FILAMENT, ADDITIVE MANUFACTURING METHODS USING THE FILAMENT AND ARTICLES MANUFACTURED THEREBY

    公开(公告)号:WO2023057393A1

    公开(公告)日:2023-04-13

    申请号:PCT/EP2022/077474

    申请日:2022-10-03

    摘要: An additive manufacturing filament is provided, as are 3D manufacturing methods using the filament, and articles and composite materials made therefrom. The filament comprises a polymer composition, and the polymer composition comprises, in turn, at least 50 wt.% of a polyamide. The polyamide comprises recurring units R(PA1) from 30 mol% to 75 mol% recurring units R(PA1) according to formula (V'): and ● from 25 mol% to 70 mol% of at least one of recurring units R(PA2), R(PA3) and R(PA4), according to formulae (VI), (VII) and (VIII), respectively: ● wherein o R1 and R2 are independently selected C1 to C3 alkyls; o Ri, at each location, is selected from the group consisting of an alkyl, an aryl, an alkali or alkaline earth metal sulfonate, an alkyl sulfonate, and a quaternary ammonium; o i is an integer from 0 to 10; o R3 is a C7-C16 alkyl, preferably a C7-C12 alkyl; o R4 is a C6 to C20 alkyl or a C6 to C20 aryl, preferably a C6 to C16 alkyl or a C6 to C16 aryl, more preferably a C6 to C12 alkyl or a C6 to C12 aryl; and o mol% is relative to the total moles of recurring units in the polyamide. The filament has a cylindrical geometry and a diameter between 0.5 mm and 5 mm.

    THERMALLY RESISTANT POLYAMIDE
    2.
    发明申请

    公开(公告)号:WO2023012061A1

    公开(公告)日:2023-02-09

    申请号:PCT/EP2022/071360

    申请日:2022-07-29

    摘要: Described herein are polyamides (PA) formed from a reaction mixture (RM) including a diamine component (DA) and a dicarboxylic acid component (DC). The diamine component (DA) includes at least 99 mol% of 1,3-bis(aminomethyl)cyclohexane ("1,3-BAC") and the dicarboxyic acid component (DC) includes at least 90 mol% of terephthalic acid ("TA"). It was surprisingly found that the polyamides (PA) had and increased glass transition temperature ("Tg"), while maintaining high melting temperatures ("Tm") and high crystallinity. More particularly, in some embodiments, the polyamides (PA) have a Tg of at least 165 °C, a Tm of at least 280 °C and a heat of fusion ("ΔHf") of at least 20 J/g. Due at least in part to the relative high Tg, Tm and crystallinity (measured by ΔHf), the polyamides (PA) can be advantageously used in high heat application settings, while maintaining desirable mechanical, electrical properties and chemical resistance

    GLYCOLIC ACID POLYMER
    3.
    发明申请

    公开(公告)号:WO2021122386A1

    公开(公告)日:2021-06-24

    申请号:PCT/EP2020/085813

    申请日:2020-12-11

    IPC分类号: C08G63/06 C08G63/60 C08L67/04

    摘要: The invention pertains to an improved branched glycolic acid polymer being obtained from polycondensation reaction of a monomer mixture comprising: (i) glycolic acid (GA); (ii) optionally, at least one hydroxyacid having only one hydroxyl group and only one carboxylic acid group different from GA [hydroxyacid (A)], wherein the molar amount of hydroxyacid (A) is of at most 5 % moles with respect to the sum of moles of GA and hydroxyacid (A); (iii) at least one polyol comprising at least three hydroxyl groups and being free from carboxylic acid group [polyol (H)]; (iv) at least one alcohol comprising one or two hydroxyl groups and being free from carboxylic acid group [alcohol (AO)]; (v) optionally at least one carboxylic acid comprising one carboxylic acid group and being free from hydroxyl group [monoacid (C)]; and (vi) optionally at least one polyacid comprising at least two carboxylic acid groups and being free from hydroxyl groups [polyacid (O)], wherein the amount of polyacid (O) is such that the number of carboxylic acid groups thereof is comprised between 0.025 and 0.900 % with respect to the overall number of hydroxyl groups of glycolid acid and of the hydroxyacid (A), if present.

    COMPATIBILIZED POLYMER COMPOSITIONS
    8.
    发明申请
    COMPATIBILIZED POLYMER COMPOSITIONS 审中-公开
    增容聚合物组合物

    公开(公告)号:WO2017186926A1

    公开(公告)日:2017-11-02

    申请号:PCT/EP2017/060223

    申请日:2017-04-28

    摘要: A polymer composition includes at least two different polymers independently selected from a poly(aryl ether ketone) (PAEK), a poly(aryl ether sulfone) (PAES), a polyarylene sulfide (PAS) and a polyetherimide (PEI), and about 0.05 to about 2 wt.% of at least one alkali metal carbonate. Preferably, the polymer composition is free or substantially free of solvent. A method includes melt mixing at least two different polymers independently selected from a poly(aryl ether ketone) (PAEK), a poly(aryl ether sulfone) (PAES), a polyarylene sulfide (PAS) and a polyetherimide (PEI), and about 0.05to about 2wt.% of at least one alkali metal carbonate to form a compatibilized polymer composition

    摘要翻译: 聚合物组合物包括独立地选自聚(芳基醚酮)(PAEK),聚(芳基醚砜)(PAES),聚亚芳基硫醚(PAS)和 聚醚酰亚胺(PEI)和约0.05至约2重量%的至少一种碱金属碳酸盐。 优选地,聚合物组合物不含或基本不含溶剂。 一种方法包括将独立选自聚芳醚酮(PAEK),聚芳醚砜(PAES),聚芳硫醚(PAS)和聚醚酰亚胺(PEI)的至少两种不同聚合物熔融混合, 0.05至约2重量%的至少一种碱金属碳酸盐以形成相容的聚合物组合物

    ELECTRICAL AND ELECTRONIC ARTICLES INCLUDING POLYAMIDE COMPOSITIONS

    公开(公告)号:WO2021224456A1

    公开(公告)日:2021-11-11

    申请号:PCT/EP2021/062137

    申请日:2021-05-07

    IPC分类号: C08G69/26 C08K7/14

    摘要: Described herein are electrical articles comprising a polyamide (PA). As explained in detail below, the polyamide (PA) is a semi-aromatic polyamide derived from the polycondensation of an aliphatic diamine, terephthalic acid, and a bis(aminoalkyl)cyclohexane or a cyclohexanedicarboxylic acid. It was surprisingly discovered that incorporation of the cycloaliphatic diamine bis(aminoalkyl)cyclohexane or the cycloaliphatic dicarboxylic acid cyclohexanedicarboxylic acid into the polyamide provided for polymer compositions (PC) having significantly improved comparative tracking index ("CTI") retention after heat aging, relative to analogous polyamides derived from only the aliphatic diamine and terephthalic acid. Due at least in part to the improved CTI retention, the polyamides (PA) can be desirably incorporated into articles that, during use, are exposed to elevated temperatures and benefit from high CTI performance.