PROCESS USING ELECTROSTATIC SPRAYING FOR COATING SUBSTRATES WITH RELEASE COATING COMPOSITIONS, PRESSURE SENSITIVE ADHESIVES, AND COMBINATIONS THEREOF
    4.
    发明申请
    PROCESS USING ELECTROSTATIC SPRAYING FOR COATING SUBSTRATES WITH RELEASE COATING COMPOSITIONS, PRESSURE SENSITIVE ADHESIVES, AND COMBINATIONS THEREOF 审中-公开
    使用静电喷涂的方法,用于涂布基材与释放涂料组合物,压敏粘合剂及其组合

    公开(公告)号:WO99017891A1

    公开(公告)日:1999-04-15

    申请号:PCT/US1998/020862

    申请日:1998-10-05

    CPC classification number: B05D5/10 B05D1/06 B32B2310/025

    Abstract: This invention relates to a process for applying a coating material comprising a release coating composition (204) or a pressure sensitive adhesive composition (206) to a substrate (202), the process comprising: (A) atomizing and electrically charging said coating material; and (B) spraying (102, 104) the atomized and charged coating material from step (A) onto a substrate (202) which overlies a grounded support structure (108). In one embodiment, the coating material sprayed during step (B) is a release coating composition (204), said process further comprising the additional steps of: (C) curing said release coating composition (204); (D) atomizing and electrically charging a pressure sensitive adhesive composition (206); (E) spraying the pressure sensitive adhesive composition (206) from step (D) onto said substrate (202) over the cured release coating composition (204) from step (C); and (F) placing another substrate (208) over the sprayed pressure sensitive adhesive composition (206) from step (E).

    Abstract translation: 本发明涉及一种将包含脱模涂料组合物(204)或压敏粘合剂组合物(206)的涂料施用于基材(202)的方法,该方法包括:(A)雾化并对所述涂料进行充电; 和(B)将来自步骤(A)的雾化和带电的涂层材料喷涂(102,104)到覆盖在接地支撑结构(108)上的衬底(202)上。 在一个实施方案中,在步骤(B)期间喷涂的涂料是一种脱模涂料组合物(204),所述方法还包括以下附加步骤:(C)固化所述脱模涂料组合物(204); (D)对压敏粘合剂组合物(206)进行雾化和充电; (E)从步骤(D)将来自步骤(D)的压敏粘合剂组合物(206)喷射到来自步骤(C)的固化的脱模涂料组合物(204)上的所述基材(202)上; 和(F)将来自步骤(E)的喷涂的压敏粘合剂组合物(206)上的另一个基底(208)放置在其上。

    BONDED ARTICLE OF THIN GLASS ON SUPPORT SUBSTRATE, PREPARATION METHOD AND USE THEREOF
    5.
    发明申请
    BONDED ARTICLE OF THIN GLASS ON SUPPORT SUBSTRATE, PREPARATION METHOD AND USE THEREOF 审中-公开
    支撑基板上的薄玻璃粘结物品,制备方法及其用途

    公开(公告)号:WO2014201665A1

    公开(公告)日:2014-12-24

    申请号:PCT/CN2013/077585

    申请日:2013-06-20

    Abstract: The invention is related to a method for making a bonded article, wherein a thin glass substrate is bonded on a support substrate in the absence of any interlayer by an electrostatic adhesion process with the assistance of external pressure, the pressure is applied constantly or stepwise during the adhesion process by use of a tool such as a roll or a wheel or other movable device with curved surface. The bonded article has no defects, e.g. bubbles or inclusions, in the bonded interface, which benefits transportation of the thin glass substrate and its post-processing as well. Such defect-free bonded article is also disclosed. Pressure supported electrostatic adhesion, initiated by electrostatic charges adhesion of a two members, e.g. a substrate member and a support member, is enabled to minimize, prevent and exclude defects, distortion between the adhered surfaces.

