IONIC LIQUID SOLVENT FOR ELECTROPLATING PROCESS
    1.
    发明申请
    IONIC LIQUID SOLVENT FOR ELECTROPLATING PROCESS 审中-公开
    用于电镀工艺的离子液体溶剂

    公开(公告)号:WO2015157441A1

    公开(公告)日:2015-10-15

    申请号:PCT/US2015/024962

    申请日:2015-04-08

    CPC classification number: C25D3/665 C25D5/36 C25D7/0607

    Abstract: Examples of next-generation ionic liquids (IL)s have been synthesized and characterized to be used in a variety of applications including aluminum electrodeposition. These ILs are non-flammable and provide smooth deposition of metal, such as metallic aluminum, onto an iron wire substrate. The newly synthesized ILs have been specifically designed for improved surface-interacting groups for smoother aluminum deposition properties. The substituent groups contain oxy-units which act as a viscosity reducer while also stabilizing the anion such as the AlCl 4 - anion. This improvement is important in forming high quality and/or defect-free coatings on different substrates, and the electroplating results obtained by this method are demonstrated to be superior over other commercially available IL processes.

    Abstract translation: 已经合成了下一代离子液体(IL)的实例,并将其表征用于各种应用,包括铝电沉积。 这些IL是不可燃的并且提供金属如金属铝的光滑沉积到铁丝基底上。 新合成的IL被专门设计用于改善表面相互作用的基团以获得更平滑的铝沉积性质。 取代基含有作为降粘剂的氧单元,同时也稳定阴离子如AlCl 4 - 阴离子。 这种改进对于在不同基底上形成高质量和/或无缺陷的涂层是重要的,并且证明通过该方法获得的电镀结果优于其它商业上可获得的IL方法。

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