公开(公告)号：WO1996022869A1

公开(公告)日：1996-08-01

申请号：PCT/JP1996000145

申请日：1996-01-26

Applicant: YUGEN KAISHA SANKI SEISAKUSHO ,  MITSUISHI, Mikio

Inventor： YUGEN KAISHA SANKI SEISAKUSHO

IPC: B29C33/14

CPC classification number: B29C33/12 ,  B29C39/10 ,  B29C70/681

Abstract: A molding method for placing a wire-shaped part in a molding by planting pins, each of which has a wire fastening portion at the tip thereof, on the bottom of a cavity, filling a resin material with wires such as heater wires fastened to the tips of the pins, and effecting mold release.

Abstract translation: 一种成型方法，用于通过种植销（在其顶端具有电线紧固部分）的一个空腔的底部，将线形部件放置在模制件中，用诸如加热丝之类的电线填充树脂材料， 引脚的尖端，并实现脱模。