公开(公告)号：WO2012054238A2

公开(公告)日：2012-04-26

申请号：PCT/US2011/055100

申请日：2011-10-06

Applicant: APPLIED MATERIALS, INC. ,  OUYE, Alan, H. ,  SCOTT, Graeme ,  YU, Keven, Kaisheng ,  GRIMBERGEN, Michael, N.

Inventor： OUYE, Alan, H. ,  SCOTT, Graeme ,  YU, Keven, Kaisheng ,  GRIMBERGEN, Michael, N.

IPC: H01L21/3065 ,  H01L21/205 ,  H01L21/02

CPC classification number: H05B3/42 ,  H01J37/32522 ,  H05B2203/003

Abstract: Embodiments of the invention generally provide a lid heater for a plasma processing chamber. In one embodiment, a lid heater assembly is provided that includes a thermally conductive base. The thermally conductive base has a planar ring shape defining an inner opening. The lid heater assembly further includes a heating element disposed on the thermally conductive base, and an insulated center core disposed across the inner opening of the thermally conductive base.

Abstract translation: 本发明的实施例通常提供用于等离子体处理室的盖式加热器。 在一个实施例中，提供了包括导热基座的盖子加热器组件。 导热基底具有限定内部开口的平面环形状。 盖式加热器组件还包括设置在导热基座上的加热元件和设置在导热基座的内开口上的绝缘中心芯。

公开(公告)号：WO2012054238A3

公开(公告)日：2012-06-14

申请号：PCT/US2011055100

申请日：2011-10-06

Applicant: APPLIED MATERIALS INC ,  OUYE ALAN H ,  SCOTT GRAEME ,  YU KEVEN KAISHENG ,  GRIMBERGEN MICHAEL N

Inventor： OUYE ALAN H ,  SCOTT GRAEME ,  YU KEVEN KAISHENG ,  GRIMBERGEN MICHAEL N

IPC: H01L21/3065 ,  H01L21/02 ,  H01L21/205

CPC classification number: H05B3/42 ,  H01J37/32522 ,  H05B2203/003

Abstract: Embodiments of the invention generally provide a lid heater for a plasma processing chamber. In one embodiment, a lid heater assembly is provided that includes a thermally conductive base. The thermally conductive base has a planar ring shape defining an inner opening. The lid heater assembly further includes a heating element disposed on the thermally conductive base, and an insulated center core disposed across the inner opening of the thermally conductive base.

Abstract translation: 本发明的实施例通常提供一种用于等离子体处理室的盖式加热器。 在一个实施例中，提供了包括导热基座的盖加热器组件。 导热基座具有限定内部开口的平面环状。 盖加热器组件还包括设置在导热基座上的加热元件，以及横跨导热基底的内部开口设置的绝缘中心芯。