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公开(公告)号:WO2008127488A1
公开(公告)日:2008-10-23
申请号:PCT/US2008/000210
申请日:2008-01-04
Applicant: APPLE INC. , HANKEY, M. Evans , SANFORD, Emery A. , PREST, Christoper D. , LIM, Way Chet
Inventor: HANKEY, M. Evans , SANFORD, Emery A. , PREST, Christoper D. , LIM, Way Chet
CPC classification number: H04R5/033 , H01R13/2428 , H01R13/6205 , H01R13/64 , H01R13/7039 , H01R29/00 , H01R43/26 , H04M1/0262 , H04M1/0274 , H04M1/0277 , H04M1/05 , H04M1/6058 , H04M1/6066 , H04M2250/02 , H04R1/1016 , H04R1/1041 , H04R1/1058 , Y02D70/10
Abstract: Headset assemblies and headset connectors are provided. Headset connectors can include a magnetic mating face and a plurality of electrical contacts disposed within the mating face. Engaging assemblies and engaging connectors are also provided. The engaging connectors can include a housing having a mating side, a magnetic array structure, and a plurality of spring biased contact members. The magnetic array structure can be fixed within the housing and house a plurality of spring biased contact members. The spring biased contact members can include tips that extend out of the mating side. The tips can electrically couple with electrical contacts in a headset connector.
Abstract translation: 提供耳机组件和耳机连接器。 耳机连接器可以包括磁配合面和布置在配合面内的多个电触头。 还提供接合组件和接合连接器。 接合连接器可以包括具有配合侧的壳体,磁性阵列结构以及多个弹簧偏置接触构件。 磁性阵列结构可以固定在壳体内并容纳多个弹簧偏置的接触构件。 弹簧偏置的接触构件可以包括延伸出配合侧的尖端。 尖端可以与耳机连接器中的电触点电耦合。