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    LIQUID METAL THERMAL INTERFACE FOR AN INTEGRATED CIRCUIT DEVICE
    1.
    发明申请
    LIQUID METAL THERMAL INTERFACE FOR AN INTEGRATED CIRCUIT DEVICE 审中-公开
    用于集成电路设备的液体金属热接口

    公开(公告)号：WO2006020332A1

    公开(公告)日：2006-02-23

    申请号：PCT/US2005/025815

    申请日：2005-07-20

    Applicant: INTEL CORPORATION ,  SAUCIUC, Ioan ,  CHRYSLER, Gregory

    Inventor： SAUCIUC, Ioan ,  CHRYSLER, Gregory

    IPC: H01L23/373

    CPC classification number: H01L23/42 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/15311 ,  H01L2224/0401

    Abstract: A liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in fluid communication with a surface of the die, and liquid metal moving over the die surface transfers heat from the die to the heat transfer element. A surface of the heat transfer element may also be in fluid communication with the liquid metal. Other embodiments are described and claimed.

    Abstract translation: 用于集成电路管芯的液态金属热接口。 液态金属热界面可以设置在模具和另一传热元件之间，例如散热器或散热器。 液体金属热界面包括与模具表面流体连通的液态金属，并且在模具表面上移动的液态金属将热量从模具传递到传热元件。 传热元件的表面也可以与液态金属流体连通。 描述和要求保护其他实施例。

    METHOD AND APPARATUS FOR TWO-PHASE START-UP OPERATION
    3.
    发明申请
    METHOD AND APPARATUS FOR TWO-PHASE START-UP OPERATION 审中-公开
    用于两相启动操作的方法和装置

    公开(公告)号：WO2005066557A1

    公开(公告)日：2005-07-21

    申请号：PCT/US2004/043647

    申请日：2004-12-22

    Applicant: INTEL CORPORATION ,  SAUCIUC, Ioan ,  CHRYSLER, Gregory, M.

    Inventor： SAUCIUC, Ioan ,  CHRYSLER, Gregory, M.

    IPC: F25B49/02

    CPC classification number: F25B49/02 ,  F25B2500/26 ,  F25B2500/28 ,  H01L23/427 ,  H01L35/00 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method and apparatus for removing vapor inside a liquid pump (110) at the start up operation of the pump. In addition, a method and apparatus for removing liquid inside a compressor (210) at the start up operation of the compressor. The pump and compressor each include a sensor (120, 220) attached to them that determines the physical state (i.e., liquid or vapor) of a material inside the pump or compressor. If vapor is detected inside the pump, a thermoelectric module (130) connected to the pump is powered to condense the vapor into a liquid. Likewise, if liquid is detected inside the compressor a heater (230) connected to the compressor is powered to evaporate the liquid into a vapor. After the state of the material inside the pump or compressor is changed, the pump or compressor is powered up for operation in a cooling system.

    Abstract translation: 一种用于在泵的启动操作期间去除液体泵（110）内的蒸汽的方法和装置。 另外，在压缩机的启动运转时，除去压缩机（210）内的液体的方法和装置。 泵和压缩机各自包括附接到它们的传感器（120,220），其确定泵或压缩机内部的材料的物理状态（即液体或蒸气）。 如果在泵内检测到蒸汽，则连接到泵的热电模块（130）被供电以将蒸汽冷凝成液体。 类似地，如果在压缩机内部检测到液体，则连接到压缩机的加热器（230）被供电以将液体蒸发成蒸汽。 在泵或压缩机内的材料状态发生变化之后，泵或压缩机上电以在冷却系统中运行。

    DIRECT AIR IMPINGEMENT COOLING OF PACKAGE STRUCTURES
    4.
    发明申请
    DIRECT AIR IMPINGEMENT COOLING OF PACKAGE STRUCTURES 审中-公开
    直接空气压缩冷却包装结构

    公开(公告)号：WO2013101212A1

    公开(公告)日：2013-07-04

    申请号：PCT/US2011/068203

    申请日：2011-12-30

    Applicant: INTEL CORPORATION ,  SAUCIUC, Ioan

    Inventor： SAUCIUC, Ioan

    IPC: H01L23/36 ,  H01L23/34

    CPC classification number: H01L23/427 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: Various embodiments of microelectronic package cooling assemblies are described. Those embodiments include a cooling assembly comprising an array of vertically separated micro channels coupled to a heat spreader, wherein the heat spreader is finless, and wherein each inlet micro channel has two adjacent outlet micro channels. A distance between individual vertically separated micro channels comprises less than about 20 microns, and a heat pipe is embedded in the heat spreader.

