INLAID TYPE FLOOR SHEET HAVING POLYVINYL CHLORIDE CHIP AND THE METHOD OF MANUFACTURING THEREOF
    1.
    发明申请
    INLAID TYPE FLOOR SHEET HAVING POLYVINYL CHLORIDE CHIP AND THE METHOD OF MANUFACTURING THEREOF 审中-公开
    具有聚氯乙烯切片的浸渍型地板及其制造方法

    公开(公告)号:WO2013036022A2

    公开(公告)日:2013-03-14

    申请号:PCT/KR2012/007092

    申请日:2012-09-05

    Abstract: Disclosed is an inlaid type floor sheet having polyvinyl chloride chip and a method of manufacturing thereof. The inlaid type floor sheet having polyvinyl chloride (PVC) chip, includes an inlaid chip layer in which polyvinyl chloride is formed into chips; a UV paint layer which is coated on the inlaid chip layer; and a dimensionally reinforcing layer which is formed of a fabric and pressed on a lower surface of the inlaid chip layer at high temperature. According to the present invention, since the plain-weave type dimensionally reinforcing layer is provided at the lower side of the inlaid type floor sheet having polyvinyl chloride chip, it is possible to improve the durability, realize the dimensional stability and balance of the product and increase the adhesive force with the construction floor.

    Abstract translation: 公开了一种具有聚氯乙烯芯片的嵌入式地板及其制造方法。 具有聚氯乙烯(PVC)芯片的嵌入式地板包括其中聚氯乙烯形成芯片的镶嵌芯片层; 涂覆在镶嵌芯片层上的UV漆层; 以及由织物形成并在高温下被压在镶嵌芯片层的下表面上的尺寸增强层。 根据本发明,由于平面织造型尺寸增强层设置在具有聚氯乙烯片的镶嵌式地板的下侧,所以可以提高耐久性,实现产品的尺寸稳定性和平衡性 增加施工地板的粘合力。

    FLOORING HAVING TRANSFER-PRINTED HDF AND PROCESS FOR MANUFACTURING THE SAME
    2.
    发明申请
    FLOORING HAVING TRANSFER-PRINTED HDF AND PROCESS FOR MANUFACTURING THE SAME 审中-公开
    具有转印HDF的地板及其制造方法

    公开(公告)号:WO2007123298A1

    公开(公告)日:2007-11-01

    申请号:PCT/KR2006/004273

    申请日:2006-10-20

    CPC classification number: B32B21/00 Y10T428/24802 Y10T428/24851

    Abstract: Disclosed herein is a low-priced flooring comprising a transfer-printed high-density fiberboard (HDF). According to the flooring, an aqueous primer layer is formed on a high-density fiberboard as a core layer and transfer printing is performed on the surface of the primer layer to form a printed layer so that the background fiber pattern of the high-density fiberboard is covered, the adhesion of the core layer to the printed layer is enhanced, and the natural beauty of wood is faithfully imparted to the surface of the flooring.

    Abstract translation: 本文公开了包括转印印刷的高密度纤维板(HDF)的低价地板。 根据地板,在作为芯层的高密度纤维板上形成水性底漆层,在底漆层的表面进行转印,形成印刷层,使高密度纤维板的背景纤维图案 被覆盖,芯层与印刷层的粘附性增强,木材的自然美丽被忠实地赋予了地板表面。

    INLAID TYPE FLOOR SHEET HAVING POLYVINYL CHLORIDE CHIP AND THE METHOD OF MANUFACTURING THEREOF
    4.
    发明申请
    INLAID TYPE FLOOR SHEET HAVING POLYVINYL CHLORIDE CHIP AND THE METHOD OF MANUFACTURING THEREOF 审中-公开
    具有聚氯乙烯片的镶嵌式地板及其制造方法

    公开(公告)号:WO2013036022A3

    公开(公告)日:2013-05-02

    申请号:PCT/KR2012007092

    申请日:2012-09-05

    Abstract: Disclosed is an inlaid type floor sheet having polyvinyl chloride chip and a method of manufacturing thereof. The inlaid type floor sheet having polyvinyl chloride (PVC) chip, includes an inlaid chip layer in which polyvinyl chloride is formed into chips; a UV paint layer which is coated on the inlaid chip layer; and a dimensionally reinforcing layer which is formed of a fabric and pressed on a lower surface of the inlaid chip layer at high temperature. According to the present invention, since the plain-weave type dimensionally reinforcing layer is provided at the lower side of the inlaid type floor sheet having polyvinyl chloride chip, it is possible to improve the durability, realize the dimensional stability and balance of the product and increase the adhesive force with the construction floor.

    Abstract translation: 公开了一种具有聚氯乙烯片的镶嵌式地板片及其制造方法。 具有聚氯乙烯(PVC)芯片的镶嵌式地板包括其中将聚氯乙烯形成为芯片的镶嵌芯片层; 涂覆在镶嵌芯片层上的UV涂料层; 以及尺寸加强层,其由织物形成并在高温下压在镶嵌芯片层的下表面上。 根据本发明,由于在具有聚氯乙烯切屑的镶嵌式地板片的下侧设置平纹式尺寸加强层,因此可以提高耐久性,实现产品的尺寸稳定性和平衡性, 增加与建筑地板的粘合力。

    CONDUCTIVE FLOORING MATERIAL AND A PRODUCTION METHOD THEREFOR
    5.
    发明申请
    CONDUCTIVE FLOORING MATERIAL AND A PRODUCTION METHOD THEREFOR 审中-公开
    导电地板材料及其生产方法

    公开(公告)号:WO2011037338A3

    公开(公告)日:2011-07-14

    申请号:PCT/KR2010006057

    申请日:2010-09-07

    Abstract: The present invention relates to a conductive flooring material containing a conductive deformation-preventing layer containing conductive fibers comprising glass fiber and carbon fiber, and to a production method therefor. The present invention can provide a conductive material which is useful not only in the form of tiles but also in the form of long sheets because the conductive fibers comprising glass fiber and carbon fiber impart not only outstanding electrical conductivity but also stable deformation-preventing properties.

    Abstract translation: 本发明涉及含有包含玻璃纤维和碳纤维的导电纤维的导电变形防止层的导电性地板材料及其制造方法。 本发明可以提供一种导电材料,其不仅可用于瓦片的形式,而且可用于长片材的形式,因为包含玻璃纤维和碳纤维的导电纤维不仅赋予优异的导电性,而且还具有稳定的变形防止性能。

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