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278 条记录 (耗时 0.03 秒)

    POLY(ARYLENE SULFIDE) COMPOSITION
    2.
    发明申请
    POLY(ARYLENE SULFIDE) COMPOSITION 审中-公开

    公开(公告)号：WO2023025534A1

    公开(公告)日：2023-03-02

    申请号：PCT/EP2022/071621

    申请日：2022-08-02

    申请人： SOLVAY SPECIALTY POLYMERS USA, LLC

    发明人： BRANHAM, Kelly D. ,  TROTTER, Benjamin

    IPC分类号： C08L63/00 ,  C08K5/00 ,  C08L81/02

    摘要： Polymer compositions are provided, as are processes of preparing them. Compositions comprising the polymer composition and up to 60 wt.% of at least one filler are also provided, as are articles, parts and composite materials comprising the polymer composition or composition. Use of the polymer composition or composition for the manufacture of 3D objects is also contemplated. The polymer compositions comprise at least one poly(arylene sulfide) polymer and at most 5 wt.% of at least one epoxy-functionalized aromatic macromer (EFAM). The epoxy-functionalized aromatic macromer has a number average molecular weight of at most 5000 g/mol. The elongation at break of the inventive polymer compositions is increased, and the elastic modulus and/or tensile strength of the inventive polymer compositions are substantially maintained, relative to the these same properties of an analogous polymer composition not comprising the epoxy-functionalized aromatic macromer.

    POLYAMIDE COMPOSITION AND ARTICLE MADE THEREFROM WITH IMPROVED MOLD SHRINKAGE
    3.
    发明申请
    POLYAMIDE COMPOSITION AND ARTICLE MADE THEREFROM WITH IMPROVED MOLD SHRINKAGE 审中-公开

    公开(公告)号：WO2022180195A1

    公开(公告)日：2022-09-01

    申请号：PCT/EP2022/054747

    申请日：2022-02-25

    申请人： SOLVAY SPECIALTY POLYMERS USA, LLC

    发明人： ANDERSON, Lindsey ,  GOPALAKRISHNAN, Vijay ,  CARVELL, Lee

    IPC分类号： H01Q1/36 ,  C08L77/06 ,  C08G69/26

    摘要： Described herein is a polyamide composition comprising two polyamides and glass fiber, wherein one of the polyamides is a polyphthalamide formed by polycondensation from various monomers: dicarboxylic acid(s) with diamine(s) and/or amino acid(s), wherein at least one monomer contains a cyclohexyl group. It was surprisingly discovered that the polyamide composition has improved warpage and/or mold shrinkage properties, excellent mechanical performance and high Tg and/or Tm. Due to the excellent performance, the polyamide composition is suitable for molding and can be desirably incorporated into mobile electronic device applications.

    HIGH MELT TEMPERATURE SOLUBLE SEMI-CRYSTALLINE POLYAMIDES
    7.
    发明申请
    HIGH MELT TEMPERATURE SOLUBLE SEMI-CRYSTALLINE POLYAMIDES 审中-公开

    公开(公告)号：WO2022002590A1

    公开(公告)日：2022-01-06

    申请号：PCT/EP2021/066209

    申请日：2021-06-16

    申请人： SOLVAY SPECIALTY POLYMERS USA, LLC

    发明人： GERSCHICK, Tanner ,  SINGLETARY, Nancy, J.

    IPC分类号： C08G69/26 ,  B33Y70/00

    摘要： The present invention relates to (co)polyamides comprising at least 85 mole % (mol.%) of recurring units (RPA) of formula (I): (I); the present invention also relates to polymer compositions comprising such (co)polyamides, as well as articles comprising the same and methods of using said articles in high temperature applications requiring sufficient swelling or deformation upon exposure to moisture, such as for example oil and gas extraction processes (e.g. fracturing balls), or as support materials used to print three-dimensional (3D) parts.

    ELECTRICAL AND ELECTRONIC ARTICLES INCLUDING POLYAMIDE COMPOSITIONS
    8.
    发明申请
    ELECTRICAL AND ELECTRONIC ARTICLES INCLUDING POLYAMIDE COMPOSITIONS 审中-公开

    公开(公告)号：WO2021224456A1

    公开(公告)日：2021-11-11

    申请号：PCT/EP2021/062137

    申请日：2021-05-07

    申请人： SOLVAY SPECIALTY POLYMERS USA, LLC

    发明人： PLAVCAN, Clay ,  MCILROY, David ,  JEOL, Stéphane ,  CARVELL, Lee

    IPC分类号： C08G69/26 ,  C08K7/14

    摘要： Described herein are electrical articles comprising a polyamide (PA). As explained in detail below, the polyamide (PA) is a semi-aromatic polyamide derived from the polycondensation of an aliphatic diamine, terephthalic acid, and a bis(aminoalkyl)cyclohexane or a cyclohexanedicarboxylic acid. It was surprisingly discovered that incorporation of the cycloaliphatic diamine bis(aminoalkyl)cyclohexane or the cycloaliphatic dicarboxylic acid cyclohexanedicarboxylic acid into the polyamide provided for polymer compositions (PC) having significantly improved comparative tracking index ("CTI") retention after heat aging, relative to analogous polyamides derived from only the aliphatic diamine and terephthalic acid. Due at least in part to the improved CTI retention, the polyamides (PA) can be desirably incorporated into articles that, during use, are exposed to elevated temperatures and benefit from high CTI performance.