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公开(公告)号：WO2005049274B1
公开(公告)日：2005-12-29
申请号：PCT/US2004038083
申请日：2004-11-12
Applicant: APPLIED MATERIALS INC , CHEN HUNG CHIH , ZUNIGA STEVEN M , GARRETSON CHARLES C , MCALLISTER DOUGLAS R , MEYER STACY , LIN JIAN , HUEY SIDNEY P , OH JEONGHOON , DOAN TRUNG T , SCHMIDT JEFFREY , WOHLERT MARTIN S , HUGHES KERRY F , WANG JAMES C , LU DANNY CAM TOAN , DELAMENIE ROMAIN BEAU , BALAGANI VENKATA R , ALLEN ADEN MARTIN , FONG MICHAEL JON
Inventor： CHEN HUNG CHIH , ZUNIGA STEVEN M , GARRETSON CHARLES C , MCALLISTER DOUGLAS R , MEYER STACY , LIN JIAN , HUEY SIDNEY P , OH JEONGHOON , DOAN TRUNG T , SCHMIDT JEFFREY , WOHLERT MARTIN S , HUGHES KERRY F , WANG JAMES C , LU DANNY CAM TOAN , DELAMENIE ROMAIN BEAU , BALAGANI VENKATA R , ALLEN ADEN MARTIN , FONG MICHAEL JON
CPC classification number: B24B37/32 , Y10T29/49815
Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portion. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
Abstract translation: 保持环可通过机加工或研磨环的底表面而成形，以在底表面中形成成形轮廓。 保持环的底表面可以包括平坦的，倾斜的和弯曲的部分。 研磨可以使用专门用于研磨扣环底面的机器进行。 在研磨过程中，环可以被允许围绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。
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公开(公告)号：WO2005049274A2
公开(公告)日：2005-06-02
申请号：PCT/US2004/038083
申请日：2004-11-12
Applicant: APPLIED MATERIALS, INC. , CHEN, Hung, Chih , ZUNIGA, Steven, M. , GARRETSON, Charles, C. , MCALLISTER, Douglas, R. , MEYER, Stacy , LIN, Jian , HUEY, Sidney, P. , OH, Jeonghoon , DOAN, Trung, T. , SCHMIDT, Jeffrey , WOHLERT, Martin, S. , HUGHES, Kerry, F. , WANG, James, C. , LU, Danny, Cam, Toan , DELAMENIE, Romain, Beau , BALAGANI, Venkata, R. , ALLEN, Aden, Martin , FONG, Michael, Jon
Inventor： CHEN, Hung, Chih , ZUNIGA, Steven, M. , GARRETSON, Charles, C. , MCALLISTER, Douglas, R. , MEYER, Stacy , LIN, Jian , HUEY, Sidney, P. , OH, Jeonghoon , DOAN, Trung, T. , SCHMIDT, Jeffrey , WOHLERT, Martin, S. , HUGHES, Kerry, F. , WANG, James, C. , LU, Danny, Cam, Toan , DELAMENIE, Romain, Beau , BALAGANI, Venkata, R. , ALLEN, Aden, Martin , FONG, Michael, Jon
IPC: B24B37/04
CPC classification number: B24B37/32 , Y10T29/49815
Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portion. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
Abstract translation: 保持环可以通过机械加工或研磨环的底部表面而在底面形成成形轮廓。 保持环的底面可以包括平坦的，倾斜的和弯曲的部分。 可以使用专用于研磨保持环底面的机器进行研磨。 在研磨期间，可以允许环围绕环的轴线自由旋转。 保持环的底面可以具有弯曲或平坦的部分。
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公开(公告)号：WO2005049274A3
公开(公告)日：2005-11-03
申请号：PCT/US2004038083
申请日：2004-11-12
Applicant: APPLIED MATERIALS INC , CHEN HUNG CHIH , ZUNIGA STEVEN M , GARRETSON CHARLES C , MCALLISTER DOUGLAS R , MEYER STACY , LIN JIAN , HUEY SIDNEY P , OH JEONGHOON , DOAN TRUNG T , SCHMIDT JEFFREY , WOHLERT MARTIN S , HUGHES KERRY F , WANG JAMES C , LU DANNY CAM TOAN , DELAMENIE ROMAIN BEAU , BALAGANI VENKATA R , ALLEN ADEN MARTIN , FONG MICHAEL JON
Inventor： CHEN HUNG CHIH , ZUNIGA STEVEN M , GARRETSON CHARLES C , MCALLISTER DOUGLAS R , MEYER STACY , LIN JIAN , HUEY SIDNEY P , OH JEONGHOON , DOAN TRUNG T , SCHMIDT JEFFREY , WOHLERT MARTIN S , HUGHES KERRY F , WANG JAMES C , LU DANNY CAM TOAN , DELAMENIE ROMAIN BEAU , BALAGANI VENKATA R , ALLEN ADEN MARTIN , FONG MICHAEL JON
CPC classification number: B24B37/32 , Y10T29/49815
Abstract: A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portion. The lapping can be performed using a machine that dedicated for use in lapping the bottom surface of retaining rings. During the lapping the ring can be permitted to rotate freely about an axis of the ring. The bottom surface of the retaining ring can have curved or flat portions.
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