Abstract:
A memory array is provided having a memory cell (40) coupled to a read word line and a write word line of the memory array and peripheral circuits for reading and writing to the memory cell. The memory cell comprises a storage element (42) for storing a logical state of the memory cell powered at a reduced voltage during at least one functional operation and a write access circuit configured to connect the storage element to at least a first write bit line (44) in the memory array in response to a write signal on the write word line for writing the logical state to the memory cell. The memory cell further comprises a read access circuit including an input node connected to the storage element and an output node connected to a read bit line of the memory array. The read access circuit is enabled and configured to read the logic state of the storage element in response to a read signal on the read word line. The reduced voltage is a voltage that is reduced relative to a peripheral operating voltage of at least one peripheral circuit associated with reading and/or writing of the memory cell.
Abstract:
The invention (100) provides a tunable voltage controller for use with a sub-circuit (105). In one embodiment, the tunable voltage controller (115) includes a diode-connected MOS transistor contained in a doped well of a substrate and configured to provide a voltage for the sub-circuit. Additionally, the tunable voltage controller also includes a biasing unit (120) configured to adjust the voltage by selectively connecting the doped well to one of a plurality of voltage sources or to a variable voltage source.
Abstract:
The invention (100) provides a tunable voltage controller for use with a sub-circuit (105). In one embodiment, the tunable voltage controller (115) includes a diode-connected MOS transistor contained in a doped well of a substrate and configured to provide a voltage for the sub-circuit. Additionally, the tunable voltage controller also includes a biasing unit (120) configured to adjust the voltage by selectively connecting the doped well to one of a plurality of voltage sources or to a variable voltage source.
Abstract:
A method of placing a cell in an array is disclosed. The method includes placing the cell a plurality of times (600, 602, 604) in a first array. The cell is also placed a plurality of times (606, 608, 610) in a second array. The second array is placed adjacent and offset from the first array by an offset distance (O 2 ).
Abstract:
An integrated circuit (IC) (200) includes at least one memory array having a plurality of memory cells (240) arranged in a plurality of rows and columns, the array also having a plurality of word lines for accessing rows of cells and a plurality bit lines for accessing columns of cells. A voltage differential generating circuit (230) is operable to provide a differential wordline voltage (VWL) relative to an array supply voltage, wherein the differential is a function of the array supply voltage.
Abstract:
A method of fabricating an SRAM cell with reduced leakage is disclosed. The method comprises fabricating asymmetrical transistors in the SRAM cell. The transistors are asymmetrical in a manner that reduces the drain leakage current of the transistors. The fabrication of asymmetrical pass transistors comprises forming a dielectric region (516) on a surface of a substrate having a first conductivity type. A gate region (500) having a length and a width is formed on the dielectric region. Source and drain extension regions (506, 510) having a second conductivity type are formed in the substrate on opposite sides of the gate region. A first pocket impurity region (508) having a first concentration and the first conductivity type is formed adjacent the source. A second pocket impurity region having a second concentration and the first conductivity type may be formed adjacent the drain. If formed, the second concentration is smaller than the first concentration, reducing the gate induced drain leakage current.
Abstract:
The invention provides circuitry for writing to and reading from an SRAM cell core (105), an SRAM cell (100), and an SRAM device. In one aspect, the circuitry includes a write circuit coupled to the SRAM cell core that includes at least one write transistor (150). The circuitry also includes a read circuit coupled to the SRAM cell core that includes at least one read transistor (185) having a gate signal in common with the gate signal of the write transistor. The read transistor and the write transistor share a common gate signal, and each have an electrical characteristic, for which the electrical characteristic of the read transistor differs from that of the write transistor.
Abstract:
The invention provides circuitry for writing to and reading from an SRAM cell core (105), an SRAM cell (100), and an SRAM device. In one aspect, the circuitry includes a write circuit coupled to the SRAM cell core that includes at least one write transistor (150). The circuitry also includes a read circuit coupled to the SRAM cell core that includes at least one read transistor (185) having a gate signal in common with the gate signal of the write transistor. The read transistor and the write transistor share a common gate signal, and each have an electrical characteristic, for which the electrical characteristic of the read transistor differs from that of the write transistor.
Abstract:
A memory array is provided having a memory cell (40) coupled to a read word line and a write word line of the memory array and peripheral circuits for reading and writing to the memory cell. The memory cell comprises a storage element (42) for storing a logical state of the memory cell powered at a reduced voltage during at least one functional operation and a write access circuit configured to connect the storage element to at least a first write bit line (44) in the memory array in response to a write signal on the write word line for writing the logical state to the memory cell. The memory cell further comprises a read access circuit including an input node connected to the storage element and an output node connected to a read bit line of the memory array. The read access circuit is enabled and configured to read the logic state of the storage element in response to a read signal on the read word line. The reduced voltage is a voltage that is reduced relative to a peripheral operating voltage of at least one peripheral circuit associated with reading and/or writing of the memory cell.
Abstract:
A method of fabricating an SRAM cell with reduced leakage is disclosed. The method comprises fabricating asymmetrical transistors in the SRAM cell. The transistors are asymmetrical in a manner that reduces the drain leakage current of the transistors. The fabrication of asymmetrical pass transistors comprises forming a dielectric region (516) on a surface of a substrate having a first conductivity type. A gate region (500) having a length and a width is formed on the dielectric region. Source and drain extension regions (506, 510) having a second conductivity type are formed in the substrate on opposite sides of the gate region. A first pocket impurity region (508) having a first concentration and the first conductivity type is formed adjacent the source. A second pocket impurity region having a second concentration and the first conductivity type may be formed adjacent the drain. If formed, the second concentration is smaller than the first concentration, reducing the gate induced drain leakage current.