公开(公告)号：WO2010080331A2

公开(公告)日：2010-07-15

申请号：PCT/US2009/067594

申请日：2009-12-10

Applicant: LAM RESEARCH CORPOTATION ,  NORKUS, Eugenijus ,  JACIAUSKIENE, Jane ,  DORDI, Yezdi

Inventor： NORKUS, Eugenijus ,  JACIAUSKIENE, Jane ,  DORDI, Yezdi

IPC: H01L21/208 ,  H01L21/28

CPC classification number: C23C18/40 ,  C23C18/48

Abstract: A non-aqueous electroless copper plating solution that includes an anhydrous copper salt component, an anhydrous cobalt salt component, a non-aqueous complexing agent, and a non-aqueous solvent is provided.

Abstract translation: 提供了包含无水铜盐组分，无水钴盐组分，非水络合剂和非水溶剂的非水无电铜电镀溶液。

公开(公告)号：WO2010022004A1

公开(公告)日：2010-02-25

申请号：PCT/US2009/054086

申请日：2009-08-17

Applicant: LAM RESEARCH CORPOTATION ,  MAGNI, Enrico ,  MARTIN, Russell

Inventor： MAGNI, Enrico ,  MARTIN, Russell

IPC: B01D19/00

CPC classification number: H01L21/67051 ,  H01L21/6708

Abstract: In an example embodiment, a top proximity head for depositing fluids on a semiconductor wafer includes a delivery bore which receives fluid. The top proximity head includes a plenum that is connected to the delivery bore by numerous input channels into which fluid flows from the delivery bore. Each input channel has an inverted V-shaped opening which urges the upward flow of any air bubbles. From the plenum, the fluid flows through output channels out of the top proximity head to form a meniscus. The fluid is suctioned from the meniscus back into the top proximity head through return channels that lead to a return bore. A passage connects the delivery bore with the return bore, allowing air bubbles to escape from the delivery bore into the return bore. The passage allows a negligible amount of fluid to flow directly between the two bores rather than through the plenum.

Abstract translation: 在示例性实施例中，用于在半导体晶片上沉积流体的顶部邻近头部包括接收流体的输送孔。 顶部邻近头包括通过多个输入通道连接到输送孔的增压室，流体从输送孔流入该通道。 每个输入通道具有倒V形开口，其推动任何气泡向上流动。 从气室，流体通过输出通道流出顶部邻近头部以形成弯液面。 流体通过返回通道返回通孔，从弯液面吸入顶部邻近头部。 通道将输送孔与回流孔连接，允许气泡从输送孔逸出到回流孔中。 该通道允许可忽略量的流体直接在两个孔之间流动，而不是通过气室。