公开(公告)号：WO2020247062A1

公开(公告)日：2020-12-10

申请号：PCT/US2020/027455

申请日：2020-04-09

Applicant: OSI ELECTRONICS, INC.

Inventor： KARAVAKIS, Konstantine ,  JUNG, Robert

IPC: H05K3/12 ,  H05K1/03 ,  H05K1/09 ,  H05K3/28

Abstract: A flexible circuit board including a substrate with a first side and an opposing second side, wherein the substrate is of a colorless polyimide; first and second circuit patterns formed by deposition of ink on the first and second sides, respectively; at least one opening to interconnect the first and second circuit patterns; and first and second cover layers applied on the first and second circuit patterns, respectively, wherein the first and second cover layers are of a colorless polyimide.

公开(公告)号：WO2020185261A1

公开(公告)日：2020-09-17

申请号：PCT/US2019/059727

申请日：2019-11-04

Applicant: OSI ELECTRONICS, INC.

Inventor： KARAVAKIS, Konstantine ,  JUNG, Robert

IPC: H01J47/00

Abstract: A multilayered flexible circuit board (FCB) may be fabricated by folding a single panel made of a substrate having conducting regions separated by a folding region. After conducting layers with patterned circuit areas are positioned on a single panel, the panel is folded to thereby cause one portion of the panel to stack atop the other portion of the panel and create the multilayered FCB. The multilayered FCB may have three, four, five, six, seven or eight conducting layers stacked upon one another.

公开(公告)号：WO2020180354A1

公开(公告)日：2020-09-10

申请号：PCT/US2019/059767

申请日：2019-11-05

Applicant: OSI ELECTRONICS, INC.

Inventor： JUNG, Robert ,  KARAVAKIS, Konstantine

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/32

Abstract: A circuit board with improved reliability and ability to withstand sonication, autoclave sterilization, moisture exposure and high pH solution exposure. The circuit board has a substrate made of a liquid crystal polymer, one or more vias extending through the substrate, conductive traces positioned on surfaces of the substrate, and cover layers positioned over surfaces of the substrate.