RIGIDIZED FILLER MATERIALS FOR METAL MATRIX COMPOSITES
    1.
    发明申请
    RIGIDIZED FILLER MATERIALS FOR METAL MATRIX COMPOSITES 审中-公开
    金属基复合材料的冲击填充材料

    公开(公告)号:WO1991017279A1

    公开(公告)日:1991-11-14

    申请号:PCT/US1991003233

    申请日:1991-05-09

    Abstract: The present invention relates to a novel process for forming metal matrix composite bodies. Specifically, in a particularly preferred embodiment for making metal matrix composite bodies by a spontaneous infiltration technique, an infiltration enhancer and/or an infiltration enhancer precursor and/or an infiltrating atmosphere are in communication with a rigidized filler material or a rigidized preform (58), at least at some point during the process, which permits molten matrix metal to spontaneously infiltrate the rigidized filler material or rigidized preform. Such spontaneous infiltration occurs without the requirement for the application of any pressure or vacuum.

    Abstract translation: 本发明涉及一种形成金属基复合体的新方法。 具体地,在用于通过自发渗透技术制备金属基质复合体的特别优选的实施方案中,渗透增强剂和/或渗透增强剂前体和/或渗透气氛与刚性填料或刚性预成型体(58)连通, 至少在该过程中的某一点,这允许熔融基质金属自发地渗透刚性填料或刚性预制件。 发生这种自发性渗透,而不需要施加任何压力或真空。

    GATING MEANS FOR METAL MATRIX COMPOSITE MANUFACTURE
    3.
    发明申请
    GATING MEANS FOR METAL MATRIX COMPOSITE MANUFACTURE 审中-公开
    金属基复合材料制品的成型手段

    公开(公告)号:WO1991017011A1

    公开(公告)日:1991-11-14

    申请号:PCT/US1991003235

    申请日:1991-05-09

    Abstract: The present invention relates to the use of a gating means (3) in combination with a spontaneous infiltration process to produce a metal matrix composite body. Particularly, a permeable mass of filler material or a preform (2) is spontaneously infiltrated by molten matrix metal (5) to form a metal matrix composite body. A gating means (3) is provided which controls or limits the areal contact between molten matrix metal (5) and the filler material or preform (2). The use of a gating means (3) provides for control of the amount of matrix metal (5) which can contact the preform (2) or filler material, which may result in less machining of a formed metal matrix composite body compared with a similar metal matrix composite body made without a gating means (3). Moreover, the use of a gating means (3) ameliorates the tendency of a formed metal matrix composite body to warp due to the contact between the formed composite body and matrix metal carcass.

    Abstract translation: 本发明涉及门控装置(3)与自发渗透方法的组合以产生金属基质复合体的用途。 特别地,填充材料或预制件(2)的可渗透物质被熔融基质金属(5)自发渗透以形成金属基质复合体。 提供了控制或限制熔融基质金属(5)与填料或预制件(2)之间的面接触的浇注装置(3)。 浇注装置(3)的使用提供了可以接触预成型件(2)或填充材料的基质金属(5)的量的控制,这可能导致与类似物形成的金属基体复合材料相比较少的加工 金属基体复合体,不具有门控装置(3)。 此外,使用浇注装置(3)可改善由于形成的复合体与基质金属体之间的接触而导致形成的金属基体复合体翘曲的倾向。

    THIN METAL MATRIX COMPOSITES AND PRODUCTION METHODS
    4.
    发明申请
    THIN METAL MATRIX COMPOSITES AND PRODUCTION METHODS 审中-公开
    薄金属基复合材料和生产方法

    公开(公告)号:WO1991017280A1

    公开(公告)日:1991-11-14

    申请号:PCT/US1991003234

    申请日:1991-05-09

    Abstract: The present invention relates to a novel process for forming thin metal matrix composite bodies. Particularly, an infiltration enhancer and/or an infiltrating atmosphere are in communication with a filler material or preform, at least at some point during the process, which permits molten matrix metal to spontaneously infiltrate the filler material or preform. Such spontaneous infiltration occurs without the application of any pressure or vacuum. In an embodiment of the present invention, the filler material may be sprayed upon a thin sheet of matrix metal. Alternatively, the filler material may be shaped via tape casing, slip casting, etc. to provide a thin preform. In another embodiment of the present invention, a body of matrix metal may be coated with a filler material such that upon spontaneous infiltration a metal matrix composite body is produced which inversely replicates the configuration of the original body of matrix metal.

    Abstract translation: 本发明涉及一种形成薄金属基复合体的新方法。 特别地,渗透增强剂和/或渗透气氛至少在该过程中的某一点处与填料或预型体连通,这允许熔融基质金属自发地渗入填料或预型体。 这种自发渗透发生在没有施加任何压力或真空的情况下。 在本发明的一个实施例中,填充材料可以喷涂在基体金属薄片上。 或者,填充材料可以通过带壳,滑移浇铸等成形,以提供薄的预成型件。 在本发明的另一个实施例中,基体金属体可以用填充材料涂覆,使得当自发渗透时,产生金属基体复合体,其反向地复制基体金属原体的构型。

    METHODS OF FORMING ELECTRONIC PACKAGES
    5.
    发明申请
    METHODS OF FORMING ELECTRONIC PACKAGES 审中-公开
    形成电子封装的方法

    公开(公告)号:WO1991013462A1

    公开(公告)日:1991-09-05

    申请号:PCT/US1991001247

    申请日:1991-02-25

    Abstract: The present invention relates to the formation of a macrocomposite body for use as an electronic package or container. The macrocomposite body is formed by spontaneously infiltrating a permeable mass of filler material (247) or a preform with molten matrix metal (250) and bonding the spontaneously infiltrated material to at least one second material such as a ceramic or ceramic containing body and/or a metal or metal containing body. Moreover, prior to infiltration, the filler material or preform is placed into contact with at least a portion of a second material such that after infiltration of the filler material or preform by molten matrix metal, the infiltrated material is bonded to said second material, thereby forming a macrocomposite body. The macrocomposite body may then be coated by techniques according to the present invention to enhance its perfomance and/or bonding capabilities.

Patent Agency Ranking