    Abstract translation: 描述微电子封装冷却组件的各种实施例。 这些实施例包括冷却组件，其包括耦合到散热器的垂直分离的微通道的阵列，其中散热器是无鳍的，并且其中每个入口微通道具有两个相邻的出口微通道。 单个垂直分离的微通道之间的距离包括小于约20微米，并且热管嵌入散热器中。

    TRANSIENT THERMAL MANAGEMENT SYSTEMS FOR SEMICONDUCTOR DEVICES
    6.
    发明申请
    TRANSIENT THERMAL MANAGEMENT SYSTEMS FOR SEMICONDUCTOR DEVICES 审中-公开
    用于半导体器件的瞬态热管理系统

    公开(公告)号：WO2013100913A1

    公开(公告)日：2013-07-04

    申请号：PCT/US2011/067422

    申请日：2011-12-27

    Applicant: INTEL CORPORATION ,  AHUJA, Sandeep ,  SAUCIUC, Ioan ,  SMITH, Susan F.

    Inventor： AHUJA, Sandeep ,  SAUCIUC, Ioan ,  SMITH, Susan F.

    IPC: H01L21/02

    CPC classification number: H01L23/473 ,  G06F1/206 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units. The switching between cooling systems allows the semiconductor device(s) to be maintained at a lower operating temperature than if switching between cooling subsystems were not employed.

    Abstract translation: 提供半导体器件的热管理系统。 本发明的实施例提供两个或更多个液体冷却子系统，每个液体冷却子系统能够向一个或多个半导体器件（例如封装的处理器）提供主动冷却。 在操作中，第一液体冷却子系统可以向半导体器件提供主动冷却，而第二冷却子系统在其自身子系统内循环传热流体。 然后可以将第二液体冷却子系统切换到操作中，并且在第一冷却子系统在其自己的子系统内循环传热流体时，向半导体装置提供主动冷却。 在替代实施例中，传热流体保留在子系统中，但是当子系统不向半导体器件提供冷却时，该子系统不会在子系统内循环。 子系统包括散热单元。 冷却系统之间的切换允许半导体器件保持在比不使用冷却子系统之间切换的较低的工作温度。

    PIEZO ACTUATOR FOR COOLING
    7.
    发明申请
    PIEZO ACTUATOR FOR COOLING 审中-公开
    用于冷却的PIEZO执行器

    公开(公告)号：WO2007005915A3

    公开(公告)日：2007-04-05

    申请号：PCT/US2006026107

    申请日：2006-06-30

    Applicant: INTEL CORP ,  PALANDUZ CENGIZ A ,  SAUCIUC IOAN ,  PAYDAR REZA

    Inventor： PALANDUZ CENGIZ A ,  SAUCIUC IOAN ,  PAYDAR REZA

    IPC: H01L41/083 ,  F04D33/00 ,  H01L41/24

    CPC classification number: F04D33/00 ,  H01L41/083 ,  H01L41/1871 ,  H01L41/273 ,  H01L41/313 ,  H01L41/338

    Abstract: A piezo actuator includes a plurality of layers of ceramic material (301-305) a plurality of layers of conductive material (306-309) interspersed between the plurality of layers of ceramic material, and a plate (330) attached to a end of the actuator. The plate of the piezo actuator includes an overhang portion (332). Preferably the actuator further comprises a balde (310), injection molded around the plate, to constitute a fan.

    Abstract translation: 压电致动器包括多层陶瓷材料层（301-305），多个导电材料层（306-309）散布在多层陶瓷材料层之间，并且板（330）附接到陶瓷材料的端部 执行器。 压电致动器的板包括突出部分（332）。 优选地，致动器还包括围绕板注塑的秃头（310），以构成风扇。

    HEAT DISSIPATING DEVICE WITH ENHANCED BOILING/CONDENSATION STRUCTURE
    8.
    发明申请
    HEAT DISSIPATING DEVICE WITH ENHANCED BOILING/CONDENSATION STRUCTURE 审中-公开
    具有增强沸腾/冷凝结构的散热装置

    公开(公告)号：WO2006007163A1

    公开(公告)日：2006-01-19

    申请号：PCT/US2005/017873

    申请日：2005-05-20

    Applicant: INTEL CORPORATION ,  ERTURK, Hakan ,  SAUCIUC, Ioan

    Inventor： ERTURK, Hakan ,  SAUCIUC, Ioan

    IPC: H01L23/427

    CPC classification number: F28D15/046 ,  F28D15/043 ,  F28F13/187 ,  F28F2245/04 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A heat dissipating device (100). The heat dissipating device comprises a receptor plate (102) to be placed over a device that generates heat, an evaporator (106) coupling to the receptor plate (102), a condenser column (108) placed in fluid communication with the evaporator (106), and a set of condenser extension surfaces (110) extending from the condenser (108). The evaporator (106) includes a modulated porous layer (114) and stores liquid. The condenser column (108) includes a non-wetting surface (122). The condenser extension surface (110) facilitates heat dissipation.

    Abstract translation: 散热装置（100）。 所述散热装置包括放置在产生热量的装置上的接收板（102），耦合到所述接收器板（102）的蒸发器（106），与所述蒸发器（106）流体连通的冷凝器柱（108） ）和从冷凝器（108）延伸的一组冷凝器延伸表面（110）。 蒸发器（106）包括调制多孔层（114）并储存液体。 冷凝器柱（108）包括非润湿表面（122）。 冷凝器延伸表面（110）有助于散热。

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