公开(公告)号：WO2023084020A1

公开(公告)日：2023-05-19

申请号：PCT/EP2022/081616

申请日：2022-11-11

申请人： FRISENSE LIMITED

发明人： MAZZA, Marco

IPC分类号： G06K7/10 ,  H01Q1/22

摘要： A resonator for a radio frequency identification reader is provided. The resonator comprises: a waveguide closed at a proximal end and closed at a distal end and dimensioned to facilitate resonance in radio frequency waves having a frequency of operation so that the radio frequency waves produce an electric field in the waveguide having a peak intensity at a location between the proximal end and the distal end; a holder for holding one or more radio frequency identification tags at the location at which the electric field produced by radio frequency waves having the frequency of operation has a peak intensity; and a radio frequency feed point for coupling radio frequency signals between the waveguide and radio frequency identification reader circuitry.

公开(公告)号：WO2022013526A1

公开(公告)日：2022-01-20

申请号：PCT/GB2021/051748

申请日：2021-07-08

申请人： FRISENSE LIMITED

发明人： MAZZA, Marco

IPC分类号： G06K19/077

摘要： A capacitive coupled radio frequency identification, RFID, tag and method for reading the tag, the tag comprising a semiconductor substrate having a first planar surface and a second planar surface distal from the first planar surface. A metallic pad formed on the first planar surface of the semiconductor substrate. A circuit formed on the semiconductor substrate and electrically connected to the metallic pad and the second planar surface of the semiconductor substrate, the circuit configured to respond to a radio frequency, RF, input signal by providing a data signal encoded by varying an impedance between the metallic pad and the second planar surface of the semiconductor substrate, wherein the metallic pad formed on the first planar surface extends beyond the semiconductor substrate. Wherein the metallic pad is rectangular, elongate or T-shaped, and/or the capacitive coupled RFID tag further comprises a metal electrode in electrical contact with the second planar surface.

公开(公告)号：WO2022254222A1

公开(公告)日：2022-12-08

申请号：PCT/GB2022/051406

申请日：2022-06-01

申请人： FRISENSE LIMITED

发明人： MAZZA, Marco ,  BOYLAN, Peter

IPC分类号： G06K19/077 ,  G06K7/00 ,  G06K19/07 ,  G06K19/00

摘要： A capacitive coupled, CC, radio frequency identification, RFID, tag reader comprising a power source. An electronic circuit configured to receive electrical power from the power source, generate a radio frequency, RF, signal and provide the RF signal to an interface and having a decoder configured to decode a data signal received at the interface. An electrode pair coupled to the interface of the electronic circuit, the electrode pair comprising a first electrode and a second electrode surrounding the first electrode. There is also provided a capacitive coupled, CC, radio frequency identification, RFID, tag reader comprising a power source. An electronic circuit configured to receive electrical power from the power source, generate a radio frequency, RF, signal and provide the RF signal to an interface and having a decoder configured to decode a data signal received at the interface. A case enclosing the electronic circuit. a first connector in electrical connection with the interface and providing an electrical connection through the case.

公开(公告)号：WO2020148550A1

公开(公告)日：2020-07-23

申请号：PCT/GB2020/050099

申请日：2020-01-17

申请人： FRISENSE LIMITED

发明人： MAZZA, Marco

IPC分类号： G06K7/08 ,  G06K19/077

摘要： A capacitive coupled radio frequency identification, RFID, tag and method for reading the tag, the tag comprising a semiconductor substrate having a first planar surface and a second planar surface distal from the first planar surface. A metallic pad formed on the first planar surface of the semiconductor substrate. A circuit formed on the semiconductor substrate and electrically connected to the metallic pad and the second planar surface of the semiconductor substrate, the circuit configured to respond to a radio frequency, RF, input signal by providing a data signal encoded by varying an impedance between the metallic pad and the second planar surface of the semiconductor substrate.