    Abstract translation: 本发明涉及一种制造接合制品的方法,其中在外部压力的帮助下,通过静电粘附工艺在不存在任何夹层的情况下将薄玻璃基板粘结在支撑基板上,在压力作用下不断地或逐步地施加压力 通过使用诸如辊或车轮的工具或具有弯曲表面的其它可移动装置的粘合过程。 粘合制品没有缺陷,例如 粘结界面中的气泡或夹杂物,这有利于薄玻璃基板的输送及其后处理。 还公开了这种无缺陷的粘合制品。 由两个构件的静电电荷附着引起的压力支持的静电粘附,例如。 衬底构件和支撑构件能够最小化,防止和排除缺陷,粘附表面之间的变形。

    METHOD FOR PRODUCING A BONDED GLASS ARTICLE AND A BONDED GLASS ARTICLE
    8.
    发明申请
    METHOD FOR PRODUCING A BONDED GLASS ARTICLE AND A BONDED GLASS ARTICLE 审中-公开
    粘结玻璃制品和粘结玻璃制品的制造方法

    公开(公告)号:WO2017035770A1

    公开(公告)日:2017-03-09

    申请号:PCT/CN2015/088726

    申请日:2015-09-01

    Abstract: Disclosed is a method for producing a bonded article (1), comprising providing a carrier substrate (2), having a bonding surface (2.1) and providing an ultra-thin substrate (3) which is sheet-like and flexible. The method further comprises cleaning at least the bonding surface of the ultra-thin substrate (3), cleaning at least the bonding surface of the carrier substrate (2), and establishing an intimate bonding. The method is characterized in that the intimate bonding is established by electrostatic forces resulting from a weak electrostatic field potential from electrostatic charges on at least one of the bonding surfaces, wherein the weak electrostatic field potential at the bonding surfaces does not exceed 1kV. Further disclosed are a bonded article and a use of the bonded article.

    Abstract translation: 本发明公开了一种接合体(1)的制造方法,其特征在于,具备提供具有接合面(2.1)的载体基板(2),提供片状且柔软的超薄基板(3)。 所述方法还包括至少清洗超薄基板(3)的粘合表面,至少清洁载体基板(2)的粘合表面,以及建立紧密接合。 该方法的特征在于,通过在至少一个接合表面上的静电电荷的弱静电场电位产生的静电力建立紧密接合,其中接合表面处的弱静电场电势不超过1kV。 进一步公开了粘合物品和粘合物品的用途。

    VERFAHREN SOWIE VORRICHTUNG ZUM POSITIONIEREN VON EINEM GLASELEMENT UND EINER KUNSTSTOFFFOLIE AUFEINANDER
    9.
    发明申请
    VERFAHREN SOWIE VORRICHTUNG ZUM POSITIONIEREN VON EINEM GLASELEMENT UND EINER KUNSTSTOFFFOLIE AUFEINANDER 审中-公开
    方法和装置,用于定位玻璃元件和塑料膜彼此

    公开(公告)号:WO2008067580A1

    公开(公告)日:2008-06-12

    申请号:PCT/AT2007/000552

    申请日:2007-12-07

    Applicant: LISEC, Peter

    Inventor: LISEC, Peter

    Abstract: Die Erfindung beschreibt ein Verfahren sowie eine Vorrichtung zum Positionieren von zwei flächigen Elementen (2, 17) wie ein Glaselement (3) und eine Folie (18) aus Kunststoff aufeinander, bei dem ein Element (2, 17) an das andere Element (17, 2) möglichst spielfrei angelegt wird. Dazu wird zumindest eines der beiden voneinander distanzierten Elemente (2, 17) elektrostatisch aufgeladen und werden die beiden Elemente (2, 17) ausgehend von der distanzierten Position relativ' zueinander bewegt, bis einander zugewandte Oberflächen der beiden Elemente (2, 17) im Wesentlichen spielfrei aneinander liegen und durch elektrostatische Anziehungskraft relativ zueinander fixiert sind.

    Abstract translation: 本发明描述了用于定位两个平坦元件(2,17),例如一个玻璃元件(3)和由塑料制成,以彼此的膜(18)的方法和设备,其中一个元件(2,17)(其他构件17 ,2)无间隙地施加的。 为了这个目的,两个相互间隔开的元件中的至少一个(2,17)被静电充电,并且所述两个元件(2,17)从间隔位置相对“彼此移动时,在两个元件的相对表面(2,17)是基本上 玩相互邻接并通过相对于彼此静电吸引力被固定。

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