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    METHOD FOR IMPROVING THE LIQUID FLOW PROPERTIES OF A HEAT TRANSFER SURFACE AND ITS USE.
    2.
    发明申请
    METHOD FOR IMPROVING THE LIQUID FLOW PROPERTIES OF A HEAT TRANSFER SURFACE AND ITS USE. 审中-公开
    用于改善热传递表面的液体流动性质的方法及其用途。

    公开(公告)号：WO2007006847A1

    公开(公告)日：2007-01-18

    申请号：PCT/FI2006/000246

    申请日：2006-07-10

    Applicant: LUVATA OY ,  RISSANEN, Petri

    Inventor： RISSANEN, Petri

    IPC: C23C8/12 ,  C23C22/00 ,  C23C8/10 ,  F28F13/00 ,  F28F13/18

    CPC classification number: F28F13/18 ,  C23C8/10 ,  C23C8/12 ,  C23C8/40

    Abstract: The invention relates to a method for improving the liquid flow properties, such as its wettability and capillary flow, of a heat transfer surface prepared on a piece made of a metal, ceramic, polymeric or composite material or a combination thereof, or on a metal piece advantageously made of copper, a copper alloy, aluminum, an aluminum alloy or steel or a combination of these metals. The piece with a heat transfer surface is subjected to oxidation by heating the same under an oxygen-rich atmosphere or using at least one chemical oxidizer. The invention also relates to the use of a heat transfer surface prepared with the help of the method.

    Abstract translation: 本发明涉及一种用于改善由金属，陶瓷，聚合物或复合材料或其组合制成的片上制备的传热表面的液体流动性质（例如其润湿性和毛细管流动性）的方法，或金属 有利地由铜，铜合金，铝，铝合金或钢或这些金属的组合制成。 具有传热表面的片材在富氧气氛下或使用至少一种化学氧化剂的同时加热氧化。 本发明还涉及在该方法的帮助下制备的传热表面的用途。

    METHOD FOR REDUCING METAL OXIDE POWDER AND ATTACHING IT TO A HEAT TRANSFER SURFACE AND THE HEAT TRANSFER SURFACE
    3.
    发明申请
    METHOD FOR REDUCING METAL OXIDE POWDER AND ATTACHING IT TO A HEAT TRANSFER SURFACE AND THE HEAT TRANSFER SURFACE 审中-公开
    减少金属氧化物粉末并附着在传热表面和热传递表面上的方法

    公开(公告)号：WO2005118913A1

    公开(公告)日：2005-12-15

    申请号：PCT/FI2005/000250

    申请日：2005-06-01

    Applicant: OUTOKUMPU OYJ ,  RISSANEN, Petri ,  LAAKSONEN, Olli

    Inventor： RISSANEN, Petri ,  LAAKSONEN, Olli

    IPC: C23C24/10

    CPC classification number: C23C24/087 ,  B23K1/0012 ,  B23K1/008 ,  B23K1/08 ,  B23K1/19 ,  B23K35/3006 ,  B23K35/302 ,  B23K2201/14 ,  B23K2203/12 ,  C23C24/106 ,  C23C26/00 ,  F28F13/185 ,  F28F13/187

    Abstract: The purpose of the method developed is to form on top of a heat transfer surface a porous surface layer, which is to be fixed to the surface below it at a temperature and time applicable for industrial production. The heat transfer surface is copper or copper alloy. The powder forming a porous surface is fine-grained copper oxide powder, which is reduced to metallic copper on the heat transfer surface during heat treatment. The invention also relates to the heat transfer surface of copper or copper alloy, on which a porous layer has been formed from metallic copper, which is manufactured by reducing copper oxide powder and is attached using brazing solder.

