公开(公告)号：WO2005072438A3

公开(公告)日：2006-11-09

申请号：PCT/US2005003095

申请日：2005-01-27

Applicant: RUCKER & KOLLS INC ,  CHOU ARLEN

Inventor： CHOU ARLEN

IPC: G01R31/02 ,  G01R1/067 ,  G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/0675 ,  G01R1/06761

Abstract: Methods and systems are provided for forming multiple electrical connections using a single probe suitable for semiconductor wafer probing and the parametric measurement of micro-devices. A conventional single-beam physical wafer probe structure can support two closely spaced and electrically independent probe contacts (21, 40) if an insulating sheath (25) overlaid by a conducting outside coaxial sheath (40) is used to provide a second independent probe contact (27, 28).

Abstract translation: 提供了用于使用适合于半导体晶片探测的单个探针和微器件的参数测量来形成多个电连接的方法和系统。 如果用导电的外部同轴鞘（40）覆盖的绝缘护套（25）用于提供第二独立的探针接触件，传统的单光束物理晶片探测器结构可以支撑两个紧密间隔且电独立的探针接触件（21,40） （27,28）。

公开(公告)号：WO2005072438A2

公开(公告)日：2005-08-11

申请号：PCT/US2005/003095

申请日：2005-01-27

Applicant: RUCKER & KOLLS, INC. ,  CHOU, Arlen

Inventor： CHOU, Arlen

IPC: G01R1/067 ,  G01R1/073 ,  G01R31/02

CPC classification number: G01R1/07342 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/0675 ,  G01R1/06761

Abstract: Methods and systems are provided for forming multiple electrical connections using a single probe suitable for semiconductor wafer probing and the parametric measurement of micro-devices. A conventional single-beam physical wafer probe structure can support two closely spaced and electrically independent probe contacts if an insulating sheath overlaid by a conducting outside coaxial sheath is used to provide a second independent probe contact.

Abstract translation: 提供了用于使用适合于半导体晶片探测的单个探针和微器件的参数测量来形成多个电连接的方法和系统。 如果使用由导电的外部同轴护套覆盖的绝缘护套来提供第二独立的探针接触，传统的单束物理晶片探针结构可以支撑两个紧密间隔且电独立的探针接触。