BONDED ARTICLE OF THIN GLASS ON SUPPORT SUBSTRATE, PREPARATION METHOD AND USE THEREOF
    1.
    发明申请
    BONDED ARTICLE OF THIN GLASS ON SUPPORT SUBSTRATE, PREPARATION METHOD AND USE THEREOF 审中-公开
    支撑基板上的薄玻璃粘结物品,制备方法及其用途

    公开(公告)号:WO2014201665A1

    公开(公告)日:2014-12-24

    申请号:PCT/CN2013/077585

    申请日:2013-06-20

    Abstract: The invention is related to a method for making a bonded article, wherein a thin glass substrate is bonded on a support substrate in the absence of any interlayer by an electrostatic adhesion process with the assistance of external pressure, the pressure is applied constantly or stepwise during the adhesion process by use of a tool such as a roll or a wheel or other movable device with curved surface. The bonded article has no defects, e.g. bubbles or inclusions, in the bonded interface, which benefits transportation of the thin glass substrate and its post-processing as well. Such defect-free bonded article is also disclosed. Pressure supported electrostatic adhesion, initiated by electrostatic charges adhesion of a two members, e.g. a substrate member and a support member, is enabled to minimize, prevent and exclude defects, distortion between the adhered surfaces.

    Abstract translation: 本发明涉及一种制造接合制品的方法,其中在外部压力的帮助下,通过静电粘附工艺在不存在任何夹层的情况下将薄玻璃基板粘结在支撑基板上,在压力作用下不断地或逐步地施加压力 通过使用诸如辊或车轮的工具或具有弯曲表面的其它可移动装置的粘合过程。 粘合制品没有缺陷,例如 粘结界面中的气泡或夹杂物,这有利于薄玻璃基板的输送及其后处理。 还公开了这种无缺陷的粘合制品。 由两个构件的静电电荷附着引起的压力支持的静电粘附,例如。 衬底构件和支撑构件能够最小化,防止和排除缺陷,粘附表面之间的变形。

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