Abstract:
The present invention provides a clamp with spring contact elements to receive and secure a flat flex cable with exposed electrical traces to an electrical circuit such as on a printed circuit board. The clamp of the present invention has features for enhanced registration and alignment of exposed electrical traces on the flat flex cable to the spring contact elements in the clamp. Another aspect of the invention is the ability to connect high density contact arrays within the clamp to a circuit board via an array of contact pads on the opposite side of the substrate on which the spring contact elements are disposed. One exemplary application of the present invention is to connect a camera module in a cell phone to a printed circuit board or like electrical device in the phone.
Abstract:
The present invention provides a clamp with spring contact elements to receive and secure a flat flex cable with exposed electrical traces to an electrical circuit such as on a printed circuit board. The clamp of the present invention has features for enhanced registration and alignment of exposed electrical traces on the flat flex cable to the spring contact elements in the clamp. Another aspect of the invention is the ability to connect high density contact arrays within the clamp to a circuit board via an array of contact pads on the opposite side of the substrate on which the spring contact elements are disposed. One exemplary application of the present invention is to connect a camera module in a cell phone to a printed circuit board or like electrical device in the phone.