWN ,  DESILVA NICHOLAS ,  HIGLEY ROBERT ,  MARKLE JOSHUA JOSIAH

Inventor： VILLARD RUSSEL G ,  KEENEY SHAWN ,  DESILVA NICHOLAS ,  HIGLEY ROBERT ,  MARKLE JOSHUA JOSIAH

IPC: F21V29/00 ,  F21V5/04 ,  F21V17/00

CPC classification number: F21K9/90 ,  F21K9/23 ,  F21V3/02 ,  F21V23/002 ,  F21V23/006 ,  F21V29/80 ,  F21W2121/00 ,  F21Y2115/10 ,  Y10T29/49002

Abstract: Light-emitting die (LED) Lamps, heat sinks, and related methods are provided. An LED lamp can include a mounting substrate having a top surface, a bottom surface and side edges. An LED package can be disposed on the top surface of the mounting substrate with the LED package comprising an LED chip. The LED lamp can include a heat sink that can include a heat sink base and a spacer extending upward from the base. The spacer can have a mounting area or pad distal from the heat sink base on which the bottom surface of the mounting substrate is disposed. The spacer can also have a width that is less than a width between the side edges of the mounting substrate. The LED lamp can further include a lens disposed over the LED package and the mounting substrate.

Abstract translation: 发光模（LED）提供灯，散热器和相关方法。 LED灯可以包括具有顶面，底面和侧边的安装基板。 LED封装可以设置在安装衬底的顶表面上，其中LED封装包括LED芯片。 LED灯可以包括散热器，散热器可以包括散热器基座和从基座向上延伸的隔离物。 间隔件可以具有远离散热器基座的安装区域或垫，安装基板的底表面布置在散热器基座上。 隔离物的宽度也可以小于安装基底的侧边之间的宽度。 LED灯还可以包括设置在LED封装和安装衬底上的透镜。

公开(公告)号：WO2013019534A2

公开(公告)日：2013-02-07

申请号：PCT/US2012/048259

申请日：2012-07-26

Applicant: CREE, INC. ,  VILLARD, Russel, G. ,  KEENEY, Shawn ,  DESILVA, Nicholas ,  HIGLEY, Robert ,  MARKLE, Joshua, Josiah

Inventor： VILLARD, Russel, G. ,  KEENEY, Shawn ,  DESILVA, Nicholas ,  HIGLEY, Robert ,  MARKLE, Joshua, Josiah

IPC: F21V29/00 ,  F21V5/04 ,  F21V17/00

CPC classification number: F21K9/90 ,  F21K9/23 ,  F21V3/02 ,  F21V23/002 ,  F21V23/006 ,  F21V29/80 ,  F21W2121/00 ,  F21Y2115/10 ,  Y10T29/49002

Abstract: Light-emitting die (LED) Lamps, heat sinks, and related methods are provided. An LED lamp can include a mounting substrate having a top surface, a bottom surface and side edges. An LED package can be disposed on the top surface of the mounting substrate with the LED package comprising an LED chip. The LED lamp can include a heat sink that can include a heat sink base and a spacer extending upward from the base. The spacer can have a mounting area or pad distal from the heat sink base on which the bottom surface of the mounting substrate is disposed. The spacer can also have a width that is less than a width between the side edges of the mounting substrate. The LED lamp can further include a lens disposed over the LED package and the mounting substrate.

Abstract translation: 提供发光模具（LED）灯，散热器和相关方法。 LED灯可以包括具有顶表面，底表面和侧边缘的安装基板。 LED封装可以设置在安装基板的顶表面上，LED封装包括LED芯片。 LED灯可以包括散热器，其可以包括散热器基座和从基座向上延伸的间隔件。 间隔件可以具有远离散热器基座的安装区域或垫，安装基板的底表面设置在该散热器基座上。 间隔件还可以具有小于安装基板的侧边缘之间的宽度的宽度。 LED灯还可以包括设置在LED封装和安装基板上的透镜。