公开(公告)号：WO2003075189A3

公开(公告)日：2003-09-12

申请号：PCT/IB2003/000819

申请日：2003-03-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  IBM (SCHWEIZ) ,  ALON, Amir ,  GOREN, David ,  GORDIN, Rachel ,  LIVSHITZ, Betty ,  SHERMAN, Anatoly ,  ZELIKSON, Michael

Inventor： ALON, Amir ,  GOREN, David ,  GORDIN, Rachel ,  LIVSHITZ, Betty ,  SHERMAN, Anatoly ,  ZELIKSON, Michael

IPC: G06F17/50

Abstract: An integrated circuit design kit including one or more circuit components topologies, and one or more critical interconnect lines topologies. The interconnect line topologies may be predefined. The kit may further include one or more circuit components models and one or more critical interconnect lines models.

公开(公告)号：WO2003075189A2

公开(公告)日：2003-09-12

申请号：PCT/IB2003/000819

申请日：2003-03-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION ,  IBM (SCHWEIZ) ,  ALON, Amir ,  GOREN, David ,  GORDIN, Rachel ,  LIVSHITZ, Betty ,  SHERMAN, Anatoly ,  ZELIKSON, Michael

Inventor： ALON, Amir ,  GOREN, David ,  GORDIN, Rachel ,  LIVSHITZ, Betty ,  SHERMAN, Anatoly ,  ZELIKSON, Michael

IPC: G06F17/50

CPC classification number: G06F17/5068 ,  G06F17/5036 ,  G06F17/5045

Abstract: An integrated circuit design kit including one or more circuit components topologies, and one or more critical interconnect lines topologies. The interconnect line topologies may be predefined. The kit may further include one or more circuit components models and one or more critical interconnect lines models.

Abstract translation: 集成电路设计套件包括一个或多个电路组件拓扑，以及一个或多个关键互连线拓扑。 可以预定义互连线拓扑。 该套件还可以包括一个或多个电路组件模型和一个或多个关键互连线模型。