公开(公告)号：WO2008048259A3

公开(公告)日：2009-04-23

申请号：PCT/US2006040732

申请日：2006-10-16

Applicant: MATERIALS AND TECHNOLOGIES COR ,  FUENTES RICRDO I

Inventor： FUENTES RICRDO I

IPC: B05D1/28 ,  B05C13/02 ,  B05D5/12 ,  B08B3/00 ,  B08B3/10 ,  G03D3/02 ,  H01L21/677

CPC classification number: H01L21/67086 ,  C23C18/161 ,  C25D5/02 ,  H01L21/67057 ,  H01L21/6715 ,  Y10S134/902

Abstract: A wet processing apparatus and method that takes advantage of a fluid meniscus to process at least a portion of a surface of an object. After one surface of the object has been processed another side or surface of the object can be similarly processed. This processing can be coating, etching, plating, to name a few. An application of the apparatus and method is in the semiconductor processing industry, especially, the processing of wafers and substrates. The method and apparatus also allows the processing of multiple surfaces of an electronic component.

Abstract translation: 利用流体弯液面处理物体表面的至少一部分的湿法处理设备和方法。 在处理对象的一个​​表面之后，可以类似地处理对象的另一面或表面。 这种处理可以是涂层，蚀刻，电镀等等。 该设备和方法的应用是在半导体加工行业中，特别是晶片和基板的加工。 该方法和装置还允许处理电子部件的多个表面。

公开(公告)号：WO2007062199A3

公开(公告)日：2007-12-27

申请号：PCT/US2006045353

申请日：2006-11-22

Applicant: MATERIALS AND TECHNOLOGIES COR ,  FUENTES RICARDO I

Inventor： FUENTES RICARDO I

IPC: H01L21/67

CPC classification number: H01L21/68728 ,  H01L21/67023

Abstract: A device and method for holding a substrate, e.g., a semiconductor wafer, during a process, e.g., a liquid meniscus process, the substrate having a first side and a second side. The device includes one or more holding components, e.g., fingers, configured to contact a second side of the substrate without significantly contacting the first side of the substrate. At least one of the holding components may be configured to be moved during the process so as to prevent the at least one holding components from effecting the process, e.g., contacting the liquid meniscus. Such an arrangement may be employed when the substrate includes a top side having at least one structure or feature thereon, it being desirable that the holding components avoid contact with the structures or features during the process.

Abstract translation: 一种用于在例如液体弯液面过程的过程中保持衬底（例如半导体晶片）的装置和方法，所述衬底具有第一侧和第二侧。 该装置包括一个或多个保持部件，例如手指，构造成接触基板的第二侧而不显着接触基板的第一侧。 至少一个保持部件可被配置为在该过程期间移动，以便防止至少一个保持部件影响该过程，例如接触液体弯液面。 当衬底包括其上具有至少一个结构或特征的顶侧时，可以采用这种布置，期望保持部件避免在该过程期间与结构或特征的接触。