公开(公告)号：WO2012151079A2

公开(公告)日：2012-11-08

申请号：PCT/US2012/034725

申请日：2012-04-23

Applicant: CAREFUSION 303, INC. ,  NICOL, David H. ,  JOYCE, Michael Dugan ,  BURGESS, Brendan

Inventor： NICOL, David H. ,  JOYCE, Michael Dugan ,  BURGESS, Brendan

IPC: H05K7/20 ,  H05K9/00 ,  G06F1/20

CPC classification number: G06F1/20 ,  G06F1/182 ,  G06F19/00 ,  G06F19/3456 ,  H05K7/20127 ,  H05K7/20336 ,  H05K7/2039 ,  H05K9/0041 ,  Y10T29/49117

Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.

Abstract translation: 公开了一种电子外壳，其提供电子部件的被动冷却，同时减少电磁干扰（EMI）发射。 电子外壳包括具有至少一个电子部件和耦合到电子组件的散热器的电子组件。 散热器具有基座部分，其构造成当散热器耦合到电子组件时热耦合到至少一个电子部件。 电子外壳还包括形成围绕电子组件的封闭容积的导电外壳。 所述外壳具有构造成围绕所述散热器和至少一个第二开口配合的第一开口。 从体积到外部环境的所有非导电通道具有至少一个横截面开口，该截面开口具有连续的导电周边，在确定的最大屏蔽频率的小于四分之一波长的开口内具有最大线性长度。

公开(公告)号：WO2012151078A2

公开(公告)日：2012-11-08

申请号：PCT/US2012/034722

申请日：2012-04-23

Applicant: CAREFUSION 303, INC. ,  NICOL, David H. ,  JOYCE, Michael Dugan ,  BURGESS, Brendan

Inventor： NICOL, David H. ,  JOYCE, Michael Dugan ,  BURGESS, Brendan

IPC: H05K9/00 ,  G06F1/16

CPC classification number: H05K9/0054

Abstract: A modular electronics enclosure for reducing electromagnetic interference (EMI) is disclosed. The electronics assembly includes a first electronic component having an output, a second electronic component having an input with an input impedance, and a circuit matching element having an input coupled to the output of the first electronic component and an output coupled to the input of the second electronic component. The output of the circuit matching element has an output impedance that matches the input impedance of the second electronic component. The electronics assembly also includes a conductive surface that forms a volume that encloses the first electronic component and the circuit matching element. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency.

Abstract translation: 公开了一种用于降低电磁干扰（EMI）的模块化电子机箱。 电子组件包括具有输出的第一电子元件，具有输入阻抗的输入的第二电子元件和具有耦合到第一电子元件的输出的输入的电路匹配元件和耦合到第一电子元件的输入的输出 第二电子元件。 电路匹配元件的输出具有与第二电子元件的输入阻抗匹配的输出阻抗。 电子组件还包括形成包围第一电子部件和电路匹配元件的体积的导电表面。 从体积到外部环境的所有非导电通道具有至少一个横截面开口，该截面开口具有连续的导电周边，在开口内的最大线性长度小于最大屏蔽频率的四分之一波长。

公开(公告)号：WO2012151079A3

公开(公告)日：2013-01-10

申请号：PCT/US2012034725

申请日：2012-04-23

Applicant: CAREFUSION 303 INC ,  NICOL DAVID H ,  JOYCE MICHAEL DUGAN ,  BURGESS BRENDAN

Inventor： NICOL DAVID H ,  JOYCE MICHAEL DUGAN ,  BURGESS BRENDAN

IPC: H05K7/20 ,  G06F1/20 ,  H05K9/00

CPC classification number: G06F1/20 ,  G06F1/1601 ,  G06F1/182 ,  G06F19/3456 ,  H05K7/20127 ,  H05K7/20336 ,  H05K7/2039 ,  H05K9/0041 ,  Y10T29/49117

Abstract: An electronics enclosure is disclosed that provides passive cooling of electronic components while reducing electromagnetic interference (EMI) emissions. The electronics enclosure includes an electronics assembly with at least one electronic component and a heat sink coupled to the electronics assembly. The heat sink has a base portion configured to thermally couple to the at least one electronic component when the heat sink is coupled to the electronic assembly. The electronics enclosure also includes a conductive enclosure forming an enclosed volume around the electronics assembly. The enclosure has a first opening configured to fit around the heat sink and at least one second opening. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a determined maximum shielding frequency.

Abstract translation: 公开了一种电子外壳，其提供电子部件的被动冷却，同时减少电磁干扰（EMI）发射。 电子外壳包括具有至少一个电子部件和耦合到电子组件的散热器的电子组件。 散热器具有基座部分，其构造成当散热器耦合到电子组件时热耦合到至少一个电子部件。 电子外壳还包括形成围绕电子组件的封闭容积的导电外壳。 外壳具有构造成围绕散热器和至少一个第二开口配合的第一开口。 从体积到外部环境的所有非导电通道具有至少一个横截面开口，该截面开口具有连续的导电周界，在确定的最大屏蔽频率的小于四分之一波长的开口内具有最大线性长度。

公开(公告)号：WO2012151078A3

公开(公告)日：2013-01-10

申请号：PCT/US2012034722

申请日：2012-04-23

Applicant: CAREFUSION 303 INC ,  NICOL DAVID H ,  JOYCE MICHAEL DUGAN ,  BURGESS BRENDAN

Inventor： NICOL DAVID H ,  JOYCE MICHAEL DUGAN ,  BURGESS BRENDAN

IPC: H05K9/00 ,  G06F1/16

CPC classification number: H05K9/0054

Abstract: A modular electronics enclosure for reducing electromagnetic interference (EMI) is disclosed. The electronics assembly includes a first electronic component having an output, a second electronic component having an input with an input impedance, and a circuit matching element having an input coupled to the output of the first electronic component and an output coupled to the input of the second electronic component. The output of the circuit matching element has an output impedance that matches the input impedance of the second electronic component. The electronics assembly also includes a conductive surface that forms a volume that encloses the first electronic component and the circuit matching element. All non-conductive passages from the volume to the external environment have at least one cross-sectional opening having a continuous conductive perimeter with a maximum linear length within the opening of less than one quarter wavelength of a maximum shielding frequency.

Abstract translation: 公开了一种用于降低电磁干扰（EMI）的模块化电子机箱。 电子组件包括具有输出的第一电子元件，具有输入阻抗的输入的第二电子元件和具有耦合到第一电子元件的输出的输入的电路匹配元件和耦合到第一电子元件的输入的输出 第二电子元件。 电路匹配元件的输出具有与第二电子元件的输入阻抗匹配的输出阻抗。 电子组件还包括形成包围第一电子部件和电路匹配元件的体积的导电表面。 从体积到外部环境的所有非导电通道具有至少一个横截面开口，该截面开口具有连续的导电周边，在开口内的最大线性长度小于最大屏蔽频率的四分之一波长。