APPARATUS AND METHODS FOR SPECTRUM BASED MONITORING OF CHEMICAL MECHANICAL POLISHING
    1.
    发明申请
    APPARATUS AND METHODS FOR SPECTRUM BASED MONITORING OF CHEMICAL MECHANICAL POLISHING 审中-公开
    用于基于频谱监测化学机械抛光的装置和方法

    公开(公告)号:WO2007024807A2

    公开(公告)日:2007-03-01

    申请号:PCT/US2006032659

    申请日:2006-08-21

    CPC classification number: B24B37/042 B24B37/205 B24B49/12

    Abstract: Apparatus and methods for spectrum based monitoring of chemical mechanical polishing, including spectrum based endpointing, spectrum based polishing rate adjustment, flushing a top surface of an optical head, or a pad with a window. The spectrum-based endpointing uses a reference spectrum which is empirically selected for particular spectrum based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum based endpoint logic. The polishing endpoint can be determined using a difference trace or a sequence of index values. The flushing system creates a laminar gas flow across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow if gas is laminar. The window includes a soft plastic portion and a crystalline or glass like portion. The spectrum based polishing rate adjustment includes obtaining spectra for different zones on a substrate.

    Abstract translation: 用于基于频谱的化学机械抛光监测的装置和方法,包括基于光谱的终点,基于光谱的抛光速率调节,冲洗光学头的顶表面或具有窗口的垫。 基于频谱的终点使用参考频谱,该参考频谱是针对特定的基于频谱的端点确定逻辑进行经验选择的,以便通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 可以使用差异迹线或索引值序列来确定抛光终点。 冲洗系统在光学头的顶表面上产生层流气流。 真空喷嘴和真空源被配置为使得气体是层流的流动。 窗口包括软塑料部分和结晶或玻璃状部分。 基于光谱的抛光速率调节包括获得基底上不同区域的光谱。

    APPARATUS AND METHODS FOR SPECTRUM BASED MONITORING OF CHEMICAL MECHANICAL POLISHING
    2.
    发明申请
    APPARATUS AND METHODS FOR SPECTRUM BASED MONITORING OF CHEMICAL MECHANICAL POLISHING 审中-公开
    用于基于频谱监测化学机械抛光的装置和方法

    公开(公告)号:WO2007024807A3

    公开(公告)日:2007-07-12

    申请号:PCT/US2006032659

    申请日:2006-08-21

    CPC classification number: B24B37/042 B24B37/205 B24B49/12

    Abstract: Apparatus and methods for spectrum based monitoring of chemical mechanical polishing, including spectrum based endpointing, spectrum based polishing rate adjustment, flushing a top surface of an optical head (53), or a pad (30) with a window. The spectrum-based endpointing uses a reference spectrum which is empirically selected for particular spectrum based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectrum based endpoint logic. The polishing endpoint can be determined using a difference trace or a sequence of index values. The flushing system creates a laminar gas flow across the top surface of the optical head (53) . The vacuum nozzle (308) and vacuum sources (312) are configured so that the flow of gas is laminar. The window includes a soft plastic portion and a crystalline or glass like portion. The spectrum based polishing rate adjustment includes obtaining spectra for different zones on a substrate.

    Abstract translation: 用于基于频谱的化学机械抛光监测的装置和方法,包括基于光谱的终点,基于光谱的抛光速率调整,冲洗光学头(53)的顶表面或具有窗口的垫(30)。 基于频谱的终点使用参考频谱,该参考频谱是针对特定的基于频谱的端点确定逻辑进行经验选择的,以便通过应用特定的基于频谱的端点逻辑来调用端点时实现目标厚度。 可以使用差异迹线或索引值序列来确定抛光终点。 冲洗系统在光学头(53)的顶表面上产生层流气流。 真空喷嘴(308)和真空源(312)构造成使得气体流是层流的。 窗口包括软塑料部分和结晶或玻璃状部分。 基于光谱的抛光速率调节包括获得基底上不同区域的光谱。

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