    Abstract translation: 所开发的方法的目的是在传热表面的顶部形成多孔表面层，其在适于工业生产的温度和时间下被固定到其下方的表面。 传热面是铜或铜合金。 形成多孔表面的粉末是细粒度的氧化铜粉末，其在热处理期间在传热表面上还原成金属铜。 本发明还涉及铜或铜合金的传热表面，其上由金属铜形成多孔层，其通过还原氧化铜粉末制成并使用钎焊焊料附着。

    METHOD FOR ATTACHING METAL POWDER TO A HEAT TRANSFER SURFACE AND THE HEAT TRANSFER SURFACE
    6.
    发明申请
    METHOD FOR ATTACHING METAL POWDER TO A HEAT TRANSFER SURFACE AND THE HEAT TRANSFER SURFACE 审中-公开
    将金属粉末连接到热传递表面和热传递表面的方法

    公开(公告)号：WO2005118912A1

    公开(公告)日：2005-12-15

    申请号：PCT/FI2005/000249

    申请日：2005-06-01

    Applicant: OUTOKUMPU OYJ ,  RISSANEN, Petri ,  LAAKSONEN, Olli

    Inventor： RISSANEN, Petri ,  LAAKSONEN, Olli

    IPC: C23C24/10

    CPC classification number: B23K35/302 ,  C23C24/10 ,  C23C26/02 ,  F28F13/185

    Abstract: The purpose of the method developed is to form on top of a heat transfer surface a porous layer, which is to be fixed strongly to the surface below it at a temperature and time applicable for industrial production. The heat transfer surface is copper or copper alloy, preferably oxygen-free or deoxidised high phosphorous copper. The powder forming a porous surface is fine-grained copper powder or copper alloy powder. In the method according to the invention, a brazing solder containing preferably nickel, tin and phosphorous alloyed with copper, is brought to the heat transfer surface. The invention also relates to the heat transfer surface onto which a porous surface is formed by means of a powder of copper or copper alloy and the brazing solder described.

    Abstract translation: 所开发的方法的目的是在传热表面的顶部形成多孔层，该多孔层在适于工业生产的温度和时间下强烈地固定在其下方的表面。 传热面是铜或铜合金，优选无氧或脱氧高磷铜。 形成多孔表面的粉末是细粒度的铜粉或铜合金粉末。 在根据本发明的方法中，将优选含有与铜合金化的镍，锡和磷的钎焊焊料带到传热表面。 本发明还涉及通过铜或铜合金粉末和所述钎焊焊料在其上形成多孔表面的传热表面。

    METHOD AND APPARATUS FOR FABRICATING A COPPER PRODUCT
    7.
    发明申请
    METHOD AND APPARATUS FOR FABRICATING A COPPER PRODUCT 审中-公开
    制造铜制品的方法和装置

    公开(公告)号：WO2012146826A1

    公开(公告)日：2012-11-01

    申请号：PCT/FI2012/050404

    申请日：2012-04-24

    Applicant: OUTOTEC OYJ ,  EEROLA, Heikki ,  RISSANEN, Petri

    Inventor： EEROLA, Heikki ,  RISSANEN, Petri

    IPC: C22B15/00 ,  F27B14/06 ,  F27B19/04

    CPC classification number: C22B15/0026 ,  F27B14/061 ,  F27B19/04 ,  Y02P10/253

    Abstract: A method and apparatus for fabricating an oxygen-free copper product (P), such as oxygen-free copper wire, tube or rod, from copper oxide powder. The method comprises the reduction and melting of copper powder, and casting of molten oxygen-free copper into a copper product (P). Copper oxide is melted in an induction crucible furnace (1) and the oxygen-containing melt is reduced by bringing it into contact with a carbon-containing material (c). The apparatus includes an induction crucible furnace (1), which is arranged to function as a melting and reduction furnace for melting copper oxide into an oxygen-containing melt and reducing the oxygen-containing melt.

    Abstract translation: 一种从氧化铜粉末制造无氧铜产品（P），例如无氧铜线，管或棒的方法和装置。 该方法包括还原和熔化铜粉，并将熔融的无氧铜铸造成铜产品（P）。 氧化铜在感应坩埚炉（1）中熔化，并通过使其与含碳材料（c）接触来还原含氧熔体。 该设备包括一个感应坩埚炉（1），其被设置成用作将氧化铜熔化成含氧熔体并还原含氧熔体的熔化还原炉。

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