公开(公告)号：WO2013100913A1

公开(公告)日：2013-07-04

申请号：PCT/US2011/067422

申请日：2011-12-27

Applicant: INTEL CORPORATION ,  AHUJA, Sandeep ,  SAUCIUC, Ioan ,  SMITH, Susan F.

Inventor： AHUJA, Sandeep ,  SAUCIUC, Ioan ,  SMITH, Susan F.

IPC: H01L21/02

CPC classification number: H01L23/473 ,  G06F1/206 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units. The switching between cooling systems allows the semiconductor device(s) to be maintained at a lower operating temperature than if switching between cooling subsystems were not employed.

Abstract translation: 提供半导体器件的热管理系统。 本发明的实施例提供两个或更多个液体冷却子系统，每个液体冷却子系统能够向一个或多个半导体器件（例如封装的处理器）提供主动冷却。 在操作中，第一液体冷却子系统可以向半导体器件提供主动冷却，而第二冷却子系统在其自身子系统内循环传热流体。 然后可以将第二液体冷却子系统切换到操作中，并且在第一冷却子系统在其自己的子系统内循环传热流体时，向半导体装置提供主动冷却。 在替代实施例中，传热流体保留在子系统中，但是当子系统不向半导体器件提供冷却时，该子系统不会在子系统内循环。 子系统包括散热单元。 冷却系统之间的切换允许半导体器件保持在比不使用冷却子系统之间切换的较低的工作温度。