公开(公告)号：WO2009096897A1

公开(公告)日：2009-08-06

申请号：PCT/SG2008/000035

申请日：2008-01-31

Applicant: ADVANCED SYSTEMS AUTOMATION LIMITED ,  LIM, Kian, Hock ,  NG, Lian, Seng ,  SUN, HaiYuan ,  ALMONTE, Elmer, Decena

Inventor： LIM, Kian, Hock ,  NG, Lian, Seng ,  SUN, HaiYuan ,  ALMONTE, Elmer, Decena

IPC: B65D69/00 ,  H01L25/00 ,  H01L21/67 ,  H01L27/00

CPC classification number: H01L21/67333

Abstract: Manufacturing of semiconductor devices is fully automated for cost savings to be achieved in terms of capital and material costs. Semiconductor devices separated from the lead- frames or substrates are typically washed and dried before being transferred to a plate. The semiconductor devices are then subsequently transferred from the plate to a holding tray. However, the large contact surface between the semiconductor devices and the plate results in the semiconductor devices adhering to the surface of the plate when transferring the semiconductor devices to the holding tray. Furthermore, misalignment also tends to occur when the devices are transferred from the plate to the holding tray due to gravitational displacement of the semiconductor devices occurring during the transfer. An embodiment of the invention describes an apparatus and a method for transferring semiconductor devices into component pockets of holding trays.

Abstract translation: 半导体器件的制造完全自动化，可以在资本和材料成本方面实现成本节约。 通常将与引线框架或基板分离的半导体器件在转移到板之前进行洗涤和干燥。 随后半导体器件随后从板转移到保持盘。 然而，当将半导体器件转移到保持托盘时，半导体器件和板之间的大的接触表面导致半导体器件粘附到板的表面。 此外，由于在传送期间发生的半导体器件的重力位移，当器件从板转移到保持托盘时，倾向于发生未对准。 本发明的实施例描述了一种用于将半导体器件转移到保持托盘的组件袋中的装置和方法。